Patents by Inventor Tan Tseng

Tan Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060003111
    Abstract: A method of making a three dimensional head representative of a head of a three dimensional object includes the steps of creating a geometric file of the head of the three dimensional object, creating an image file of the head of the three dimensional object, milling a milled head based upon the geometric file, recasting the milled head into a sculptable head, sculpting the sculptable shape, painting features onto the sculpted shape based upon the image file.
    Type: Application
    Filed: October 14, 2004
    Publication date: January 5, 2006
    Inventor: Tan Tseng
  • Publication number: 20050069682
    Abstract: A 3D copy of a 3D subject is made by combining a 3D custom milled shape and a 2D printed 2D image sheet molded to the contours of the 3D custom milled shape. A 3D camera captures 3D details of the 3D subject and also captures a multi-color 2D image of the 3D subject. The 3D camera outputs a geometry file to a CNC milling machine that cuts a milling blank to make a custom milled shape. The 3D camera also outputs a 2D image file to a personal computer that prints the 2D image onto a plastic sheet. The custom milled shape is placed as a mold on a vacuum-forming machine. The plastic sheet is aligned to the custom milled shape and heat and vacuum pressure applied. The 2D image is molded into the 3D shape of the custom milled shape.
    Type: Application
    Filed: September 30, 2003
    Publication date: March 31, 2005
    Inventor: Tan Tseng
  • Patent number: 6848882
    Abstract: An apparatus and a method for positioning a cassette pod onto a loadport by an overhead hoist transport system are described. The apparatus includes a vertical front panel of a process machine equipped with a docking opening therein, a loadport stage extending horizontally from the vertical front panel, a loadport situated on the loadport stage, at least two back guiding plates situated on the back of the loadport, at least two side guiding plates with one situated on each side of the loadport, a front guiding plate situated on the front side of the loadport, and a clamp positioner for guiding the position of an OHT clamp during an unloading operation of the cassette pod. The two halves of the clamp positioner move sideways away from each other to allow the cassette pod to pass therethrough during a loading operation.
    Type: Grant
    Filed: March 31, 2003
    Date of Patent: February 1, 2005
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Ho-Jen Chen, Fan-Lin Lu, Ko-Chin Chung, Yu-Tan Tseng
  • Publication number: 20040191042
    Abstract: An apparatus and a method for positioning a cassette pod onto a loadport by an overhead hoist transport system are described. The apparatus includes a vertical front panel of a process machine equipped with a docking opening therein, a loadport stage extending horizontally from the vertical front panel, a loadport situated on the loadport stage, at least two back guiding plates situated on the back of the loadport, at least two side guiding plates with one situated on each side of the loadport, a front guiding plate situated on the front side of the loadport, and a clamp positioner for guiding the position of an OHT clamp during an unloading operation of the cassette pod. The two halves of the clamp positioner move sideways away from each other to allow the cassette pod to pass therethrough during a loading operation.
    Type: Application
    Filed: March 31, 2003
    Publication date: September 30, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ho-Jen Chen, Fan-Lin Lu, Ko-Chin Chung, Yu-Tan Tseng
  • Publication number: 20020091507
    Abstract: A hardware-based logic emulator uses routing chips to implement a virtual full-crossbar interconnect. Logic gates and some internal interconnection of the emulated design are programmed into field-programmable gate array (FPGA) logic chips. External interconnection of the logic chips is provided by routing chips. When the routing chips are also FPGA chips with a same number of I/O pins, the number of routing chips can be 1.5 times the number of logic chips. For L logic chips, the first L routing chips are column routing chips. The column routing chips connect to the same pin or pins of all the logic chips and make connections within a single column of a routing table. The other L2 routing chips are diagonal routing chips that connect to different pins on different logic chips. The diagonal routing chips make connections among logic chips along diagonals in the routing table.
    Type: Application
    Filed: January 5, 2001
    Publication date: July 11, 2002
    Inventor: Tan Tseng