Abstract: The embodiments herein relate to defect inspection methods of semiconductor wafers during the manufacturing process. According to an aspect of the present disclosure, a defect inspection system is provided. The defect inspection system includes a first inspection system, pattern simulator software, and a second inspection system. The first inspection system is capable of determining a plurality of defect locations on an article. The pattern simulator software is capable of generating a set of simulated pattern features from the plurality of defect locations. The second inspection system is capable of providing a higher graphical resolution of defects than the first inspection at the defect locations corresponding to the set of simulated pattern features.