Patents by Inventor Tan Hock Chuan

Tan Hock Chuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8058716
    Abstract: An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: November 15, 2011
    Assignee: Micron Technology, Inc.
    Inventors: Chew Beng Chye, Tan Kian Shing Michael, Tan Hock Chuan, Neo Chee Peng
  • Publication number: 20100065955
    Abstract: An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.
    Type: Application
    Filed: November 24, 2009
    Publication date: March 18, 2010
    Applicant: Micron Technology, Inc.
    Inventors: Chew Beng Chye, Tan Kian Shing Michael, Tan Hock Chuan, Neo Chee Peng
  • Patent number: 7622798
    Abstract: An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: November 24, 2009
    Assignee: Micron Technology, Inc.
    Inventors: Chew Beng Chye, Tan Kian Shing Michael, Tan Hock Chuan, Neo Chee Peng
  • Publication number: 20080233684
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
    Type: Application
    Filed: April 23, 2008
    Publication date: September 25, 2008
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
  • Patent number: 7425470
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
    Type: Grant
    Filed: August 17, 2004
    Date of Patent: September 16, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
  • Publication number: 20070246840
    Abstract: An IC device includes a die and a first package interposer stacked over a second package interposer. The IC device includes a first conductive connection from a first bond pad of the die directly to a bond pad of the first interposer and a second conductive connection from a second bond pad of the die directly to a bond pad of the second interposer. Another IC device includes a second die stacked over a separate first die and a first package interposer stacked over a separate second package interposer. The first die is stacked over the first interposer. A first conductive connection exists from a bond pad of the first die directly to a bond pad of the first interposer and a second conductive connection exists from a bond pad of the second die directly to a bond pad of the second interposer.
    Type: Application
    Filed: June 1, 2006
    Publication date: October 25, 2007
    Inventors: Chew Beng Chye, Tan Kian Shing Michael, Tan Hock Chuan, Neo Chee Peng
  • Patent number: 7057281
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: June 6, 2006
    Assignee: Micron Technology Inc.
    Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
  • Patent number: 7018270
    Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.
    Type: Grant
    Filed: July 28, 2005
    Date of Patent: March 28, 2006
    Assignee: Micron Technology, Inc.
    Inventors: Neo Chee Peng, Tan Hock Chuan, Ho Kian Seng, Chew Beng Chye, Lim Guek Har, Tan Kok Chua
  • Patent number: 6939199
    Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.
    Type: Grant
    Filed: June 2, 2003
    Date of Patent: September 6, 2005
    Assignee: Micron Technology, Inc.
    Inventors: Neo Chee Peng, Tan Hock Chuan, Ho Kian Seng, Chew Beng Chye, Lim Guek Har, Tan Kok Chua
  • Publication number: 20040188400
    Abstract: Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.
    Type: Application
    Filed: April 13, 2004
    Publication date: September 30, 2004
    Applicant: Micron Technology, Inc.
    Inventors: Neo Chee Peng, Kian Shing Tan, Chew Beng Chyt, Tan Hock Chuan, Fong Chun Wai
  • Publication number: 20040173899
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
    Type: Application
    Filed: April 28, 2003
    Publication date: September 9, 2004
    Inventors: Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, David Chai Yih Ming, Michael Tan Kian Shing
  • Patent number: 6737606
    Abstract: Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.
    Type: Grant
    Filed: July 9, 2002
    Date of Patent: May 18, 2004
    Assignee: Micron Technology, Inc.
    Inventors: Neo Chee Peng, Kian Shing Tan, Chew Beng Chye, Tan Hock Chuan, Fong Chun Wai
  • Publication number: 20030203538
    Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.
    Type: Application
    Filed: June 2, 2003
    Publication date: October 30, 2003
    Inventors: Neo Chee Peng, Tan Hock Chuan, Ho Kian Seng, Chew Beng Chye, Lim Guek Har, Tan Kok Chua
  • Patent number: 6576531
    Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: June 10, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Neo Chee Peng, Tan Hock Chuan, Ho Kian Seng, Chew Beng Chye, Lim Guek Har, Tan Kok Chua
  • Publication number: 20030060022
    Abstract: Improperly mounted wafer saw blades can damage wafers cut or diced with the blades. Embodiments of this invention employ sensors to measure a distance to the blade to help indicate if the blade is improperly mounted. In one method of the invention, a the distance to the blade face is measured as the blade is rotated and a variance in this measured distance is determined. If the variance is no greater than a predetermined maximum, the blade may be used to cut the wafer. In one apparatus of the invention, a wafer saw include a blade and a sensor. The sensor is adapted to monitor a distance to a face of the rotating blade. A processor coupled to the sensor may indicate if the distance to the face of the blade as it rotates deviates too far from a baseline position of the blade face.
    Type: Application
    Filed: August 30, 2001
    Publication date: March 27, 2003
    Inventors: Neo Chee Peng, Tan Hock Chuan, Ho Kian Seng, Chew Beng Chye, Lim Guek Har, Tan kok Chua
  • Publication number: 20030047543
    Abstract: Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.
    Type: Application
    Filed: July 9, 2002
    Publication date: March 13, 2003
    Applicant: Micron Technology, Inc.
    Inventors: Neo Chee Peng, Kian Shing Tan, Chew Beng Chye, Tan Hock Chuan, Fong Chun Wai