Patents by Inventor Tamotsu Tanaka

Tamotsu Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982965
    Abstract: An image forming apparatus includes a developing member, a first detection processing portion, and an acquisition processing portion. The developing member conveys developer to a facing portion between the developing member and the image-carrying member. The first detection processing portion detects a first development current for each of a plurality of specific voltages with different DC voltage values applied to the developing member, the first development current flowing, in response to application of the specific voltages, through the facing portion including the developer and a specific exposed area, formed by the light emitting portion, on the image-carrying member. The acquisition processing portion acquires a potential value of the specific exposed area based on the DC voltage values of the specific voltages and current values of the first development current, detected by the first detection processing portion, corresponding to the respective specific voltages.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: May 14, 2024
    Assignee: KYOCERA Document Solutions Inc.
    Inventors: Kazunori Tanaka, Yoshihiro Yamagishi, Tamotsu Shimizu, Kazuhiro Nakachi, Ryota Okui
  • Publication number: 20240146144
    Abstract: A motor housing may include a cast body. The cast body may include a cylindrical portion. At least one machined surface may be disposed on at least one of (i) an inner peripheral surface of the cylindrical portion and (ii) an outer peripheral surface of the cylindrical portion. A back side of the at least one machined surface may be an exposed non-machined surface.
    Type: Application
    Filed: October 27, 2023
    Publication date: May 2, 2024
    Inventors: Akihiko Eguchi, Shota Nogiwa, Yuki Suzuki, Tamotsu Tanaka, Ryosuke Tonooka
  • Publication number: 20240146142
    Abstract: [Problem to be Solved] High positional accuracy of connection terminals should be achieved in a bus bar unit for a motor. [Solution] A method for manufacturing a busbar unit (10) according to the present invention includes a step of molding a power connection terminal member (14) integrally with a resin plate (12) by insert molding, and a step of attaching the busbar to the power connection terminal member (14) so as to connect electrically each other. The power connection terminal member (14) has a power connection terminal (14a) for connecting to the motor control board, and an attachment portion (14b) for attaching to a bus bar electrically connected to the coils of the stator. The power connection terminal (14a) and the attachment portion (14b) protrude from the resin plate (12) individually. The attachment portion (14b) of the power connection terminal member (14) is welded to the attachment portion of the busbar.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: Akihiko Eguchi, Shota Nogiwa, Yuki Suzuki, Tamotsu Tanaka
  • Publication number: 20240088742
    Abstract: A cover member for a motor unit is disclosed. The cover member is interposed between a motor and a control substrate for controlling operation of the motor. The motor has a bus bar terminal electrically connected to a coil of a stator of the motor. The control substrate has a connection terminal that is fitted to the bus bar terminal and is made to electrically connect the control substrate to the stator. The cover member has a through hole, through which the bus bar terminal pierces, and an enclosing part for enclosing a fitting location for the bus bar terminal and the connection terminal, as seen in a piercing direction of the bus bar terminal.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 14, 2024
    Inventors: Akihiko Eguchi, Shota Nogiwa, Yuki Suzuki, Tamotsu Tanaka, Ryosuke Tonooka
  • Patent number: 6876895
    Abstract: An order assembly production system comprises means for showing an order-entry screen to select a frame of a product to be manufactured and an essential unit, means for generating a main body model number based on items selected on the order-entry screen, means for creating a manufacturing parts list for each main body model number based on a product components list showing a list of units as the selectable essential units of each model and the items selected on the order-entry screen, and means for settling delivery time based on a production schedule formed every model and the manufacturing parts list of each main body model number and instructing to start production.
    Type: Grant
    Filed: July 2, 2002
    Date of Patent: April 5, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hiromi Seimiya, Yukio Kunieda, Tamotsu Tanaka
  • Patent number: 6841487
    Abstract: A semiconductor manufacturing method is mainly contemplated, improved to prevent an altered surface layer of a resist from being removed when a single patterned resist is used to provide dry-etch and wet-etch successively. On a semiconductor substrate an insulation film and a conductive layer are formed successively. On the conductive layer a patterned resist is formed. With the patterned resist used as a mask, the conductive layer is dry-etched. A surface layer of the patterned resist is partially removed. With the patterned resist used as a mask, the insulation film is wet-etched.
    Type: Grant
    Filed: September 6, 2002
    Date of Patent: January 11, 2005
    Assignees: Renesas Technology Corp., Ryoden Semiconductor System Engineering Corporation
    Inventors: Kojiro Yuzuriha, Shu Shimizu, Tamotsu Tanaka, Takashi Yano
  • Publication number: 20030008459
    Abstract: A semiconductor manufacturing method is mainly contemplated, improved to prevent an altered surface layer of a resist from being removed when a single patterned resist is used to provide dry-etch and wet-etch successively. On a semiconductor substrate an insulation film and a conductive layer are formed successively. On the conductive layer a patterned resist is formed. With the patterned resist used as a mask, the conductive layer is dry-etched. A surface layer of the patterned resist is partially removed. With the patterned resist used as a mask, the insulation film is wet-etched.
