Patents by Inventor Tamotsu Sasaki

Tamotsu Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240069469
    Abstract: An image forming apparatus includes a developer, a development device, and an image bearing member. The developer includes an initial developer containing an initial carrier and a replenishment developer containing a replenishment carrier. The initial carrier has a surface roughness Sa1 of at least 0.3 ?m and no greater than 1.0 ?m. A ratio Sa1/Sa2 of the surface roughness Sa1 of the initial carrier to a surface roughness Sa2 of the replenishment carrier is at least 1.2 and no greater than 3.4. The packing volume Vp calculated from equation (1)“Vp=100×Y/(Z×DS)” was at least 40% and no greater than 70%. In equation (1), Y represents an amount of the developer conveyed by a developer bearing member. Z represents an apparent density of the initial developer. DS represents a width of a space between the developer bearing member and the image bearing member.
    Type: Application
    Filed: August 25, 2023
    Publication date: February 29, 2024
    Applicant: KYOCERA Document Solutions Inc.
    Inventors: Masashi FUJISHIMA, Tamotsu SHIMIZU, Asami SASAKI, Eriko TAKEUCHI
  • Patent number: 11271147
    Abstract: A piezoelectric composition containing: a complex oxide having a perovskite structure represented by a general formula of ABO3; copper; and one or more elements selected from the group consisting of chromium, nickel and zinc, in which in ABO3, an A-site element is potassium and a B-site element is niobium, or niobium and tantalum, with respect to 1 mol of the complex oxide, a content ratio of the copper is ? mol % in terms of CuO, a content ratio of one or more elements selected from the group consisting of chromium, nickel and zinc is ? mol % in terms of CrO3/2, NiO, ZnO, ? satisfies a relationship of 0.2???2.5, and ? satisfies a relationship of 0.2???2.0.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: March 8, 2022
    Assignee: TDK CORPORATION
    Inventors: Masakazu Hirose, Yuiko Hirose, Hiroki Katoh, Tamotsu Sasaki, Yuji Umeda
  • Publication number: 20210091298
    Abstract: A piezoelectric composition containing: a complex oxide having a perovskite structure represented by a general formula of ABO3; copper; and one or more elements selected from the group consisting of chromium, nickel and zinc, in which in ABO3, an A-site element is potassium and a B-site element is niobium, or niobium and tantalum, with respect to 1 mol of the complex oxide, a content ratio of the copper is ? mol % in terms of CuO, a content ratio of one or more elements selected from the group consisting of chromium, nickel and zinc is ? mol % in terms of CrO3/2, NiO, ZnO, ? satisfies a relationship of 0.2???2.5, and ? satisfies a relationship of 0.2???2.0.
    Type: Application
    Filed: March 19, 2019
    Publication date: March 25, 2021
    Applicant: TDK CORPORATION
    Inventors: Masakazu HIROSE, Yuiko HIROSE, Hiroki KATOH, Tamotsu SASAKI, Yuji UMEDA
  • Patent number: 9286945
    Abstract: A disk information display device capable of displaying display data responding to the operation of operating part in a complete and in real time, the disk information display device includes: a disk information acquiring unit for acquiring information recorded on a disk; an operating part for making a request to display data recorded on the disk in response to an operation; a control part that acquires display data responding to a final display request among display requests made during a period, in which display data responding to a former display request is acquired from the disk information acquiring unit, from the disk information acquiring unit when display requests are made in succession by the operation of operating part; and a display that displays the display data acquired by the control part after the display data responding to the former display request is displayed.
