Patents by Inventor Tamil Selvamuniandy

Tamil Selvamuniandy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Grid array connection device and method
    Patent number: 9698114
    Abstract: A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: July 4, 2017
    Assignee: INTEL CORPORATION
    Inventors: Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Charan K. Gurumurthy, Selvy Tamil Selvamuniandy
  • Alignment inspection
    Patent number: 8399264
    Abstract: The present disclosure relates to the field of microelectronic substrate fabrication and, more particularly, to alignment inspection for vias formed in the microelectronic substrates. The alignment inspection may be achieved by determining the relative positions of fluorescing and non-fluorescing elements in a microelectronic substrate.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: March 19, 2013
    Assignee: Intel Corporation
    Inventors: Zhihua Zou, Liang Zhang, Sheng Li, Tamil Selvamuniandy
  • GRID ARRAY CONNECTION DEVICE AND METHOD
    Publication number: 20110169167
    Abstract: A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
    Type: Application
    Filed: March 25, 2011
    Publication date: July 14, 2011
    Inventors: Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Charan K. Gurumurthy, Selvy Tamil Selvamuniandy
  • Grid array connection device and method
    Patent number: 7915060
    Abstract: A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: March 29, 2011
    Assignee: Intel Corporation
    Inventors: Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Charan K. Gurumurthy, Selvy Tamil Selvamuniandy
  • GRID ARRAY CONNECTION DEVICE AND METHOD
    Publication number: 20100148365
    Abstract: A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
    Type: Application
    Filed: February 26, 2010
    Publication date: June 17, 2010
    Inventors: Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Charan K. Gurumurthy, Selvy Tamil Selvamuniandy
  • Grid array connection device and method
    Patent number: 7670951
    Abstract: A method and device for input/output connections is provided. Devices and methods for connection structure are shown with improved mechanical properties such as hardness and abrasion resistance. Land grid array structures are provided that are less expensive to manufacture due to reductions in material cost such as gold. Ball grid array structures are provided with improved resistance to corrosion during fabrication. Ball grid array structures are also provided with improved mechanical properties resulting in improved shock testing results.
    Type: Grant
    Filed: June 27, 2005
    Date of Patent: March 2, 2010
    Assignee: Intel Corporation
    Inventors: Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Charan K. Gurumurthy, Selvy Tamil Selvamuniandy