Patents by Inventor Tang-An Liu

Tang-An Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210369712
    Abstract: A method for preventing and/or treating fibrosis associated with a reproductive tract or digestive tract disease or disorder includes administering an effective amount of a multikinase inhibitor to an animal or human in need thereof. The multikinase inhibitor comprises axitinib, nintedanib, sunitinib, lenvatinib, regorafenib, ponatinib, pazopanib, riociguat, or a salt thereof. The reproductive tract or digestive tract disease or disorder comprises uterine fibroids or primary sclerosing cholangitis, including Intra uterine surgery, intra uterine synechiae, Asherman's syndrome, biliary duct fibrosis, biliary duct sclerosis, and primary biliary cirrhosis.
    Type: Application
    Filed: August 13, 2018
    Publication date: December 2, 2021
    Inventors: Diane Dan-Shya Tang-Liu, Tiffany Constance Liu, Gerald Woodrow DeVries
  • Publication number: 20210360829
    Abstract: A containerized data system, including a container body, a first cabinet array, a second cabinet array and a plurality of first air-conditioning devices. The first cabinet array and the second cabinet array are positioned in the container body and spaced apart from each other. Air intake areas of the first cabinet array and the second cabinet array communicates with a cold aisle connection space of the container body. Heat dissipation areas of the first cabinet array and the second cabinet array communicates with a hot aisle connection space of the container body. Air inlets of the first air-conditioning devices are communicated with the hot aisle connection space to collect the hot air flow in the container body, and air outlets of the plurality of first air-conditioning devices are communicated with the cold aisle connection space to convey the cold air flow to the container body.
    Type: Application
    Filed: August 11, 2020
    Publication date: November 18, 2021
    Inventors: CHAO-KE WEI, TZE-CHERN MAO, YAO-TING CHANG, YEN-CHUN FU, CHING-TANG LIU, CHIH-HUNG CHANG, LI-WEN CHANG
  • Publication number: 20210330673
    Abstract: A pharmaceutical composition for prevention or treatment of a disease or disorder characterized by chronic inflammation, associated with angiogenesis and fibrosis. The pharmaceutical composition includes a multi-target inhibitor, multi-phase modulator, or multi-kinase inhibitor, such as axitinib, nintedanib, pirfenidone, riociguat, sorafenib, sunitinib, lenvatinib, regorafenib, ponatinib, or pazopanib.
    Type: Application
    Filed: August 13, 2019
    Publication date: October 28, 2021
    Inventors: Gerald Woodrow DeVries, Diane Tang-Liu
  • Publication number: 20210325578
    Abstract: An optical device includes an objective module, a prism module and an ocular module. The prism module includes a first prism, a second prism, a third prism and a first coating. The prism module is disposed between the objective module and the ocular module. A first light beam emitted by an object sequentially passes through the objective module, the prism module and the ocular module. Central axes of the objective module and the ocular module are in parallel without overlapping.
    Type: Application
    Filed: April 8, 2021
    Publication date: October 21, 2021
    Inventors: Bin Liu, Hua-Tang Liu
  • Publication number: 20210325178
    Abstract: An optical device includes an objective module, a prism module and an ocular module. The prism module includes a first prism, a second prism and a first coating. The prism module is disposed between the objective module and the ocular module. A first light beam emitted by an object sequentially passes through the objective module, the prism module and the ocular module. Central axes of the objective module and the ocular module are in parallel without overlapping.
    Type: Application
    Filed: April 8, 2021
    Publication date: October 21, 2021
    Inventors: Bin Liu, Hua-Tang Liu
  • Publication number: 20210329817
    Abstract: A heat exchange system includes a heat-absorbing substance such as Liquid Natural Gas (LNG), a heat dissipation apparatus, a water storage tank, a heat exchanger, and a heat exchanger. The heat exchanger is coupled between the LNG and the water storage tank. The heat exchanger is coupled between the heat dissipation apparatus and the water storage tank.
