Abstract: Resin compositions for the inner coat of semiconductors which include(A) 100 parts by weight of a polysiloxane having vinyl groups and having a viscosity of 100 to 800cP at 25.degree. C., said polysiloxane having a general formula ##STR1## in which V represents a vinyl group, Me represents a methyl group, Ph represents a phenyl group, R represents a methyl group or a phenyl group and both k and l represent natural numbers which are variables within the range of 0.01.ltoreq.l/(k+l).ltoreq.0.2,(B) 1 to 35 parts by weight of a polysiloxane haivng a viscosity of 2 to 500cP at 25.degree. C., said polysiloxane having a general formula ##STR2## in which Me represents a methyl group, and both m and n represent natural numbers which are variables within the range of 0.05.ltoreq.n/(M+n).ltoreq.0.3,(C) 0.

Abstract: A polysiloxane compound modified with two hydroxyl groups at the one end thereof and particularly suitable for improving the surface characteristics of resins prepared by polycondensation of a polyol with another polyfunctional compound, and a silicone-modified polyurethane having superior characteristics such as low frictional properties, water repellency, oil repellency, thrombosis resistance, etc. and also a process for producing the polyurethane are provided, which polysiloxane compound expressed by the formula ##STR1## wherein R represents H, Me (methyl) or Et (ethyl) and n represents an integer of 0 to 4,000, and which silicone-modified polyurethane is obtained from a compound having at least two isocyanate groups and a compound having at least two hydroxyl groups, and by using as a part of the compound having at least two hydroxyl groups, the polysiloxane compound of the above formula (I) in the urethane bond-forming reaction.