Abstract: A processing system includes: at least one processing unit. Each processing unit includes a plurality of processing chambers, and a utility module. Each of the processing chambers processes a processing target object using a supplied processing gas. The utility module includes a flow rate controller configured to control a flow rate of the processing gas supplied to each of the plurality of processing chambers. The plurality of processing chambers are disposed to overlap each other in a vertical direction. The utility module is disposed between two processing chambers adjacent in the vertical direction, among the plurality of processing chambers.

Abstract: A substrate transfer processing apparatus capable of processing a substrate at high speed is provided. A mounting table on which a substrate is mounted includes a plate-shaped main body and a recessed part formed in a rear surface of the plate-shaped main body. Since the mounting table is lightweight as compared to the mounting table before the recessed part is formed therein, the load on a motor is small and the running cost is low even when the mounting table is moved at high speed. Because the plate-shaped main body is made of granite, the mounting surface can be made flat and smooth by polishing. Since the mounting surface is flat and smooth, the accuracy in positioning the substrate is high.

Abstract: Provided is a substrate stage which can transfer a substrate at a high speed. In the substrate stage of the present invention, auxiliary mounting tables are attached to a main mounting table, and lower rails are arranged over on the main mounting table and above the auxiliary mounting tables. When both ends of the lower rails are bent upwardly by a vertically adjusting unit in order to prevent the both ends of the lower rails to be bent downwardly, the lower rails are made straight. Since the lower rail is not divided, the linearity is ensured and the moving plate does not stutter so that transfer of the substrate at high speed can be performed.

Abstract: A movable table, which has a substrate to be processed mounted thereon and moves, includes: a main plate formed of a metallic material; and a plurality of sub plates which is disposed on the main plate and is formed of a material with a hardness higher than the metallic material, and the top surfaces of the plurality of sub plates are mounting surfaces of the substrate to be processed.

Abstract: A substrate transfer processing apparatus capable of processing a substrate at high speed is provided. A mounting table on which a substrate is mounted includes a plate-shaped main body and a recessed part formed in a rear surface of the plate-shaped main body. Since the mounting table is lightweight as compared to the mounting table before the recessed part is formed therein, the load on a motor is small and the running cost is low even when the mounting table is moved at high speed. Because the plate-shaped main body is made of granite, the mounting surface can be made flat and smooth by polishing. Since the mounting surface is flat and smooth, the accuracy in positioning the substrate is high.

Abstract: Provided is a substrate stage which can transfer a substrate at a high speed. In the substrate stage of the present invention, auxiliary mounting tables are attached to a main mounting table, and lower rails are arranged over on the main mounting table and above the auxiliary mounting tables. When both ends of the lower rails are bent upwardly by a vertically adjusting unit in order to prevent the both ends of the lower rails to be bent downwardly, the lower rails are made straight. Since the lower rail is not divided, the linearity is ensured and the moving plate does not stutter so that transfer of the substrate at high speed can be performed.

Abstract: A movable table, which has a substrate to be processed mounted thereon and moves, includes: a main plate formed of a metallic material; and a plurality of sub plates which is disposed on the main plate and is formed of a material with a hardness higher than the metallic material, and the top surfaces of the plurality of sub plates are mounting surfaces of the substrate to be processed.

Abstract: An opening and closing apparatus (52, 54) opens and closes an opening and closing lid (10) which closes an opening part (4) of an accommodating box (2) for accommodating an object (W) to be processed and is locked by a locking mechanism (12). A key member (26) is mounted to a base table (90) via a bearing mechanism (92) in a state in which the key member is rotatable with respect to the base table (90) and movable in a vertical direction with respect to a front surface of the base table (90). A part of the opening and closing lid (10) is held by being put between the key member (26) and an elastic member (98) provided on a front surface of the base table. Thereby, the opening and closing lid (10) is prevented from being displaced with respect to the base table (90) when the opening and closing lid (10) is removed from the accommodation box (2).

Abstract: A vertical heat treatment apparatus for semiconductor wafers (W) including a heat treating furnace (19) which is heated to 600.degree. C. or higher. In the heat treating furnace (19), the wafers (W) are subjected to batch treatment while they are placed on a boat (16). A preparatory vacuum chamber (102) is airtightly connected to a lower side of the heat treating furnace (19). Disposed in the preparatory vacuum chamber (102) are a horizontal transfer mechanism (201) and a vertical transfer mechanism (202) for transferring the boat (16). The two transfer mechanisms (201 and 202) are supported by support members (29a and 33a) mounted on a mechanical base (28). The preparatory vacuum chamber (102) and the support members (29a and 33a) are airtightly connected to each other by means of bellows.

Abstract: The vertical heat treatment apparatus for semiconductor wafers (W) includes a heat treatment furnace (19). In the heat treatment furnace (19), the wafers (W) are subjected to a batch treatment in a state mounted on a boat (16). To the lower side of the heat treatment furnace (19), a preparatory vacuum chamber (102) is airtightly connected through a manifold (33). The manifold (33) has first and second parts (33a and 33b) separably coupled to each other, which are connected to the heat treatment furnace (19) and the preparatory vacuum chamber (102), respectively. The second part (33b) defines a valve seat on which a lid (22) is seated to cut off the communication between the heat treatment furnace (19) and the preparatory vacuum chamber (102).

Abstract: A treatment apparatus comprises a treatment chamber for performing a treatment for a workpiece W, a loading chamber connected to the treatment chamber, for loading and unloading a holding member which contains the workpiece into and from the treatment chamber, and an input/output chamber for inputting and outputting the workpiece to and from the loading chamber. The input/output chamber includes a cassette accommodating vessel port which holds a cassette accommodating vessel. The vessel is filled with clean air or an inert gas, and is airtightly closed. A cassette receiving mechanism is disposed below the port and lowers only the cassette of the vessel so as to receive the cassette. Thus, when the cassette is input and output to and from the outside of the treatment apparatus, the workpiece contained within the cassette is not exposed to the atmosphere in a working region. Consequently, it is not necessary to improve the cleanliness level of the atmosphere in the working region.

Abstract: A treatment apparatus comprises a treatment chamber for performing a treatment for a workpiece W, a loading chamber connected to the treatment chamber, for loading and unloading a holding member which contains the workpiece into and from the treatment chamber, and an input/output chamber for inputting and outputting the workpiece to and from the loading chamber. The input/output chamber includes a cassette accommodating vessel port which holds a cassette accommodating vessel. The vessel is filled with clean air or an inert gas, and is airtightly closed. A cassette receiving mechanism is disposed below the port and lowers only the cassette of the vessel so as to receive the cassette. Thus, when the cassette is input and output to and from the outside of the treatment apparatus, the workpiece contained within the cassette is not exposed to the atmosphere in a working region. Consequently, it is not necessary to improve the cleanliness level of the atmosphere in the working region.