    Type: Application
    Filed: June 29, 2021
    Publication date: October 21, 2021
    Inventors: TZE-CHERN MAO, YEN-CHUN FU, CHIH-HUNG CHANG, CHAO-KE WEI, LI-WEN CHANG, CHING-TANG LIU, HUNG-CHOU CHAN
  • Patent number: 11153984
    Abstract: An electronic apparatus includes a first housing, a second housing, a positioning structure, a hinge structure and a positioning piece. The positioning structure includes a plate, a pole and a first snapping portion. The pole and the first snapping portion connect the plate which connects the second housing. The hinge structure includes a first connecting portion and a second connecting portion. The first connecting portion connects the first housing. The second connecting portion pivotally connects the first connecting portion. The second connecting portion includes a main body, a second snapping portion and a hole. The second snapping portion connects the main body and snaps with the first snapping portion. The hole locates at the main body for the pole to penetrate through. The positioning piece locates in the hole and abuts against the main body. The positioning piece connects the pole.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: October 19, 2021
    Assignees: Inventec (Pudong) Technology Corporation, INVENTEC CORPORATION
    Inventors: Chia-Chen Chen, Tang-An Liu, Chi-Zen Peng
  • Patent number: 11107881
    Abstract: The subject application relates to a semiconductor package device, which includes a first conductive layer; a semiconductor wall disposed on the first conductive layer; a first conductive wall disposed on the first conductive layer; and an insulation layer disposed on the first conductive layer and between the semiconductor wall and the first conductive wall.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: August 31, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Shao Hsuan Chuang, Huang-Hsien Chang, Min Lung Huang, Yu Cheng Chen, Syu-Tang Liu
  • Publication number: 20210265290
    Abstract: A semiconductor package structure includes a first substrate, a second substrate, a pad layer and a conductive bonding layer. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The second substrate is disposed side-by-side with the first substrate. The pad layer is disposed on the second surface of the first substrate and the second surface of the second substrate. The conductive bonding layer is disposed between the pad layer and the second surfaces of the first substrate and the second substrate.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 26, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Syu-Tang LIU, Huang-Hsien CHANG, Shu-Han YANG
  • Patent number: 11083109
    Abstract: A heat exchange system includes a heat-absorbing substance such as Liquid Natural Gas (LNG), a heat dissipation apparatus, a water storage tank, a heating portion, and a cooling portion. The heating portion is coupled between the LNG and the water storage tank. The cooling portion is coupled between the heat dissipation apparatus and the water storage tank. The cooling portion transfers heat of the heat dissipation apparatus to water of the water storage tank to heat the heating portion, and the heating portion transfers heat of the water of the water storage tank to the LNG.
    Type: Grant
    Filed: August 15, 2017
    Date of Patent: August 3, 2021
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Tze-Chern Mao, Yen-Chun Fu, Chih-Hung Chang, Chao-Ke Wei, Li-Wen Chang, Ching-Tang Liu, Hung-Chou Chan
  • Publication number: 20210233836
    Abstract: A substrate structure includes a wiring structure, a first bump pad, a second bump pad and a compensation structure. The wiring structure includes a plurality of redistribution layers. The first bump pad and the second bump pad are bonded to and electrically connected to the wiring structure. An amount of redistribution layers disposed under the first bump pad is greater than an amount of redistribution layers disposed under the second bump pad. The compensation structure is disposed under the second bump pad.
    Type: Application
    Filed: July 29, 2020
    Publication date: July 29, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Syu-Tang LIU, Tsung-Tang TSAI, Huang-Hsien CHANG, Ching-Ju CHEN
  • Patent number: 11022170
    Abstract: A rotating shaft mechanism includes a first connecting portion, a second connecting portion, a central shaft rotatably connected to the first connecting portion and the second connecting portion, and an adjusting unit disposed on the central shaft. The adjusting unit includes an adjusting ring disposed around the central shaft, a first washer disposed around the central shaft and configured to generate a force to the first connecting portion or the second connecting portion. A position of the adjusting ring with respect to the central shaft is axially adjustable for adjusting the force so that the first connecting portion or the second connecting portion is rotatable or fixed relative to the central shaft.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: June 1, 2021
    Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.
    Inventors: Sheng Luo, Lian Zhao, Hua-Tang Liu, Yue-Ye Chen, Ke-Yu Qiu, Jia-Jun Cao
  • Publication number: 20210151407
    Abstract: A package structure includes a wiring structure and a first electronic device. The wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The first electronic device is electrically connected to the wiring structure, and has a first surface, a second surface and at least one lateral side surface extending between the first surface and the second surface. The first electronic device includes a first active circuit region and a first protrusion portion. The first protrusion portion protrudes from the at least one lateral side surface of the first electronic device. A portion of the first active circuit region is disposed in the first protrusion portion.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 20, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Syu-Tang LIU, Min Lung HUANG, Huang-Hsien CHANG, Tsung-Tang TSAI, Ching-Ju CHEN
  • Publication number: 20210118812
    Abstract: A package structure includes a wiring structure, a first electronic device, a second electronic device and a reinforcement structure. The wiring structure includes at least one dielectric layer, and at least one circuit layer in contact with the dielectric layer. The at least one circuit layer includes at least one interconnection portion. The first electronic device and the second electronic device are electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the at least one interconnection portion of the at least one circuit layer. The reinforcement structure is disposed above the at least one interconnection portion of the at least one circuit layer.
    Type: Application
    Filed: October 17, 2019
    Publication date: April 22, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Syu-Tang LIU, Min Lung HUANG, Huang-Hsien CHANG, Tsung-Tang TSAI, Ching-Ju CHEN
  • Publication number: 20210113535
    Abstract: A pharmaceutical composition for prevention or treatment of a disease or disorder characterized by chronic inflammation, with associated angiogenesis and fibrosis, wherein the disease or disorder is selected from the group consisting of rosacea, psoriasis, erythema multiforme, bullous pemphigoid, hereditary hemorrhagic telangiectasia, rheumatoid arthritis, atopic dermatitis, and dermal wound healing. The pharmaceutical composition includes at least one multi-kinase inhibitor selected from the group consisting of axitinib, nintedanib, and lenvatinib.
