Patents by Inventor Tan Hwee

Tan Hwee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050205987
    Abstract: A chip level package utilizing a CGA is described. A semiconductor chip with pillars is molded in an encapsulant. Solder balls are added and connected to the chip pillars. The final package does not require a first level substrate or interposer and is able to be assembled to the next level as is. An additional embodiment describes the addition of a thermal heat sink to the packaged chip.
    Type: Application
    Filed: May 12, 2005
    Publication date: September 22, 2005
    Inventors: Tan Hwee, Roman Perez, Kee Lau, Alex Chew, Antonio Dimaano
  • Publication number: 20050087883
    Abstract: A design and method of fabrication for a semiconductor package is described. A solder bumped semiconductor chip is assembled to a metallized package substrate utilizing the solder bumps. The interconnecting solder bumps are properly constrained at assembly by the introduction of a no-flow underfill between the chip and the substrate. The no-flow underfill constrains the solder of the solder bumps so as to maintain the desired size and shape.
    Type: Application
    Filed: October 22, 2003
    Publication date: April 28, 2005
    Inventors: Tan Hwee, Roman Perez, Antonio Dimaano, Lau Kwang, Alex Chew