Patents by Inventor Tamotsu SAKURAI

Tamotsu SAKURAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230368941
    Abstract: A cable is provided with a cable core including one or more electric wires, a shield layer provided to cover around the cable core and composed of a laterally wound shield formed by winding metal wire strands helically, and a sheath provided to cover around the shield layer. The metal wire strands are semi-hard copper alloy wires, and P/PD, which is the ratio of the winding pitch P in the laterally wound shield to the pitch diameter PD of the shield layer, is less than 9.9.
    Type: Application
    Filed: March 29, 2023
    Publication date: November 16, 2023
    Inventors: Tamotsu SAKURAI, Hiromitsu Kuroda, Yoshiki Nakade, Minoru Takatsuto, Atsuro Yaguchi
  • Patent number: 11715584
    Abstract: A coaxial cable is composed of a conductor, an insulator around the conductor, a shield layer around the insulator, and a sheath around the shield layer. The shield layer includes a lateral winding shielding portion with metal wires helically wrapped around the insulator, and a batch plating portion covering the lateral winding shielding portion. The shield layer includes a joining portion where adjacent metal wires are joined with each other with the batch plating portion at a gap between the adjacent metal wires, and inner peripheral portions where the metal wires are not being covered with the batch plating portion and plating layers are exposed. The joining portion is provided between adjacent inner peripheral portions. When an elemental analysis is performed in any analysis region having an area of 0.015 mm2 or more and 0.
    Type: Grant
    Filed: August 24, 2021
    Date of Patent: August 1, 2023
    Assignee: PROTERIAL, LTD.
    Inventors: Hiromitsu Kuroda, Tamotsu Sakurai, Keisuke Fujito, Yoshiki Nakade, Detian Huang, Hideki Nonen
  • Patent number: 11631507
    Abstract: A coaxial cable includes a conductor, an electrically insulating member provided over a periphery of the conductor, a shielding layer composed of served shields formed by helically wrapping a plurality of metal wires around the electrically insulating member, and a sheath provided around the shielding layer. The electrically insulating member includes indentations on portions of its surface to be brought into contact with and mated to the metal wires respectively. The shielding layer includes portions in respective circumferential directions of the plurality of metal wires being brought into contact with the electrically insulating member are mated to the indentations, respectively, on the electrically insulating member, and adjacent ones of the metal wires in a circumferential direction of the shielding layer are in surface contact with each other.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: April 18, 2023
    Assignee: PROTERIAL, LTD.
    Inventors: Detian Huang, Takanobu Watanabe, Hideki Nonen, Masashi Arai, Hiromitsu Kuroda, Ryohei Okada, Tamotsu Sakurai
  • Publication number: 20230008828
    Abstract: A signal transmission cable includes a conductor, an insulator covering a periphery of the conductor, and a shield layer covering a periphery of the insulator. The shield layer includes a lateral winding shield portion composed of a plurality of metal wires being helically wrapped around the periphery of the insulator to cover the periphery of the insulator, and a batch plating portion composed of a hot dip plating, which is covering a periphery of the lateral winding shield portion. Where a diameter of the metal wire is d and a thickness of the batch plating portion from an outer surface of the metal wire is t, a formula t<0.5d is met over an entire cable circumference. When the signal transmission cable is bent in a U-shape within a range of a bending strain of 35% or less, no cracks occur in the batch plating portion.
    Type: Application
    Filed: June 10, 2022
    Publication date: January 12, 2023
    Inventors: Hiromitsu KURODA, Tamotsu SAKURAI, Yoshiki NAKADE, Detian HUANG, Xinweilong LI
  • Publication number: 20220344071
    Abstract: A cable in which decrease in a shield performance of a shield layer due to bending or twisting is difficult to occur is provided. A cable includes: a cable core including one or more electrical wires; a shield layer made of a metallic wire arranged on a periphery of the cable core; and a sheath arranged on a periphery of the shield layer, the metallic wire is made of a copper alloy wire made of a copper alloy containing indium, a content of which is equal to or more than 0.3 mass % and equal to or less than 0.65 mass %, and the metallic wire has tensile strength that is equal to or higher than 350 MPa and elongation that is equal to or higher than 7%.
    Type: Application
    Filed: February 18, 2022
    Publication date: October 27, 2022
    Inventors: Tamotsu Sakurai, Masanori Kobayashi, Setsuo Kobayashi, Hiromitsu Kuroda
  • Patent number: 11437692
    Abstract: A coaxial cable is composed of a conductor, an electrical insulating member covering a periphery of the conductor, a shield layer covering a periphery of the electrical insulating member, and a sheath covering a periphery of the shield layer. The shield layer is configured to include a lateral winding shielding portion with a plurality of metal wires being helically wrapped around the periphery of the electrical insulating member, and a batch plating portion made of a hot-dip plating covering respective peripheries of the lateral winding shielding portion. The shield layer includes an outer peripheral portion, in which the metal wires are covered with the batch plating portion, and an inner peripheral portion, in which the metal wires are not covered with the batch plating portion. The outer peripheral portion of the shield layer includes intermetallic compounds between the metal wires and the batch plating portion.
    Type: Grant
    Filed: April 21, 2021
    Date of Patent: September 6, 2022
    Assignee: HITACHI METALS, LTD.
    Inventors: Detian Huang, Takanobu Watanabe, Hideki Nonen, Masashi Arai, Hiromitsu Kuroda, Ryohei Okada, Tamotsu Sakurai
  • Patent number: 11404181
    Abstract: A copper alloy wire is made of a copper alloy, and the copper alloy contains indium, a content of which is equal to or more than 0.3 mass % and equal to or less than 0.45 mass %. A tensile strength of the copper alloy wire is equal to or higher than 800 MPa, and an electrical conductivity of the same is equal to or higher than 80% IACS.
