Patents by Inventor Tameyasu Anayama

Tameyasu Anayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • In-situ packaging decapsulation feature for electrical fault localization
    Patent number: 10049949
    Abstract: An IR camera is used to image an IC to identify hot spots. The objective of the IR camera is removed and laser optics are inserted into the optical axis of the system. A laser is then used to ablate the encapsulation in a defined area around the optical axis. The IR camera operates in a lock-in mode to obtain phase information of the IR signal from the IC. The phase information is used to obtain a depth estimate of the defect. Predetermined etch rates are then used in conjunction with the depth estimate to generate a timed end-point for the laser ablation.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: August 14, 2018
    Assignee: FEI Company
    Inventors: Tameyasu Anayama, John Muzzio, Herve Deslandes
  • IN-SITU PACKAGING DECAPSULATION FEATURE FOR ELECTRICAL FAULT LOCALIZATION
    Publication number: 20170117233
    Abstract: An IR camera is used to image an IC to identify hot spots. The objective of the IR camera is removed and laser optics are inserted into the optical axis of the system. A laser is then used to ablate the encapsulation in a defined area around the optical axis. The IR camera operates in a lock-in mode to obtain phase information of the IR signal from the IC. The phase information is used to obtain a depth estimate of the defect. Predetermined etch rates are then used in conjunction with the depth estimate to generate a timed end-point for the laser ablation.
    Type: Application
    Filed: October 21, 2016
    Publication date: April 27, 2017
    Inventors: Tameyasu Anayama, John Muzzio, Herve Deslandes