Patents by Inventor Tamilselvan Krishnamoorthy

Tamilselvan Krishnamoorthy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230223307
    Abstract: A semiconductor device has a differential height substrate including a first section and a second section thinner than the first section. The first section may include contact fingers for electrically coupling the semiconductor device to a connector in a slot of a host device. The second section may include one or more semiconductor dies and other components. Mold compound may encapsulate the semiconductor dies and other components, leaving the contact fingers in the first section of the substrate exposed. A second layer of mold compound may also be applied to a second, uniformly planar surface of the differential height substrate opposite a surface including the one or more semiconductor dies.
    Type: Application
    Filed: January 10, 2022
    Publication date: July 13, 2023
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Nandha Kumar Mohanraj, Jegathese Dhanachandra Prakash, Tamilselvan Krishnamoorthy