Abstract: A pixel image sensor has an isolation barrier and diffusion well connected to a biasing voltage to prevent substrate charge leakage caused by photoelectrons generated in the substrate beneath a photon sensing area of the pixel image sensor from drifting to a storage node. An opaque metallic silicide layer is deposited on and a metal shield is fabricated above the storage node and storage node control transistor switches to prevent light from impinging on the storage node and storage node control transistor switches and thus preventing generation of photoelectrons at the storage node and storage node control transistor switches. A guard ring surrounds the photo sensing area, the storage node, and the storage node control transistor switches and is in contact with the biasing voltage and reduces cross-talk from photoelectrons drifting from adjacent image sensors.

Abstract: An active pixel sensor circuit comprising a photodiode, a storage node, and a transfer gate between the photodiode and storage node, where the potential barrier between the photodiode and the storage region is maintained during charge accumulation, thereby preventing charge tunneling between the photodiode and the storage region. This is achieved by electrically connecting the transfer gate, which controls charge transfer between the photodiode and the storage region, to the storage region. Connecting the transfer gate to the storage region maintains the potential barrier between the photodiode and the storage region at a threshold voltage during the charge integration period which prevents charge tunneling between the photodiode and the storage node. The threshold voltage is determined by the implant levels used to form the active pixel sensor and can be optimized by using optimum implant levels. This prevention of charge tunneling between the photodiode and the storage node eliminates image lag.

Abstract: A pixel circuit with a dual gate PMOS is formed by forming two P+ regions in an N? well. The N? well is in a P? type substrate. The two P+ regions form the source and drain of a PMOS transistor. The PMOS transistors formed within the N? well will not affect the collection of the photo-generated charge as long as the source and drain potentials of the PMOS transistors are set at a lower potential than the N? well potential so that they remain reverse biased with respect to the N? well. One of the P+ regions used to form the source and drain regions can be used to reset the pixel after it has been read in preparation for the next cycle of accumulating photo-generated charge. The N? well forms a second gate for the dual gate PMOS transistor since the potential of the N? well 12 affects the conductivity of the channel of the PMOS transistor. The addition of two NMOS transistors enables the readout signal to be stored at the gate of one of the NMOS transistors thereby making a snapshot imager possible.

Abstract: A color multiple sensor pixel image sensor includes multiple photo-sensing devices, a combined photosensing and charge storage device, and multiple triggering switches. Each of the multiple photo-sensing devices is structured for conversion of photons of one differentiated color component to photoelectrons. The combined photosensing and charge storage device is structured for conversion of photons of a principal color photoelectrons and connected to sequentially receive photoelectrons from each of the multiple photo-sensing devices. Each triggering switch is connected such that photoelectrons are selectively and sequentially transferred from each of the multiple photo-sensing devices to the combined photosensing and charge storage device.

Abstract: A pixel image sensor has a high shutter rejection ratio that prevents substrate charge leakage to a floating diffusion storage node of the pixel image sensor and prevents generation of photoelectrons within the floating diffusion storage node and storage node control transistor switches of the pixel image sensor. The pixel image sensor that prevents substrate charge leakage of photoelectrons from pixel image sensor adjacent to the pixel image sensor. The pixel image sensor is fabricated on a substrate with an isolation barrier and a carrier conduction well. The isolation barrier formed underneath the floating diffusion storage node allows effective isolation by draining away the stray carriers and preventing them from reaching the floating diffusion storage node. The carrier conduction well in combination with the deep N-well isolation barrier separates the pinned photodiode region from the deep N-well isolation barrier that is underneath the floating diffusion storage node.

Abstract: A multiple photosensor pixel image sensor sense differentiated color components of light. The multiple photosensor pixel image sensor has a plurality of photo-sensing devices formed with the surface of the substrate. Each photo-sensing device has a structure adjusted to convert photons of the light to photoelectrons representative of a magnitude of the color component of the light for which the structure of the photo-sensing device is adjusted. Each multiple photosensor pixel image sensor includes at least one storage node to selectively receive photoelectrons from each photo-sensing device and triggering switches connected to selectively and sequentially transfer the photoelectrons from each of the plurality of photo-sensing devices to the storage node. At least one reset triggering switch is connected to the one storage node to place the storage node to a reset voltage level after integration and sensing of the photoelectrons.

