Abstract: An apparatus is described. The apparatus includes an add-in card having multiple semiconductor chip packages mounted to a printed circuit board of the add-in card. The add-in card includes separate dedicated heat sinks respectively coupled to the semiconductor chip packages with spring loaded fixturing elements, a heat pipe coupled to a plurality of the heat sinks.

Abstract: An apparatus is described. The apparatus includes a semiconductor chip package having a semiconductor chip therein. The semiconductor chip package to communicate a temperature of the semiconductor chip. The apparatus includes a heat sink that is thermally coupled to the semiconductor chip package. The heat sink has fins. The apparatus includes a fan. The apparatus includes a temperature sensing device. The temperature sensing device is to sense a temperature of an ambient before the ambient is warmed by the fins. A rotational speed of the fan is to be determined from the temperature of the semiconductor chip and the temperature of the ambient.