    Type: Grant
    Filed: April 6, 2005
    Date of Patent: March 15, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tamotsu Sasaki, Takashi Senoo
  • Patent number: 9034118
    Abstract: A method for manufacturing a hot-rolled sheet attains grain refinement of the steel sheet whose grain size is extremely fine. In particular, a ferrite grain size of less than average 2 ?m is obtained, which is not laminar but has ferrite grains with equiaxed morphology and exhibits high formability in forming. The method comprises the steps of rolling and cooling, wherein the rolling reductions, cooling steps, and temperature are closely regulated. A hot rolled sheet made from the method of manufacturing has a controlled ferrite grain in different regions of sheet thickness.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: May 19, 2015
    Assignee: NIPPON STEEL & SUMITOMO METAL CORPORATION
    Inventors: Suguhiro Fukushima, Manabu Eto, Tamotsu Sasaki, Kaori Kawano, Masayuki Wakita
  • Publication number: 20140086787
    Abstract: A method for manufacturing a hot-rolled sheet attains grain refinement of the steel sheet whose grain size is extremely fine. In particular, a ferrite grain size of less than average 2 ?m is obtained, which is not laminar but has ferrite grains with equiaxed morphology and exhibits high formability in forming. The method comprises the steps of rolling and cooling, wherein the rolling reductions, cooling steps, and temperature are closely regulated. A hot rolled sheet made from the method of manufacturing has a controlled ferrite grain in different regions of sheet thickness.
    Type: Application
    Filed: March 11, 2013
    Publication date: March 27, 2014
    Inventors: Suguhiro Fukushima, Manabu Eto, Tamotsu Sasaki, Kaori Kawano, Masayuki Wakita
  • Patent number: 8404060
    Abstract: A method for manufacturing a hot-rolled sheet is provided, wherein the method attains grain refinement of the steel sheet containing C, Si, and Mn, wherein the grain size thereof is set to particularly below average of 2 ?m, which has ferrite grain with equiaxed morphology, which has high formability in forming, and the ferrite grain-size deviation in the thickness direction is uniformed down to the level not higher than a predetermined amount whereby uniform formability in forming is high. The method includes a first rolling for rolling the sheet such that the total rolling reduction is 80% or more or the average grain size is 30 ?m or less in a form of single phase of austenite, a second rolling of a single-pass, a third rolling being conducted thereafter, and a following cooling.
    Type: Grant
    Filed: February 2, 2007
    Date of Patent: March 26, 2013
    Assignee: Nippon Steel & Sumitomo Metal Corporation
    Inventors: Suguhiro Fukushima, Manabu Eto, Tamotsu Sasaki, Kaori Kawano, Masayuki Wakita
  • Patent number: 8205349
    Abstract: Provided is an alignment apparatus including holding and rotating means for holding an alignment object and rotating the alignment object, the alignment apparatus including supporting means for supporting that part of the alignment object being rotated which is different from that part of the alignment object which is held by the holding and rotating means. This makes it possible to align the alignment object highly accurately by preventing the alignment object from being deformed, e.g. bent, due to its own weight.
    Type: Grant
    Filed: June 18, 2010
    Date of Patent: June 26, 2012
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akihiko Nakamura, Junichi Katsuragawa, Satoshi Kobari, Tamotsu Sasaki
  • Publication number: 20100319209
    Abstract: Provided is an alignment apparatus including holding and rotating means for holding an alignment object and rotating the alignment object, the alignment apparatus including supporting means for supporting that part of the alignment object being rotated which is different from that part of the alignment object which is held by the holding and rotating means. This makes it possible to align the alignment object highly accurately by preventing the alignment object from being deformed, e.g. bent, due to its own weight.
    Type: Application
    Filed: June 18, 2010
    Publication date: December 23, 2010
    Inventors: Akihiko NAKAMURA, Junichi Katsuragawa, Satoshi Kobari, Tamotsu Sasaki
  • Publication number: 20100089505
    Abstract: The present invention provides a method for manufacturing the hot-rolled sheet, which includes: a step A including a first rolling in which a steel sheet containing 0.04-0.20% C, 0.01-2.0% Si, 0.5-3.0% Mn by mass, and the reminder being Fe and inevitable impurities, is rolled by successive multi-pass rolling at a total rolling reduction of 80% or more while keeping the steel sheet at temperatures not lower than the para-equilibrium transformation temperature Ae3; a step B including a second rolling in which a single-pass rolling is carried out at a rolling reduction of 30-55% when an entry side temperature is not lower than the para-equilibrium transformation temperature Ae3; a step C including a third rolling in which a single-pass rolling is carried out at a rolling reduction of 35-70% when an entry side temperature is set within a predetermined range; and a step D in which within 0.2 seconds after the third rolling, the rolled sheet is cooled at a cooling rate of 600 degree C.