Abstract: An active pixel sensor which provides reduced dark current, improved sensitivity, and improved modulation transfer function. An N well, surrounded by a P well is formed in a P type epitaxial substrate. A P+ region is formed extending from within the P well into the substrate leaving a gap between the P+ region and the N well. A gate dielectric is formed covering at least the gap, part of the P+ region, and part of the N well. A gate electrode is formed on the gate dielectric over the gap, part of the P+ region, and part of the N well. The gate electrode is biased so that the region of the substrate under the gate electrode is accumulated with holes and the region of the N well under the gate electrode is depleted of electrons. This will reduce the dark current and improve the sensitivity of the active pixel sensor.

Abstract: A pixel for detecting red and green light is a single pixel is described. The pixel comprises a deep N well formed in a P type epitaxial substrate. The pixel comprises a deep N well formed in a P type epitaxial substrate. A number of P wells, which are used as the sensor nodes, are formed in the deep N well. The use of these P wells as the sensor nodes improves the modulation transfer function. The depth of the deep N well is about equal to the depth of hole electron pairs generated by red light in silicon. The depth of the P wells is about equal to the depth of hole electron pairs generated by green light in silicon. A red/green signal is determined at each P well by determining the potentials between each of the P wells and the deep N well after a charge integration cycle with the P wells and the deep N well isolated.

Abstract: A pixel circuit with a dual gate PMOS is formed by forming two P+ regions in an N? well. The N? well is in a P+ type substrate. The two P+ regions form the source and drain of a PMOS transistor. The PMOS transistors formed within the N? well will not affect the collection of the photo-generated charge as long as the source and drain potentials of the PMOS transistors are set at a lower potential than the N? well potential so that they remain reverse biased with respect to the N? well. One of the P+ regions used to form the source and drain regions can be used to reset the pixel after it has been read in preparation for the next cycle of accumulating photo-generated charge. The N? well forms a second gate for the dual gate PMOS transistor since the potential of the N? well 12 affects the conductivity of the channel of the PMOS transistor. The addition of two NMOS transistors enables the readout signal to be stored at the gate of one of the NMOS transistors thereby making a snapshot imager possible.

Abstract: A pixel image sensor has an isolation barrier and diffusion well connected to a biasing voltage to prevent substrate charge leakage caused by photoelectrons generated in the substrate beneath a photon sensing area of the pixel image sensor from drifting to a storage node. An opaque metallic silicide layer is deposited on and a metal shield is fabricated above the storage node and storage node control transistor switches to prevent light from impinging on the storage node and storage node control transistor switches and thus preventing generation of photoelectrons at the storage node and storage node control transistor switches. A guard ring surrounds the photo sensing area, the storage node, and the storage node control transistor switches and is in contact with the biasing voltage and reduces cross-talk from photoelectrons drifting from adjacent image sensors.

Abstract: A circuit and method for correcting pixel output signals for fixed pattern noise. Pixels in a selected row of pixels are read after an integration period and the resulting signals are stored in a first sample and hold circuit for each column. The pixels in the selected row are then reset and immediately read again and the resulting signals are stored in a second sample and hold circuit for each column. The signals in the second sample and hold circuits are subtracted from the signals in the first sample and hold circuits to produce signals related to the light seen by the pixels in the selected row corrected for fixed pattern noise. The output of the first sample and hold circuits and second sample and hold circuits can be connected to a subtraction unit and sequentially activated so that a single subtraction unit is required for the entire imager.

Abstract: A pixel circuit with a dual gate PMOS is formed by forming two P+ regions in an N? well. The N? well is in a P? type substrate. The two P+ regions form the source and drain of a PMOS transistor. The PMOS transistors formed within the N? well will not affect the collection of the photo-generated charge as long as the source and drain potentials of the PMOS transistors are set at a lower potential than the N? well potential so that they remain reverse biased with respect to the N? well. One of the P+ regions used to form the source and drain regions can be used to reset the pixel after it has been read in preparation for the next cycle of accumulating photo-generated charge. The N? well forms a second gate for the dual gate PMOS transistor since the potential of the N? well 12 affects the conductivity of the channel of the PMOS transistor. The addition of two NMOS transistors enables the readout signal to be stored at the gate of one of the NMOS transistors thereby making a snapshot imager possible.

Abstract: A photo-sensor image resolution adjustment apparatus is in communication with an array of image photo-sensors that are organized in columns and rows and have multiple sensor types arranged in a pattern such as a Bayer pattern to detect light. The photo-sensor image resolution adjustment apparatus has a photo-sensor array decimation circuit to partition the array of image photo-sensors into a plurality of sub-groups. A column averaging circuit averages the light conversion electrical signals from common color photo-sensors within the sub-groups. A row averaging circuit averages the common color adjacent light conversion electrical signals from color adjacent rows within the sub-groups in high light intensity condition. In low light conditions, a row binning circuit integrates the common color adjacent light conversion electrical signals from color adjacent rows within the sub-groups.

