Abstract: The present disclosure provides antibodies and antigen-binding fragments thereof that bind specifically to a coronavirus spike protein and methods of using such antibodies and fragments for treating or preventing viral infections (e.g., coronavirus infections).

Abstract: The present disclosure provides antibodies and antigen-binding fragments thereof that bind specifically to a coronavirus spike protein and methods of using such antibodies and fragments for treating or preventing viral infections (e.g., coronavirus infections).

Abstract: The present disclosure provides antibodies and antigen-binding fragments thereof that bind specifically to a coronavirus spike protein and methods of using such antibodies and fragments for treating or preventing viral infections (e.g., coronavirus infections).

Abstract: The present disclosure provides novel immunoglobulin proteins that bind to a human natriuretic peptide receptor 1 (NPR1) agonist, preferably an anti-NPR1 antibody. In certain embodiments, the proteins of the disclosure comprise at least one immunoglobulin variable domain that binds to an anti-NPR1 antibody. In certain embodiments, the proteins of the disclosure are useful in blocking and/or reversing the effect of an administered anti-NPR1 antibody. In certain embodiments, the antigen-binding proteins are useful for effective management of blood pressure and hemodynamics in humans.

Abstract: The present disclosure provides antibodies and antigen-binding fragments thereof that bind specifically to a coronavirus spike protein and methods of using such antibodies and fragments for treating or preventing viral infections (e.g., coronavirus infections).

Abstract: The present disclosure provides antibodies and antigen-binding fragments thereof that bind specifically to a coronavirus spike protein and methods of using such antibodies and fragments for treating or preventing viral infections (e.g., coronavirus infections).

Abstract: The present disclosure provides antibodies and antigen-binding fragments thereof that bind specifically to a coronavirus spike protein and methods of using such antibodies and fragments for treating or preventing viral infections (e.g., coronavirus infections).

Abstract: A human antibody or an antigen-binding fragment which binds human IL-6 receptor (hIL-6R) with a KD of about 500 pM or less and blocks IL-6 activity with an IC50 of 200 pM or less. In preferred embodiments, the antibody the antibody or antigen-binding fragment binds hIL-6R with an affinity at least 2-fold higher relative to its binding monkey IL-6R.

Abstract: An isolated antibody or antibody fragment that binds human interleukin-18 receptor alpha (hIL-18R?), comprising a light chain variable region (LCVR) selected from the group consisting of SEQ ID NO: 5, 9, 13, 17, 21, 25, 29, 33, 37, 41, 45, 49, 53, 61, 65, 69, 73, 77, and 81 and/or a heavy chain variable region (HCVR) selected from the group consisting of SEQ ID NO: 3, 7, 11, 15, 19, 23, 27, 31, 35, 39, 43, 47, 51, 55, 59, 63, 67, 71, 75, and 79, or a fragment or sequence modified by an amino acid substitution, deletion or addition thereof.

Abstract: Provided is a technique for designing an integrated circuit die which includes a semiconductor layer, a primary metal layer, a horizontal metal layer and a vertical metal layer. Electronic components are laid out on the semiconductor layer, and a primary power distribution network for distributing power to the electronic components is laid out on the primary metal layer. Then, a uniform trunk width is calculated for all trunks in a power mesh based on a desired maximum voltage drop for the generated electronic component layout. Finally, horizontal power trunks are laid out on the horizontal metal layer and vertical power trunks are laid out on the vertical metal layer using the calculated uniform trunk width, so as to form the power mesh, and an electrical connection is specified between the power mesh and the primary power distribution network.

Abstract: An integrated circuit (IC) die includes a semiconductor layer, electronic components formed on the semiconductor layer, and a primary metal layer upon which is formed a primary power distribution network for distributing power to the electronic components. The IC die also includes a horizontal metal layer, a vertical metal layer, and a power mesh electrically connected to the primary power distribution network, the power mesh including horizontal power trunks formed on the horizontal metal layer and vertical power trunks formed on the vertical metal layer. Also provided is an integrated circuit (IC) die which includes a semiconductor layer, electronic components formed on the semiconductor layer. A fine power distribution network, formed on a first metal layer, distributes power to the electronic components.

Abstract: A method for optimizing routing mesh segment widths within limits imposed by voltage drop and metal migration requirements, beginning with an initial mesh comprising a plurality of horizontal segments forming rows and a plurality of vertical segments forming columns. First, a voltage drop and current density associated with each segment is determined. Then a first width for each segment is found by scaling each segment width using a voltage drop scaling factor so that the routing mesh has a maximum voltage drop that satisfies the voltage drop requirement. Next, widths for each segment are determined such that the metal migration requirement minus a margin is satisfied. Then the method ensures that each segment within each row, and each segment within each column, is not more than a first scaling factor wider than its neighboring segments.

Abstract: A system for modeling and estimating crosstalk noise and detecting false logic is provided. The noise is caused by culprit signal nets that are in a switching state and affect a victim net which is in a non-switching (DC) steady state. This estimated noise is evaluated against a predetermined threshold to determine whether any false logic results in the victim net.