Patents by Inventor Tamotsu ODAJIMA

Tamotsu ODAJIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LASER IRRADIATION APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
    Publication number: 20230411159
    Abstract: A laser irradiation apparatus according to an embodiment includes an optical module which irradiates an object with laser light so as to form a linear irradiation region along a first direction and a beam damper which absorbs reflected light having been reflected by the object. The beam damper includes a member and a member fixed to the member. The member includes an eaves portion having an opening portion through which the reflected light passes. The eaves portion has a reflection surface which reflects, toward an internal space enclosed by the member and the member, reflected light having been reflected by the object.
    Type: Application
    Filed: November 5, 2021
    Publication date: December 21, 2023
    Applicant: JSW Aktina System Co., Ltd.
    Inventors: Hiroya TANAKA, Suk-hwan CHUNG, Tamotsu ODAJIMA, Daisuke ITO
  • Laser irradiation apparatus and method for manufacturing semiconductor device
    Patent number: 11676818
    Abstract: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: June 13, 2023
    Assignee: JSW AKTINA SYSTEM CO., LTD
    Inventors: Daisuke Ito, Tamotsu Odajima, Ryo Shimizu, Masashi Machida, Tatsuro Matsushima
  • Laser irradiation apparatus and method for manufacturing semiconductor device
    Patent number: 10943785
    Abstract: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: March 9, 2021
    Assignee: THE JAPAN STEEL WORKS, LTD.
    Inventors: Daisuke Ito, Tamotsu Odajima, Ryo Shimizu, Masashi Machida, Tatsuro Matsushima
  • LASER IRRADIATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20210066082
    Abstract: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).
    Type: Application
    Filed: October 22, 2020
    Publication date: March 4, 2021
    Inventors: Daisuke ITO, Tamotsu ODAJIMA, Ryo SHIMIZU, Masashi MACHIDA, Tatsuro MATSUSHIMA
  • LASER IRRADIATION APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20190198322
    Abstract: A laser irradiation apparatus (1) according to an embodiment includes an optical-system module (20) configured to apply laser light (L1) to an object to be irradiated, a shield plate (51) in which a slit (54) is formed, through which the laser light (L1) passes, and a reflected-light receiving component (61) disposed between the optical-system module (20) and the shield plate (51), in which the reflected-light receiving component (61) is able to receive, out of the laser light (L1), reflected light (R1) reflected by the shield plate (51).
    Type: Application
    Filed: July 14, 2017
    Publication date: June 27, 2019
    Inventors: Daisuke ITO, Tamotsu ODAJIMA, Ryo SHIMIZU, Masashi MACHIDA, Tatsuro MATSUSHIMA