    Type: Grant
    Filed: February 1, 2021
    Date of Patent: August 2, 2022
    Assignee: Hitachi Metals, Ltd.
    Inventors: Hiromitsu Kuroda, Takashi Hayasaka, Detian Huang, Ryohei Okada, Tamotsu Sakurai
  • Publication number: 20220223313
    Abstract: A copper alloy wire is composed of a copper alloy including indium. of 0.3 mass % or more and 0.65 mass % or less, and has 0.2% proof stress of 300 MPa or more, electrical conductivity of 80% IACS or more, and elongation of 7% or more.
    Type: Application
    Filed: December 28, 2021
    Publication date: July 14, 2022
    Inventors: Hiromitsu Kuroda, Takashi HAYASAKA, Detian HUANG, Ryohei OKADA, Tamotsu SAKURAI
  • Publication number: 20220084723
    Abstract: A coaxial cable is composed of a conductor, an insulator around the conductor, a shield layer around the insulator, and a sheath around the shield layer. The shield layer includes a lateral winding shielding portion with metal wires helically wrapped around the insulator, and a batch plating portion covering the lateral winding shielding portion. The shield layer includes a joining portion where adjacent metal wires are joined with each other with the batch plating portion at a gap between the adjacent metal wires, and inner peripheral portions where the metal wires are not being covered with the batch plating portion and plating layers are exposed. The joining portion is provided between adjacent inner peripheral portions. When an elemental analysis is performed in any analysis region having an area of 0.015 mm2 or more and 0.
    Type: Application
    Filed: August 24, 2021
    Publication date: March 17, 2022
    Inventors: Hiromitsu KURODA, Tamotsu SAKURAI, Keisuke FUJITO, Yoshiki NAKADE, Detian HUANG, Hideki NONEN
  • Publication number: 20210399396
    Abstract: A coaxial cable is composed of a conductor, an electrical insulating member covering a periphery of the conductor, a shield layer covering a periphery of the electrical insulating member, and a sheath covering a periphery of the shield layer. The shield layer is configured to include a lateral winding shielding portion with a plurality of metal wires being helically wrapped around the periphery of the electrical insulating member, and a batch plating portion made of a hot-dip plating covering respective peripheries of the lateral winding shielding portion. The shield layer includes an outer peripheral portion, in which the metal wires are covered with the batch plating portion, and an inner peripheral portion, in which the metal wires are not covered with the batch plating portion. The outer peripheral portion of the shield layer includes intermetallic compounds between the metal wires and the batch plating portion.
    Type: Application
    Filed: April 21, 2021
    Publication date: December 23, 2021
    Inventors: Detian HUANG, Takanobu WATANABE, Hideki NONEN, Masashi ARAI, Hiromitsu KURODA, Ryohei OKADA, Tamotsu SAKURAI
  • Publication number: 20210398713
    Abstract: A coaxial cable includes a conductor, an electrically insulating member provided over a periphery of the conductor, a shielding layer composed of served shields formed by helically wrapping a plurality of metal wires around the electrically insulating member, and a sheath provided around the shielding layer. The electrically insulating member includes indentations on portions of its surface to be brought into contact with and mated to the metal wires respectively. The shielding layer includes portions in respective circumferential directions of the plurality of metal wires being brought into contact with the electrically insulating member are mated to the indentations, respectively, on the electrically insulating member, and adjacent ones of the metal wires in a circumferential direction of the shielding layer are in surface contact with each other.
    Type: Application
    Filed: December 9, 2020
    Publication date: December 23, 2021
    Inventors: Detian HUANG, Takanobu WATANABE, Hideki NONEN, Masashi ARAI, Hiromitsu KURODA, Ryohei OKADA, Tamotsu SAKURAI
  • Publication number: 20210249149
    Abstract: Improvement of a strength of a copper alloy wire and improvement of an electrical conductivity of the same are both achieved. A copper alloy wire is made of a copper alloy, and the copper alloy contains indium, a content of which is equal to or more than 0.3 mass % and equal to or less than 0.45 mass %. A tensile strength of the copper alloy wire is equal to or higher than 800 MPa, and an electrical conductivity of the same is equal to or higher than 80% IACS.
    Type: Application
    Filed: February 1, 2021
    Publication date: August 12, 2021
    Inventors: Hiromitsu Kuroda, Takashi Hayasaka, Detian Huang, Ryohei Okada, Tamotsu Sakurai
  • Patent number: 10720258
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: July 21, 2020
    Assignee: HITACHI METALS, LTD.
    Inventors: Seigi Aoyama, Toru Sumi, Takashi Hayasaka, Ryohei Okada, Detian Huang, Tamotsu Sakurai, Satoshi Yajima, Minoru Takatsuto, Hiroshi Bando
  • Publication number: 20200168355
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Application
    Filed: January 29, 2020
    Publication date: May 28, 2020
    Inventors: Seigi AOYAMA, Toru SUMI, Takashi HAYASAKA, Ryohei OKADA, Detian HUANG, Tamotsu SAKURAI, Satoshi YAJIMA, Minoru TAKATSUTO, Hiroshi BANDO
  • Publication number: 20180197652
    Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.
    Type: Application
    Filed: October 3, 2017
    Publication date: July 12, 2018
    Inventors: Seigi AOYAMA, Toru SUMI, Takashi HAYASAKA, Ryohei OKADA, Detian HUANG, Tamotsu SAKURAI, Satoshi YAJIMA, Minoru TAKATSUTO, Hiroshi BANDO