Patents by Inventor Tamotsu Ishikawa

Tamotsu Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140117836
    Abstract: A high-pressure discharge lamp having an electrode including an electrode rod, a melted part and a coil part, and satisfying 0 < La L < 0.3 , where La denotes an average value of a length in units of mm of an exposed portion of the coil part in an axial direction of the electrode rod, the exposed portion being not covered with the melted part, and L denotes a maximum value of a length in units of mm between a tip of a head of the electrode rod and an opposite edge of the coil part to the melted part, measured in the axial direction.
    Type: Application
    Filed: March 22, 2013
    Publication date: May 1, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Hiroki OGAWA, Yoshiki KITAHARA, Kazunori OHTA, Tamotsu ISHIKAWA, Jun SAKAGUCHI
  • Patent number: 8704436
    Abstract: A high-pressure discharge lamp having an electrode including an electrode rod, a melted part and a coil part, and satisfying 0 < La L < 0.3 , where La denotes an average value of a length in units of mm of an exposed portion of the coil part in an axial direction of the electrode rod, the exposed portion being not covered with the melted part, and L denotes a maximum value of a length in units of mm between a tip of a head of the electrode rod and an opposite edge of the coil part to the melted part, measured in the axial direction.
    Type: Grant
    Filed: March 22, 2013
    Date of Patent: April 22, 2014
    Assignee: Panasonic Corporation
    Inventors: Hiroki Ogawa, Yoshiki Kitahara, Kazunori Ohta, Tamotsu Ishikawa, Jun Sakaguchi
  • Publication number: 20100012435
    Abstract: A belt-conveyor sushi counter has an opening (8) under a conveyor lane (4) where conveyors (5, 6) circulate for bringing sushi S on plates T to customers. At least dishes such as the used plates T placed on a counter table (3) can be collected from the opposite side of the conveyor lane (4) through the opening (8). This configuration eliminates the need for employees who enter a customer seat floor to collect the dishes such as the plates, resulting in reduction of labor costs, reduction of the area required for the customer seat floor, reduction of the fatigue of employees, and improvement of sanitation and services.
    Type: Application
    Filed: June 10, 2008
    Publication date: January 21, 2010
    Inventor: Tamotsu Ishikawa
  • Patent number: 5241829
    Abstract: A method of operating a heat pump having at least one circuit for circulation of a refrigerant comprising a compressor, a once-through path, complete counterflow type condenser as a high-temperature heat output means, an expansion valve and a low-temperature heat output means (evaporator or a segregated low-stage circuit for circulation of a lower-boiling-point refrigerant), which comprises choosing a supercool degree, which is equal to the difference between a saturation temperature and an outlet temperature of the refrigerant, to satisfy the conditions that a temperature effectiveness of refrigerant liquid as defined by the formula: ##EQU1## is at least 40% and the temperature difference of the denominator is at least 35.degree. C. As a result, boiling water of ca. 100.degree. C. or other high-temperature fluids can be discharged with a large temperature difference.
    Type: Grant
    Filed: March 12, 1992
    Date of Patent: September 7, 1993
    Assignees: Osaka Prefecture Government, Nishiyodo Air Conditioner Co., Ltd.
    Inventors: Toshimasa Irie, Tohru Isoda, Shuhei Miyauchi, Taizo Imoto, Yukio Fujishima, Yasuhiro Hatano, Masami Ogata, Yukitoshi Hatano, Tamotsu Ishikawa, Masayuki Kawabata
  • Patent number: 4567646
    Abstract: A method for fabricating a wafer for a dielectric isolation (DI) integrated circuit device is provided, wherein the substrate of the wafer, comprises portions of polycrystalline silicon positioned beneath regions for electrical elements, namely, "islands", and portions of single crystal silicon are positioned in other areas of the wafer such as scribing regions, peripheral regions and contact regions. The single crystal portions of the substrate are grown during its fabricating steps by exposing surfaces of an original substrate of single crystal silicon, before the deposition of silicon onto the original substrate, by removing a dielectric isolation layer over the predetermined regions to be exposed. The single crystal silicon portions of the wafer provide various advantages for subsequent mechanical processing of the wafer such as shaping and rounding of the peripheral region and the scribing of the wafer into dice.
    Type: Grant
    Filed: November 30, 1984
    Date of Patent: February 4, 1986
    Assignee: Fujitsu Limited
    Inventors: Tamotsu Ishikawa, Hirokazu Tanaka, Akira Tabata