Patents by Inventor Tamotsu SAKURAI
Tamotsu SAKURAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230368941Abstract: A cable is provided with a cable core including one or more electric wires, a shield layer provided to cover around the cable core and composed of a laterally wound shield formed by winding metal wire strands helically, and a sheath provided to cover around the shield layer. The metal wire strands are semi-hard copper alloy wires, and P/PD, which is the ratio of the winding pitch P in the laterally wound shield to the pitch diameter PD of the shield layer, is less than 9.9.Type: ApplicationFiled: March 29, 2023Publication date: November 16, 2023Inventors: Tamotsu SAKURAI, Hiromitsu Kuroda, Yoshiki Nakade, Minoru Takatsuto, Atsuro Yaguchi
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Patent number: 11715584Abstract: A coaxial cable is composed of a conductor, an insulator around the conductor, a shield layer around the insulator, and a sheath around the shield layer. The shield layer includes a lateral winding shielding portion with metal wires helically wrapped around the insulator, and a batch plating portion covering the lateral winding shielding portion. The shield layer includes a joining portion where adjacent metal wires are joined with each other with the batch plating portion at a gap between the adjacent metal wires, and inner peripheral portions where the metal wires are not being covered with the batch plating portion and plating layers are exposed. The joining portion is provided between adjacent inner peripheral portions. When an elemental analysis is performed in any analysis region having an area of 0.015 mm2 or more and 0.Type: GrantFiled: August 24, 2021Date of Patent: August 1, 2023Assignee: PROTERIAL, LTD.Inventors: Hiromitsu Kuroda, Tamotsu Sakurai, Keisuke Fujito, Yoshiki Nakade, Detian Huang, Hideki Nonen
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Patent number: 11631507Abstract: A coaxial cable includes a conductor, an electrically insulating member provided over a periphery of the conductor, a shielding layer composed of served shields formed by helically wrapping a plurality of metal wires around the electrically insulating member, and a sheath provided around the shielding layer. The electrically insulating member includes indentations on portions of its surface to be brought into contact with and mated to the metal wires respectively. The shielding layer includes portions in respective circumferential directions of the plurality of metal wires being brought into contact with the electrically insulating member are mated to the indentations, respectively, on the electrically insulating member, and adjacent ones of the metal wires in a circumferential direction of the shielding layer are in surface contact with each other.Type: GrantFiled: December 9, 2020Date of Patent: April 18, 2023Assignee: PROTERIAL, LTD.Inventors: Detian Huang, Takanobu Watanabe, Hideki Nonen, Masashi Arai, Hiromitsu Kuroda, Ryohei Okada, Tamotsu Sakurai
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Publication number: 20230008828Abstract: A signal transmission cable includes a conductor, an insulator covering a periphery of the conductor, and a shield layer covering a periphery of the insulator. The shield layer includes a lateral winding shield portion composed of a plurality of metal wires being helically wrapped around the periphery of the insulator to cover the periphery of the insulator, and a batch plating portion composed of a hot dip plating, which is covering a periphery of the lateral winding shield portion. Where a diameter of the metal wire is d and a thickness of the batch plating portion from an outer surface of the metal wire is t, a formula t<0.5d is met over an entire cable circumference. When the signal transmission cable is bent in a U-shape within a range of a bending strain of 35% or less, no cracks occur in the batch plating portion.Type: ApplicationFiled: June 10, 2022Publication date: January 12, 2023Inventors: Hiromitsu KURODA, Tamotsu SAKURAI, Yoshiki NAKADE, Detian HUANG, Xinweilong LI
