Abstract: There is provided a pyroelectric ceramic composition of the general formula:X--PbZrO.sub.3 --Y--Pb(Zn.sub.1/3 NB.sub.2/3)O.sub.3 --Z--PbTiO.sub.3where X+Y+Z=1, X=0.07, 0.82.ltoreq.X.ltoreq.0.93, O<Y.ltoreq.0.11, and having both of high pyroelectric constant and the second transition temperature below its Curie's temperature. Further, the material comprising the combination of the fired powders having the different compositions of the above formula, each from the other can be more useful.

Abstract: A pyroelectric ceramic composition structure composed of ceramic agglomerations assembled from a plurality of pyroelectric ceramic compositions to form a structure with a high pyroelectric constant, and a second transition temperature below its curie temperature. The composition is made up of a compound of the formula:PbZr.sub.x (Zn.sub.1/3 Nb.sub.2/3).sub.y Ti.sub.z O.sub.3wherein X+Y+Z=1, X=0.72-0.95; Y=0.1-Z and 0<Z.ltoreq.0.1 an additive and a glass phase which acts to sinter together the agglomerates.

Abstract: A pyroelectric ceramic composition of the general formula: PbZr.sub.X (Zn.sub.1/3 Nb.sub.2/3).sub.Y Ti.sub.Z O.sub.3 wherein X+Y+Z=1 is provided having both of high pyroelectric constant and the second transition temperature below its Curie's temperature. Further, there is provided a multilayered pyroelectric structure comprising a stack of a plurality of layers, each of which has the different composition each to other, of the general formula: PbZr.sub.X (Zn.sub.1/3 Nb.sub.2/3).sub.Y Ti.sub.Z O.sub.3 wherein X+Y+Z=1, where the value of Z is different from each other in the different layers.

Abstract: A highly electroconductive paste for metallizing comprising (a) a high-melting metal powder such as W, Mo, Mo-Mn, Pt, etc., powder, (b) an additive such as MgO, CaO, SiO.sub.2, Al.sub.2 O.sub.3, etc., in an amount of 0.1 to 3 parts by weight per 100 parts by weight of the metal powder, (c) a binding agent, and (d) a solvent can give a highly electroconductive metallized ceramic having strongly bonded metallized layer by coating said paste on an alumina ceramic substrate and firing it.

Abstract: A novel circuit board in which circuit portions including pad portions, through-hole portions and conductors are formed, at least at the pad portions and the through-hole portions of the circuit, in the vacant portions defined by a cured photopolymeric resin composition and the vacant portions are plated with electroless copper. When only the pad portions and through-hole portions are plated with electroless copper, the conductors are all covered with the resin composition, thereby enabling fears of mechanical and chemical damages to be eliminated. When all the circuit portions are plated with electroless copper, the amount of copper required can be considerably reduced.