    Type: Application
    Filed: September 6, 2002
    Publication date: January 9, 2003
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Kojiro Yuzuriha, Shu Shimizu, Tamotsu Tanaka, Takashi Yano
  • Publication number: 20030004595
    Abstract: An order assembly production system comprises means for showing an order-entry screen to select a frame of a product to be manufactured and an essential unit, means for generating a main body model number based on items selected on the order-entry screen, means for creating a manufacturing parts list for each main body model number based on a product components list showing a list of units as the selectable essential units of each model and the items selected on the order-entry screen, and means for settling delivery time based on a production schedule formed every model and the manufacturing parts list of each main body model number and instructing to start production.
    Type: Application
    Filed: July 2, 2002
    Publication date: January 2, 2003
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hiromi Seimiya, Yukio Kunieda, Tamotsu Tanaka
  • Patent number: 6458655
    Abstract: A semiconductor manufacturing method is mainly contemplated, improved to prevent an altered surface layer of a resist from being removed when a single patterned resist is used to provide dry-etch and wet-etch successively. On a semiconductor substrate an insulation film and a conductive layer are formed successively. On the conductive layer a patterned resist is formed. With the patterned resist used as a mask, the conductive layer is dry-etched. A surface layer of the patterned resist is partially removed. With the patterned resist used as a mask, the insulation film is wet-etched.
    Type: Grant
    Filed: June 7, 2000
    Date of Patent: October 1, 2002
    Assignees: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering
    Inventors: Kojiro Yuzuriha, Shu Shimizu, Tamotsu Tanaka, Takashi Yano
  • Patent number: 5315220
    Abstract: The door can be safely and exactly opened and shut even when the door opening and shutting stroke value is not memorized in the non-volatile memory. The door opening and shutting stroke value measured in the setting time of the automatic door is memorized in the non-volatile memory 14. Then, the memorized door opening and shutting stroke value is read in the plant memory 15 for the door stroke value of the micro-computor 12. In the automatic door for opening and shutting the door 5 according to the door opening and shutting stroke value, when the door opening and shutting stroke value is not memorized in the non-volatile memory 14 after the power supply, the door 5 is opened and shut at the low speed to measure the door stroke value. And the door stroke value is memorized in the plant memory 15 for the door stroke value of the micro-computor 12 as the door opening and shutting stroke value, and the door 5 is opened and shut in accordance with the memorized value.
    Type: Grant
    Filed: June 24, 1992
    Date of Patent: May 24, 1994
    Assignee: Yoshida Kogyo K.K.
    Inventors: Akiyoshi Takimoto, Tamotsu Tanaka, Yukio Yoshida
  • Patent number: 4734574
    Abstract: A light projecting and receiving unit for use in a human body detecting apparatus having a light projecting section consisting of at least one set of concave mirrors and a plurality of light projecting elements, and a light receiving section consisting of at least one set of concave mirrors and a plurality of light receiving elements. The light projecting section and the light receiving section are formed on one side surface of a generally rectangular unit body, and the unit body is divided longitudinally into one and the other sides by a partition wall located at the longitudinal central part of the unit body and projecting vertically therefrom as an integral part thereof. Further, each of the split concave mirror sets consists of a combination of a plurality of concave mirrors oriented in different directions and arranged sequentially in the longitudinal direction of the unit body so as to have a common or the same focus.
    Type: Grant
    Filed: December 17, 1986
    Date of Patent: March 29, 1988
    Assignee: Yoshida Kogyo K. K.
    Inventor: Tamotsu Tanaka
  • Patent number: 4265320
    Abstract: An electrically powered torque-controlled tool having an electric motor which rotates a bit, whereby a screw, bolt or nut fitted at the front end of the bit is tightened. The tool is designed so that when the tightening force exerted by the bit reaches a preset torque, the driving by the electric motor is stopped by opening the switch and concurrently therewith a clutch interposed between the electric motor and the bit is disengaged and held in this released state, thereby avoiding the reaction which would otherwise be produced by the motor inertia immediately after the tightening, thus achieving a high-precision tightening operation.
    Type: Grant
    Filed: May 4, 1978
    Date of Patent: May 5, 1981
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Tamotsu Tanaka, Michio Kato, Masataka Uematsu, Yoshikazu Nishida, Shuji Hosokawa
  • Patent number: 4039114
    Abstract: Wire-bonding equipment has jigs which may be secured on a mounting support whereat an electronic or other module may be loaded onto a jig and moved into a correct alignment observable on a television screen, and the jigs are transportable from the mounting support location to a positioning table location whereat successive jigs are automatically moved in a requisite manner to bring successive terminals of modules loaded thereon to a position for bonding of wires thereto by a simultaneously actuated wire-bonder unit, after which successive jigs are transported back to the mounting support to permit unloading of a wired module and loading of a new module. Since the disclosed equipment permits use of ultrasonic bonding means, and requires only simple, easily observable actions by an operator, the equipment is particularly suited to wiring of microelectronic modules.
    Type: Grant
    Filed: February 13, 1976
    Date of Patent: August 2, 1977
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takekazu Yoshida, Yoshiaki Makizawa, Tamotsu Tanaka