Abstract: Tunable bandpass filters are provided. In one embodiment, the invention relates to a tunable bandpass filter including a dielectric substrate having a first surface opposite to a second surface, a conductive ground plane disposed on the first surface, a microstrip conductive trace pattern disposed on the second surface, the trace pattern defining a phase velocity compensation transmission line section including a series of spaced alternating T-shaped conductor portions, at least one varactor diode coupled to a first T-shaped conductor portion of the series of T-shaped conductor portions and to the conductive ground plane, and bias control circuitry coupled to the first T-shaped conductor portion, wherein the bias control circuitry is configured to control the at least one varactor diode.

Abstract: Tunable bandpass filters are provided. In one embodiment, the invention relates to a tunable bandpass filter including a dielectric substrate having a first surface opposite to a second surface, a conductive ground plane disposed on the first surface, a microstrip conductive trace pattern disposed on the second surface, the trace pattern defining a phase velocity compensation transmission line section including a series of spaced alternating T-shaped conductor portions, at least one varactor diode coupled to a first T-shaped conductor portion of the series of T-shaped conductor portions and to the conductive ground plane, and bias control circuitry coupled to the first T-shaped conductor portion, wherein the bias control circuitry is configured to control the at least one varactor diode.

Abstract: Tunable bandpass filters are provided. In one embodiment, the invention relates to a tunable bandpass filter including a dielectric substrate having a first surface opposite to a second surface, a conductive ground plane disposed on the first surface, a microstrip conductive trace pattern disposed on the second surface, the trace pattern defining a phase velocity compensation transmission line section including a series of spaced alternating T-shaped conductor portions, at least one varactor diode coupled to a first T-shaped conductor portion of the series of T-shaped conductor portions and to the conductive ground plane, and bias control circuitry coupled to the first T-shaped conductor portion, wherein the bias control circuitry is configured to control the at least one varactor diode.

Abstract: A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.

Abstract: Tunable bandpass filters are provided. In one embodiment, the invention relates to a tunable bandpass filter including a dielectric substrate having a first surface opposite to a second surface, a conductive ground plane disposed on the first surface, a microstrip conductive trace pattern disposed on the second surface, the trace pattern defining a phase velocity compensation transmission line section including a series of spaced alternating T-shaped conductor portions, at least one varactor diode coupled to a first T-shaped conductor portion of the series of T-shaped conductor portions and to the conductive ground plane, and bias control circuitry coupled to the first T-shaped conductor portion, wherein the bias control circuitry is configured to control the at least one varactor diode.

Abstract: A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.

Abstract: A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.

Abstract: Tunable bandpass filters are provided. In one embodiment, the invention relates to a tunable bandpass filter including a dielectric substrate having a first surface opposite to a second surface, a conductive ground plane disposed on the first surface, a microstrip conductive trace pattern disposed on the second surface, the trace pattern defining a phase velocity compensation transmission line section including a series of spaced alternating T-shaped conductor portions, at least one varactor diode coupled to a first T-shaped conductor portion of the series of T-shaped conductor portions and to the conductive ground plane, and bias control circuitry coupled to the first T-shaped conductor portion, wherein the bias control circuitry is configured to control the at least one varactor diode.

Abstract: A surface mount circulator. The novel circulator includes a substrate, a predetermined number of microstrip lines disposed on a first surface of the substrate, a ground layer and a predetermined number of electrical contacts disposed on the second surface of the substrate, and a mechanism for coupling each microstrip line to one of the electrical contacts. In an illustrative embodiment, the circulator uses edge wrap metallization to wrap a microstrip line down a side of the substrate to connect with a corresponding contact. A ball grid array can then be used to connect the signal contacts and ground at the second surface of the substrate with a circuit board. The circulator also includes a magnet on first surface of the substrate over a resonator circuit connecting the microstrip lines and a pole piece on the second surface of the substrate beneath the ground to provide magnetic bias to the substrate.

Abstract: A compact multilayer signal processing system. In the illustrative embodiment, the system is adapted for use with microwave signals. The system includes a first mechanism for receiving an input signal and selectively routing the input signal onto a first signal path. A second mechanism routes the input signal along the first signal path vertically through one or more layers to a first circuit component. The first circuit component outputs an adjusted signal in response to receipt of the input signal. A third mechanism directs the adjusted signal to the output of the system. In a specific embodiment, the one or more layers include one or more groundplane layers. In this embodiment, the first mechanism includes an input switching network in communication with a controller. The switching network is positioned on a switching layer and communicates with one or more controllers to facilitate selectively switching the input signal onto one of plural input signal paths.

Abstract: A compact multilayer signal processing system. In the illustrative embodiment, the system is adapted for use with microwave signals. The system includes a first mechanism for receiving an input signal and selectively routing the input signal onto a first signal path. A second mechanism routes the input signal along the first signal path vertically through one or more layers to a first circuit component. The first circuit component outputs an adjusted signal in response to receipt of the input signal. A third mechanism directs the adjusted signal to the output of the system. In a specific embodiment, the one or more layers include one or more groundplane layers. In this embodiment, the first mechanism includes an input switching network in communication with a controller. The switching network is positioned on a switching layer and communicates with one or more controllers to facilitate selectively switching the input signal onto one of plural input signal paths.

Abstract: An edge-coupled filter includes a phase velocity compensation transmission line section comprising a series of spaced alternating T-shaped conductor portions.

Abstract: An edge-coupled filter includes a phase velocity compensation transmission line section comprising a series of spaced alternating T-shaped conductor portions.

Abstract: A multi-channel microwave switched filter bank, wherein the input circuitry and output circuitry are mounted on opposite sides of the filter bank, providing a compact structure with excellent isolation. The filter bank includes a set of microwave band pass filter circuits. A housing structure provides an outer conductive peripheral frame structure. A rack structure disposed within the housing structure has a plurality of elongated slots for mounting therein corresponding ones of the plurality of filter circuits. A top dielectric substrate board is mounted adjacent a first side of the rack structure and has a first set of openings formed therein for providing access to a first set of input/output (I/O) ports of the plurality of filter circuits. A bottom dielectric substrate board is mounted adjacent a second side of the rack structure opposite the first side and has a second set of openings formed therein for providing access to a second set of input/output (I/O) ports of the plurality of filter circuits.

Abstract: A compact thick film substrate for filtering, shielding, and routing multiple lines of dc and control signals between isolated ports of a microwave integrated circuit. The substrate circuit includes a dielectric substrate having upper and lower substrate surfaces and first and second side surfaces. A first ground plane layer is formed on the upper substrate surface.