    Type: Application
    Filed: December 29, 2020
    Publication date: April 22, 2021
    Inventors: Diane Tang-Liu, Gerald Woodrow DeVries
  • Publication number: 20210104595
    Abstract: A vertical capacitor structure includes a substrate, at least a pillar, a first conductive layer, a first dielectric layer and a second conductive layer. The substrate defines a cavity. The pillar is disposed in the cavity. The first conductive layer covers and is conformal to the cavity of the substrate and the pillar, and is insulated from the substrate. The first dielectric layer covers and is conformal to the first conductive layer. The second conductive layer covers and is conformal to the first dielectric layer. The first conductive layer, the first dielectric layer and the second conductive layer jointly form a capacitor component.
    Type: Application
    Filed: November 23, 2020
    Publication date: April 8, 2021
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Syu-Tang LIU, Huang-Hsien CHANG, Tsung-Tang TSAI, Hung-Jung TU
  • Publication number: 20210041671
    Abstract: An optical lens assembly includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens, all of which are arranged in order from an object side to an image side along an optical axis. The first lens comprises a convex surface facing an image side. The second lens is with positive refractive power and comprises a convex surface facing an object side. The third lens is meniscus lens with refractive power. The fourth lens is meniscus lens with refractive power. The fifth lens is with negative refractive power and comprises a concave surface facing the object side. The sixth lens is meniscus lens with refractive power. The seventh lens is meniscus lens with positive refractive power.
    Type: Application
    Filed: July 16, 2020
    Publication date: February 11, 2021
    Inventors: Fang-Li Ma, Bin Liu, Yue-Ye Chen, Hua-Tang Liu
  • Publication number: 20210029849
    Abstract: A cooling device includes a cabinet, a coolant circulation mechanism, and a heat exchange mechanism. The coolant circulation mechanism includes a first conduit, a second conduit, a control conduit, and a circulation conduit. The circulation conduit is connected to the cabinet and the heat exchange mechanism. The first conduit and the second conduit are connected to the heat exchange mechanism. The control conduit is connected to the cabinet and selectively connects to the first conduit or the second conduit. When the control conduit connects to the second conduit, coolant from the cabinet flows to the heat exchange mechanism through the second conduit. When the control conduit connects to the first conduit, coolant from the heat exchange mechanism flows to the cabinet through the first conduit. Coolant in the cabinet flows through the circulation conduit to the heat exchange mechanism when a level of the coolant reaches the circulation conduit.
    Type: Application
    Filed: September 27, 2019
    Publication date: January 28, 2021
    Inventors: CHAO-KE WEI, HUI-HSUAN WANG, CHING-TANG LIU
  • Patent number: 10870635
    Abstract: The present invention relates to compounds of Formula (I) or a stereoisomer, tautomer, or pharmaceutically acceptable salt or solvate thereof, wherein X, Y, Z, Q, W, m, u, ring (A), R2, R3, R4, R5 and R6, are as defined in the specification and claims. The present invention provides a pharmaceutical composition containing the compounds of Formula (I) and a therapeutic method of treating and/or preventing Downs syndrome, 3-amyloid angiopathy, disorders associated with cognitive impairment, Alzheimer's disease, memory loss, attention deficit symptoms associated with Alzheimer's disease, neurodegenerative diseases, pre-senile dementia, senile dementia and dementia associated with Parkinson's disease, Alzheimer's disease and/or Down syndrome, age-related macular degeneration (AMD), glaucoma, olfactory function impairment, traumatic brain injury, progressive muscle diseases, Type II diabetes mellitus and cardiovascular diseases (stroke).
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: December 22, 2020
    Assignee: ALLGENESIS BIOTHERAPEUTICS, INC.
    Inventors: Madhu Cherukury, Hsiao-Wen Lin, Shu Chieh Yu, Riping Phang, Yesudoss Christu Rajan, Diane Dan-Shya Tang-Liu, Andrew D. White, Thomas Malone, Richard Beresis
  • Patent number: 10847602
    Abstract: A vertical capacitor structure includes a substrate, at least a pillar, a first conductive layer, a first dielectric layer and a second conductive layer. The substrate defines a cavity. The pillar is disposed in the cavity. The first conductive layer covers and is conformal to the cavity of the substrate and the pillar, and is insulated from the substrate. The first dielectric layer covers and is conformal to the first conductive layer. The second conductive layer covers and is conformal to the first dielectric layer. The first conductive layer, the first dielectric layer and the second conductive layer jointly form a capacitor component.
    Type: Grant
    Filed: January 3, 2019
    Date of Patent: November 24, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Syu-Tang Liu, Huang-Hsien Chang, Tsung-Tang Tsai, Hung-Jung Tu