Patents by Inventor Tan Tien Lai

Tan Tien Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module
    Patent number: 7759777
    Abstract: A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second main surface and the carrier.
    Type: Grant
    Filed: April 16, 2007
    Date of Patent: July 20, 2010
    Assignee: Infineon Technologies AG
    Inventors: Ralf Otremba, Xaver Schloegel, Klaus Schiess, Charlie Tan Tien Lai
  • SEMICONDUCTOR MODULE
    Publication number: 20090227071
    Abstract: A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second main surface and the carrier.
    Type: Application
    Filed: March 12, 2009
    Publication date: September 10, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ralf Otremba, Xaver Schloegel, Klaus Schiess, Charlle Tan Tien Lai
  • DEVICE INCLUDING A SEMICONDUCTOR CHIP HAVING A PLURALITY OF ELECTRODES
    Publication number: 20090108460
    Abstract: A device, including a semiconductor chip having a plurality of first electrodes is disclosed. A plurality of second electrodes is arranged on a first surface of the semiconductor chip. A first electrically conductive layer is applied over a first section of the first surface and electrically coupled to the first electrodes arranged within the first section. A second electrically conductive layer is applied over the first electrically conductive layer and electrically coupled to the second electrodes arranged within the first section.
    Type: Application
    Filed: October 26, 2007
    Publication date: April 30, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ralf Otremba, Xaver Schloegel, Klaus Schiess, Tan Tien Lai
  • Semiconductor Module
    Publication number: 20080251859
    Abstract: A component includes a first semiconductor chip attached to a first carrier and second semiconductor chip attached to a second carrier. The first carrier has a first extension, which forms a first external contact element. The second carrier has a second extension, which forms a second external contact element. The first and the second carriers are arranged in such a way that the first and the second extension point in different directions.
    Type: Application
    Filed: April 10, 2007
    Publication date: October 16, 2008
    Inventors: Ralf Otremba, Lutz Goergens, Gerhard Noebauer, Charlie Tan Tien Lai, Erwin Huber, Marco Puerschel, Gilles Delarozee, Markus Dinkel
  • SEMICONDUCTOR MODULE
    Publication number: 20080251903
    Abstract: A module having a semiconductor chip with a first contact element on a first main surface and a second contact element on a second main surface is disclosed. The semiconductor chip is arranged on a carrier. An insulating layer and a wiring layer cover the second main surface and the carrier.
    Type: Application
    Filed: April 16, 2007
    Publication date: October 16, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Ralf Otremba, Xaver Schloegel, Klaus Schiess, Charlie Tan Tien Lai