Patents by Inventor Tan Kwang Hong

Tan Kwang Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of packaging integrated circuit devices using preformed carrier
    Patent number: 8217508
    Abstract: Disclosed is a method of packaging integrated circuit devices using a preformed carrier. In one illustrative embodiment, the method includes providing a carrier having a plurality of pockets formed therein, positioning an integrated circuit chip and a substrate in each of the plurality of pockets and conductively coupling the integrated circuit chip and the substrate in each of the plurality of pockets to one another. Also disclosed is a packaged integrated circuit device including a preformed body and an integrated circuit chip and a substrate positioned within the preformed body, the integrated chip and the substrate being conductively coupled to one another.
    Type: Grant
    Filed: February 11, 2010
    Date of Patent: July 10, 2012
    Assignee: Micron Technology, Inc.
    Inventor: Tan Kwang Hong
  • METHOD OF PACKAGING INTEGRATED CIRCUIT DEVICES USING PREFORMED CARRIER
    Publication number: 20100148351
    Abstract: Disclosed is a method of packaging integrated circuit devices using a preformed carrier. In one illustrative embodiment, the method includes providing a carrier having a plurality of pockets formed therein, positioning an integrated circuit chip and a substrate in each of the plurality of pockets and conductively coupling the integrated circuit chip and the substrate in each of the plurality of pockets to one another. Also disclosed is a packaged integrated circuit device including a preformed body and an integrated circuit chip and a substrate positioned within the preformed body, the integrated chip and the substrate being conductively coupled to one another.
    Type: Application
    Filed: February 11, 2010
    Publication date: June 17, 2010
    Applicant: MICRON TECHNOLOGY, INC.
    Inventor: Tan Kwang Hong
  • Method of packaging integrated circuit devices using preformed carrier
    Patent number: 7682869
    Abstract: Disclosed is a method of packaging integrated circuit devices using a preformed carrier. In one illustrative embodiment, the method includes providing a carrier having a plurality of pockets formed therein, positioning an integrated circuit chip and a substrate in each of the plurality of pockets and conductively coupling the integrated circuit chip and the substrate in each of the plurality of pockets to one another. Also disclosed is a packaged integrated circuit device including a preformed body and an integrated circuit chip and a substrate positioned within the preformed body, the integrated chip and the substrate being conductively coupled to one another.
    Type: Grant
    Filed: March 23, 2006
    Date of Patent: March 23, 2010
    Assignee: Micron Technology, Inc.
    Inventor: Tan Kwang Hong