Abstract: A stacked die package is disclosed. The stacked die package includes a wire-bond die that is electrically coupled to other components via one or more wire bonds and a flip-chip die that is coupled to the top surface of the wire-bond die via one or more solder joints. The wire-bond die is formed underneath the flip-chip die. A space defined by the height of the loops of the one or more wire-bonds overlap a space defined by the thickness of one or more solder joints.

Abstract: A circuit assembly having an insulating base, a heat-conducting plate and a circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the insulating base. The insulating base includes heat-conducting channels that are in thermal contact with the heat-conducting plate. The die includes an integrated circuit therein and is mounted such that the heat-conducting plate is disposed between the die and the insulating plate. The insulating base preferably includes signal conducting channels for providing electrical connections to the die, the heat-conducting plate having an opening therein for making the connections between the die and the conducting channels. The assembly may also include a heat-spreading cover in thermal contact with the heat-conducting base plate, the heat-spreading cover overlying the die. The heat-conducting channels are preferably filled with solder, and include a solder protrusion extending from the heat-conducting channels.

Abstract: A packaged die having a die pad, leads, and a power ring is disclosed. The die includes an electrical circuit thereon and is attached to the die pad. The leads are arranged around the die pad with at least one of the leads being connected to the die. The power ring includes a conductor disposed between the leads and the die pad, at least one power connection on the die being connected to the power ring. A layer of encapsulating material covers the die, die pad, the power ring, and the leads. The layer has a top surface, a bottom surface, and side surfaces. Each of the leads includes a conductor having a portion thereof exposed on the bottom surface. In addition, a portion of the conductor in the power ring is exposed on the bottom surface. In one embodiment, the exposed portions of the conductors include solder balls.

Abstract: A circuit assembly having an insulating base, heat-conducting plate and circuit containing die is disclosed. The die is in thermal contact with the heat-conducting plate, which is bonded to the insulating base. The insulating base includes heat-conducting channels that are in thermal contact with the heat-conducting plate. The die includes an integrated circuit therein and is mounted such that the heat-conducting plate is disposed between the die and the insulating plate. The insulating base preferably includes signal conducting channels for providing electrical connections to the die, the heat-conducting plate having an opening therein for making the connections between the die and the conducting channels. The assembly may also include a heat-spreading cover in thermal contact with the heat-conducting base plate, the heat-spreading cover overlying the die. The heat-conducting channels are preferably filled with solder, and include a solder protrusion extending from the heat-conducting channels.