Abstract: A photo-sensor image resolution adjustment apparatus is in communication with an array of image photo-sensors that are organized in columns and rows and have multiple sensor types arranged in a pattern such as a Bayer pattern to detect light. The photo-sensor image resolution adjustment apparatus has a photo-sensor array decimation circuit to partition the array of image photo-sensors into a plurality of sub-groups. A column averaging circuit averages the light conversion electrical signals from common color photo-sensors within the sub-groups. A row averaging circuit averages the common color adjacent light conversion electrical signals from color adjacent rows within the sub-groups in high light intensity condition. In low light conditions, a row binning circuit integrates the common color adjacent light conversion electrical signals from color adjacent rows within the sub-groups.

Abstract: A photo-sensor image resolution adjustment apparatus is in communication with an array of image photo-sensors that are organized in columns and rows and have multiple sensor types arranged in a pattern such as a Bayer pattern to detect light. The photo-sensor image resolution adjustment apparatus has a photo-sensor array decimation circuit to partition the array of image photo-sensors into a plurality of sub-groups. A column averaging circuit averages the light conversion electrical signals from common color photo-sensors within the sub-groups. A row averaging circuit averages the common color adjacent light conversion electrical signals from color adjacent rows within the sub-groups in high light intensity condition. In low light conditions, a row binning circuit integrates the common color adjacent light conversion electrical signals from color adjacent rows within the sub-groups.

Abstract: A stereo imaging chip is presented that contains two imaging arrays located at opposite edges of the chip. Support circuitry, including a computational unit, is located on the chip in areas not occupied by the imaging arrays. A FPGA located on the chip is used to provide instructions to the computational unit and allow updates. A stereo focusing unit on a single optical substrate focuses a distant object onto the two imaging arrays. The semiconductor process producing the chip provides accurate alignment of the two imaging arrays and the use of a single optical substrate to containing the stereo lens provides additional dimensional accuracy and stability to allow calculations of the distance to distant objects.

Abstract: An active pixel sensor which provides reduced dark current, improved sensitivity, and improved modulation transfer function. An N well, surrounded by a P well is formed in a P type epitaxial substrate. A P+ region is formed extending from within the P well into the substrate leaving a gap between the P+ region and the N well. A gate dielectric is formed covering at least the gap, part of the P+ region, and part of the N well. A gate electrode is formed on the gate dielectric over the gap, part of the P+ region, and part of the N well. The gate electrode is biased so that the region of the substrate under the gate electrode is accumulated with holes and the region of the N well under the gate electrode is depleted of electrons. This will reduce the dark current and improve the sensitivity of the active pixel sensor.

Abstract: A new electronic imaging system is achieved. The system comprises a sensor having a first color region, a second color region, and a third color region. A prism system comprises a first prism having a first index of refraction and overlying the first color region. The first prism directs incident light of the first color to the first color region of the sensor. A second prism has a second index of refraction and overlies the second color region. The second prism directs incident light of the second color to the second color region of the sensor. A third prism has a third index of refraction and overlies the third color region. The third prism directs incident light of the third color to the third color region of the sensor.

Abstract: An active pixel sensor circuit comprising a photodiode, a storage node, and a transfer gate between the photodiode and storage node, where the potential barrier between the photodiode and the storage region is maintained during charge accumulation, thereby preventing charge tunneling between the photodiode and the storage region. This is achieved by electrically connecting the transfer gate, which controls charge transfer between the photodiode and the storage region, to the storage region. Connecting the transfer gate to the storage region maintains the potential barrier between the photodiode and the storage region at a threshold voltage during the charge integration period which prevents charge tunneling between the photodiode and the storage node. The threshold voltage is determined by the implant levels used to form the active pixel sensor and can be optimized by using optimum implant levels. This prevention of charge tunneling between the photodiode and the storage node eliminates image lag.

Abstract: A circuit and method for correcting for power supply voltage noise using two dummy pixels in each row of pixels of an imager having a number of pixels arranged in rows and columns are described. The dummy pixels are driven by the same power supply as the active pixels but do not have the capability to sense light energy. The first dummy pixel is read at the time the active pixels in a row are reset and stores a signal in a first dummy register related to the voltage level of the power supply at the time the active pixels are reset. The second dummy pixel is read at the time the active pixels in the row are read and stores a signal in a second dummy register related to the voltage level of the power supply at the time the active pixels are read. The signals in the first storage register and second storage register can then be used to correct the signals from the active pixels in the row for the effect of noise caused by power supply voltage level fluctuations.