Patents by Inventor Tan Kek Yong

Tan Kek Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Test handler apparatus for SMD (surface mount devices), BGA (ball grid arrays) and CSP (chip scale packages)
    Patent number: 6765378
    Abstract: A test handler apparatus, having a treatment area; a testing station in the treatment area; and an output unit connected to an output of the treatment area. An input unit picks singulated or stripped packages and unloads them on carrier boats in a loading zone; a conveyor mechanism transfers the carrier boats from the loading zone through the treatment area to the testing station and from the testing station to the output unit. In practice, the carrier boat forms a universal carrier which is able to contain multiple singulated or strip packages for the purpose of testing. Placing packages onto carriers with standardized dimension allows handler equipment to accommodate the packages in singulated or strip condition.
    Type: Grant
    Filed: July 1, 2002
    Date of Patent: July 20, 2004
    Assignee: STMicroelectronics Sdn Bhd
    Inventors: Lee Boon Seng, Tan Kek Yong
  • Test handler apparatus for SMD (surface mount devices), BGA (ball grid arrays) and CSP (chip scale packages)
    Publication number: 20030020457
    Abstract: A test handler apparatus, having a treatment area; a testing station in the treatment area; and an output unit connected to an output of the treatment area. An input unit picks singulated or stripped packages and unloads them on carrier boats in a loading zone; a conveyor mechanism transfers the carrier boats from the loading zone through the treatment area to the testing station and from the testing station to the output unit. In practice, the carrier boat forms a universal carrier which is able to contain multiple singulated or strip packages for the purpose of testing. Placing packages onto carriers with standardized dimension allows handler equipment to accommodate the packages in singulated or strip condition.
    Type: Application
    Filed: July 1, 2002
    Publication date: January 30, 2003
    Applicant: STMICROELECTRONICS SDN BHD
    Inventors: Lee Boon Seng, Tan Kek Yong