Abstract: Conventional processor and memory configurations place holes into silicon or use expensive multi-layer-laminates/substrates to connect the processor with memory. Using a direct contact between the memory and processor allows for signaling between the two units. By judicious arrangement of the contact areas as well as employing other structures such as carriers and redistributors, adequate power and ground supply can be maintained for the processor. Therefore, there is little-to-no damage done to the silicon and expensive multi-layer-laminates/substrates can be avoided. Furthermore, there can be faster processing speeds since the memory and processor are close together.

Abstract: Methods for recycling unused error correction code (ECC) during flash memory programming, comprise generating ECC from user data to form a syndrome and storing the syndrome into volatile memory. ECC is re-encoded corresponding to the syndrome read from the memory with new user data. Re-encoding ECC comprises comparing new ECC with the most recent ECC of the previous syndrome, correcting a bit error in the new ECC, and indicating if the new ECC has failed.

Abstract: Methods for recycling unused error correction code (ECC) during flash memory programming, comprise generating ECC from user data to form a syndrome and storing the syndrome into volatile memory. ECC is re-encoded corresponding to the syndrome read from the memory with new user data. Re-encoding ECC comprises comparing new ECC with the most recent ECC of the previous syndrome, correcting a bit error in the new ECC, and indicating if the new ECC has failed.

Abstract: Conventional processor and memory configurations place holes into silicon or use expensive multi-layer-laminates/substrates to connect the processor with memory. Using a direct contact between the memory and processor allows for signaling between the two units. By judicious arrangement of the contact areas as well as employing other structures such as carriers and redistributors, adequate power and ground supply can be maintained for the processor. Therefore, there is little-to-no damage done to the silicon and expensive multi-layer-laminates/substrates can be avoided. Furthermore, there can be faster processing speeds since the memory and processor are close together.