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Publication number: 20220344071Abstract: A cable in which decrease in a shield performance of a shield layer due to bending or twisting is difficult to occur is provided. A cable includes: a cable core including one or more electrical wires; a shield layer made of a metallic wire arranged on a periphery of the cable core; and a sheath arranged on a periphery of the shield layer, the metallic wire is made of a copper alloy wire made of a copper alloy containing indium, a content of which is equal to or more than 0.3 mass % and equal to or less than 0.65 mass %, and the metallic wire has tensile strength that is equal to or higher than 350 MPa and elongation that is equal to or higher than 7%.Type: ApplicationFiled: February 18, 2022Publication date: October 27, 2022Inventors: Tamotsu Sakurai, Masanori Kobayashi, Setsuo Kobayashi, Hiromitsu Kuroda
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Patent number: 11437692Abstract: A coaxial cable is composed of a conductor, an electrical insulating member covering a periphery of the conductor, a shield layer covering a periphery of the electrical insulating member, and a sheath covering a periphery of the shield layer. The shield layer is configured to include a lateral winding shielding portion with a plurality of metal wires being helically wrapped around the periphery of the electrical insulating member, and a batch plating portion made of a hot-dip plating covering respective peripheries of the lateral winding shielding portion. The shield layer includes an outer peripheral portion, in which the metal wires are covered with the batch plating portion, and an inner peripheral portion, in which the metal wires are not covered with the batch plating portion. The outer peripheral portion of the shield layer includes intermetallic compounds between the metal wires and the batch plating portion.Type: GrantFiled: April 21, 2021Date of Patent: September 6, 2022Assignee: HITACHI METALS, LTD.Inventors: Detian Huang, Takanobu Watanabe, Hideki Nonen, Masashi Arai, Hiromitsu Kuroda, Ryohei Okada, Tamotsu Sakurai
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Patent number: 11404181Abstract: A copper alloy wire is made of a copper alloy, and the copper alloy contains indium, a content of which is equal to or more than 0.3 mass % and equal to or less than 0.45 mass %. A tensile strength of the copper alloy wire is equal to or higher than 800 MPa, and an electrical conductivity of the same is equal to or higher than 80% IACS.Type: GrantFiled: February 1, 2021Date of Patent: August 2, 2022Assignee: Hitachi Metals, Ltd.Inventors: Hiromitsu Kuroda, Takashi Hayasaka, Detian Huang, Ryohei Okada, Tamotsu Sakurai
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Publication number: 20220223313Abstract: A copper alloy wire is composed of a copper alloy including indium. of 0.3 mass % or more and 0.65 mass % or less, and has 0.2% proof stress of 300 MPa or more, electrical conductivity of 80% IACS or more, and elongation of 7% or more.Type: ApplicationFiled: December 28, 2021Publication date: July 14, 2022Inventors: Hiromitsu Kuroda, Takashi HAYASAKA, Detian HUANG, Ryohei OKADA, Tamotsu SAKURAI
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Publication number: 20220084723Abstract: A coaxial cable is composed of a conductor, an insulator around the conductor, a shield layer around the insulator, and a sheath around the shield layer. The shield layer includes a lateral winding shielding portion with metal wires helically wrapped around the insulator, and a batch plating portion covering the lateral winding shielding portion. The shield layer includes a joining portion where adjacent metal wires are joined with each other with the batch plating portion at a gap between the adjacent metal wires, and inner peripheral portions where the metal wires are not being covered with the batch plating portion and plating layers are exposed. The joining portion is provided between adjacent inner peripheral portions. When an elemental analysis is performed in any analysis region having an area of 0.015 mm2 or more and 0.Type: ApplicationFiled: August 24, 2021Publication date: March 17, 2022Inventors: Hiromitsu KURODA, Tamotsu SAKURAI, Keisuke FUJITO, Yoshiki NAKADE, Detian HUANG, Hideki NONEN
