Abstract: The present invention relates to a brake band for use with a centrifugal clutch. The brake band is formed in a curved strip shape to be disposed along the outer peripheral surface of a clutch drum of the centrifugal clutch, and is adapted to be tightened around or released from the outer peripheral surface in response to the movement of at least one end of the brake band. The brake band comprises a plurality of linings provided on the inner surface thereof to be opposed the outer peripheral surface of the clutch drum. The linings are located spaced apart from each other along the longitudinal direction of the brake band.

Abstract: There is provided a recoil starter which is capable of inhibiting settling and bending in the spiral spring of spiral spring mechanism, thus improving the durability of the spiral spring and preventing the internal hook end of the spiral spring from being easily disengaged from the core portion. The spiral spring mechanism comprises a spiral spring case placed close to the driving member, a actuating pulley placed close to the driven member, a spiral spring interposed between the spiral spring case and the actuating pulley, and means for rotating the spiral spring case only unidirectionally, wherein the outer and inner ends of the spiral spring are fastened to the spiral spring case and the actuating pulley, respectively.

Abstract: The present invention relates to a brake band for use with a centrifugal clutch. The brake band is formed in a curved strip shape to be disposed along the outer peripheral surface of a clutch drum of the centrifugal clutch, and is adapted to be tightened around or released from the outer peripheral surface in response to the movement of at least one end of the brake band. The brake band comprises a plurality of linings provided on the inner surface thereof to be opposed the outer peripheral surface of the clutch drum. The linings are located spaced apart from each other along the longitudinal direction of the brake band.

Abstract: There is provided a recoil starter which is capable of inhibiting settling and bending in the spiral spring of spiral spring mechanism, thus improving the durability of the spiral spring and preventing the internal hook end of the spiral spring from being easily disengaged from the core portion. The spiral spring mechanism comprises a spiral spring case placed close to the driving member, a actuating pulley placed close to the driven member, a spiral spring interposed between the spiral spring case and the actuating pulley, and means for rotating the spiral spring case only unidirectionally, wherein the outer and inner ends of the spiral spring are fastened to the spiral spring case and the actuating pulley, respectively.

Abstract: Providing a method of producing a semiconductor device wherein semiconductor element are sealed with a resin by using the same lead and other means regardless of the specifications of the semiconductor elements, and a semiconductor device which can be reduced in size and weight and has good heat dissipation performance and high-frequency performance. The semiconductor devices can be produced by mounting a plurality of the semiconductor elements on the lead frame having leads disposed substantially parallel to each other, sealing the whole with a resin, and cutting off the individual semiconductor devices.

Abstract: Providing a method of producing a semiconductor device wherein semiconductor element are sealed with a resin by using the same lead and other means regardless of the specifications of the semiconductor elements, and a semiconductor device which can be reduced in size and weight and has good heat dissipation performance and high-frequency performance.

Abstract: Providing a method of producing a semiconductor device wherein semiconductor element are sealed with a resin by using the same lead and other means regardless of the specifications of the semiconductor elements, and a semiconductor device which can be reduced in size and weight and has good heat dissipation performance and high-frequency performance. The semiconductor devices can be produced by mounting a plurality of the semiconductor elements on the lead frame having leads disposed substantially parallel to each other, sealing the whole with a resin, and cutting off the individual semiconductor devices.