Patents by Inventor Tan Yong Kian

Tan Yong Kian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ultrathin leadframe BGA circuit package
    Patent number: 7294911
    Abstract: A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are positioned below the reference plane. Jumper wires are wirebonded between terminals on the die and the bond pads to form a package subassembly. The subassembly is encapsulated and then background to remove the leadframe fingers and surrounding frame. The bond pads which remain embedded in the encapsulation material are exposed on the lower surface of the package for connection to further conductors.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: November 13, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Teck Kheng Lee, Tan Yong Kian, Setho Sing Fee
  • Ultrathin leadframe BGA circuit package
    Patent number: 7183134
    Abstract: A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are positioned below the reference plane. Jumper wires are wirebonded between terminals on the die and the bond pads to form a package subassembly. The subassembly is encapsulated and then background to remove the leadframe fingers and surrounding frame. The bond pads which remain embedded in the encapsulation material are exposed on the lower surface of the package for connection to further conductors.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: February 27, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Teck Kheng Lee, Tan Yong Kian, Setho Sing Fee
  • Ultrathin leadframe BGA circuit package
    Publication number: 20030197267
    Abstract: A circuit package is formed using a leadframe. The leadframe is formed or etched to align a plurality of bond pad structures above a reference plane while supporting leadframe fingers are positioned below the reference plane. Jumper wires are wirebonded between terminals on the die and the bond pads to form a package subassembly. The subassembly is encapsulated and then background to remove the leadframe fingers and surrounding frame. The bond pads which remain embedded in the encapsulation material are exposed on the lower surface of the package for connection to further conductors.
    Type: Application
    Filed: August 29, 2002
    Publication date: October 23, 2003
    Inventors: Teck Kheng Lee, Tan Yong Kian, Setho Sing Fee