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Publication number: 20210399396Abstract: A coaxial cable is composed of a conductor, an electrical insulating member covering a periphery of the conductor, a shield layer covering a periphery of the electrical insulating member, and a sheath covering a periphery of the shield layer. The shield layer is configured to include a lateral winding shielding portion with a plurality of metal wires being helically wrapped around the periphery of the electrical insulating member, and a batch plating portion made of a hot-dip plating covering respective peripheries of the lateral winding shielding portion. The shield layer includes an outer peripheral portion, in which the metal wires are covered with the batch plating portion, and an inner peripheral portion, in which the metal wires are not covered with the batch plating portion. The outer peripheral portion of the shield layer includes intermetallic compounds between the metal wires and the batch plating portion.Type: ApplicationFiled: April 21, 2021Publication date: December 23, 2021Inventors: Detian HUANG, Takanobu WATANABE, Hideki NONEN, Masashi ARAI, Hiromitsu KURODA, Ryohei OKADA, Tamotsu SAKURAI
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Publication number: 20210398713Abstract: A coaxial cable includes a conductor, an electrically insulating member provided over a periphery of the conductor, a shielding layer composed of served shields formed by helically wrapping a plurality of metal wires around the electrically insulating member, and a sheath provided around the shielding layer. The electrically insulating member includes indentations on portions of its surface to be brought into contact with and mated to the metal wires respectively. The shielding layer includes portions in respective circumferential directions of the plurality of metal wires being brought into contact with the electrically insulating member are mated to the indentations, respectively, on the electrically insulating member, and adjacent ones of the metal wires in a circumferential direction of the shielding layer are in surface contact with each other.Type: ApplicationFiled: December 9, 2020Publication date: December 23, 2021Inventors: Detian HUANG, Takanobu WATANABE, Hideki NONEN, Masashi ARAI, Hiromitsu KURODA, Ryohei OKADA, Tamotsu SAKURAI
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Publication number: 20210249149Abstract: Improvement of a strength of a copper alloy wire and improvement of an electrical conductivity of the same are both achieved. A copper alloy wire is made of a copper alloy, and the copper alloy contains indium, a content of which is equal to or more than 0.3 mass % and equal to or less than 0.45 mass %. A tensile strength of the copper alloy wire is equal to or higher than 800 MPa, and an electrical conductivity of the same is equal to or higher than 80% IACS.Type: ApplicationFiled: February 1, 2021Publication date: August 12, 2021Inventors: Hiromitsu Kuroda, Takashi Hayasaka, Detian Huang, Ryohei Okada, Tamotsu Sakurai
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Patent number: 10720258Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.Type: GrantFiled: October 3, 2017Date of Patent: July 21, 2020Assignee: HITACHI METALS, LTD.Inventors: Seigi Aoyama, Toru Sumi, Takashi Hayasaka, Ryohei Okada, Detian Huang, Tamotsu Sakurai, Satoshi Yajima, Minoru Takatsuto, Hiroshi Bando
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Publication number: 20200168355Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.Type: ApplicationFiled: January 29, 2020Publication date: May 28, 2020Inventors: Seigi AOYAMA, Toru SUMI, Takashi HAYASAKA, Ryohei OKADA, Detian HUANG, Tamotsu SAKURAI, Satoshi YAJIMA, Minoru TAKATSUTO, Hiroshi BANDO
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Publication number: 20180197652Abstract: A method for manufacturing a conductive wire includes conducting a continuous casting of a conductive alloy material at a casting rate of not less than 40 mm/min and not more than 200 mm/min to form a conductive wire with a primary diameter, the conductive alloy material containing not more than 1.0 mass % of an added metal element, reducing a diameter of the conductive wire with the primary diameter to form a conductive wire with a secondary diameter, heat treating the conductive wire with the secondary diameter so that tensile strength thereof is reduced to not less than 90% and less than 100% of tensile strength before the heat treating, and reducing a diameter of the conductive wire with the secondary diameter and the reduced tensile strength to generate a logarithmic strain of 7.8 to 12.0 therein to form a conductive wire with a tertiary diameter.Type: ApplicationFiled: October 3, 2017Publication date: July 12, 2018Inventors: Seigi AOYAMA, Toru SUMI, Takashi HAYASAKA, Ryohei OKADA, Detian HUANG, Tamotsu SAKURAI, Satoshi YAJIMA, Minoru TAKATSUTO, Hiroshi BANDO