    Type: Application
    Filed: February 2, 2007
    Publication date: April 15, 2010
    Inventors: Suguhiro Fukushima, Manabu Eto, Tamotsu Sasaki, Kaori Kawano, Masayuki Wakita
  • Patent number: 7166184
    Abstract: A multi-stage type processing apparatus which can be positioned in a limited space without having a complicated driving mechanism, includes processing units which are stacked in a multi-stage state in the vertical direction. Each processing unit has a cup surrounding a substrate and a chuck for retaining and rotating a substrate, and the cup can be elevated and lowered with respect to the chuck. A cylinder unit is contracted and thereby all the cups are unitarily lowered, so that the top surface of the chuck is located in a slightly upper position with respect to the top surface of the cup. In this state, a substrate is mounted on the chuck and attracted. Next, the cylinder unit is extended and thereby all the cups are unitarily elevated so as to accommodate the substrate therein.
    Type: Grant
    Filed: February 16, 2004
    Date of Patent: January 23, 2007
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akihiko Nakamura, Taiichiro Aoki, Seiji Ohishi, Tamotsu Sasaki
  • Publication number: 20050265160
    Abstract: A disk information display device capable of displaying display data responding to the operation of operating part in a complete and in real time, the disk information display device includes: a disk information acquiring unit for acquiring information recorded on a disk; an operating part for making a request to display display data recorded on the disk in response to an operation; a control part that acquires display data responding to a final display request among display requests made during a period, in which display data responding to a former display request is acquired from the disk information acquiring unit, from the disk information acquiring unit when display requests are made in succession by the operation of operating part; and a display that displays the display data acquired by the control part after the display data responding to the former display request is displayed.
    Type: Application
    Filed: April 6, 2005
    Publication date: December 1, 2005
    Inventors: Tamotsu Sasaki, Takashi Senoo
  • Publication number: 20040179173
    Abstract: The object of the present invention is to provide a multi-stage type processing apparatus which can be positioned in a limited space without having a complicated driving mechanism. The processing apparatus is comprised of processing units which are stacked in a multi-stage state in the vertical direction. Each processing unit has a cup surrounding a substrate and a chuck for retaining and rotating a substrate, and the cup can be elevated and lowered with respect to the chuck. A cylinder unit is contracted and thereby all the cups are unitarily lowered, so that the top surface of the chuck is located in a slightly upper position with respect to the top surface of the cup. In this state, a substrate is mounted on the chuck and attracted. Next, the cylinder unit is extended and thereby all the cups are unitarily elevated so as to accommodate the substrate therein.
    Type: Application
    Filed: February 16, 2004
    Publication date: September 16, 2004
    Applicant: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akihiko Nakamura, Taiichiro Aoki, Seiji Ohishi, Tamotsu Sasaki
  • Patent number: 4558266
    Abstract: A workpiece transfer bar is reciprocated by a rack driven by a pinion which is driven by a servomotor through an eccentric arm. A computer is used to set rates of acceleration and deceleration, a maximum speed, etc. in accordance with the origin of the transfer bar, stroke thereof etc.
    Type: Grant
    Filed: March 15, 1984
    Date of Patent: December 10, 1985
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventors: Tamotsu Sasaki, Yutaka Tsuchiya
  • Patent number: 4468195
    Abstract: The semiconductor device manufacturing process for producing semiconductors (transistor, IC, LSI or the like) needs a large number of thermal treatments for semiconductor wafers, such as thermal oxidation, diffusion, CVD, annealing or the like. The above-mentioned various thermal treatments are conducted by employing thermal treatment apparatus. The thermal treatment apparatus according to the present invention performs thermal treatments for semiconductor wafers, such as thermal oxidation, diffusion, CVD, annealing or the like, and has a soft landing loader capable of loading and unloading a wafer jig housing therein a plurality of semiconductor wafers into and from a process tube of the thermal treatment apparatus with high reliability and a high thermal efficiency as well as capable of automatic control of the movement of the semiconductor wafers in accordance with thermal treatment conditions.
    Type: Grant
    Filed: September 15, 1982
    Date of Patent: August 28, 1984
    Assignee: Hitachi, Ltd.
    Inventors: Tamotsu Sasaki, Tetsuya Takagaki, Kenichi Ikeda