Patents by Inventor Tan Eng Hwa

Tan Eng Hwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stress relieving film for semiconductor packages
    Patent number: 7187075
    Abstract: Techniques for reducing the mechanical stress imposed upon semiconductor dice by protective molding compounds during times of temperature fluctuation. A thermoplastic material is attached to a top surface of a die to relieve the stress. The thermoplastic material serves as a cushion between the die and the molding compound when the components expand and contract. The thermoplastic material can be shaped such that it does not cover bond pads on the surface of a die.
    Type: Grant
    Filed: July 29, 2004
    Date of Patent: March 6, 2007
    Assignee: National Semiconductor Corporation
    Inventors: Tan Eng Hwa, Lim Peng Soon, Santhiran S/O Nadarajah, Ong Sze Yan