Abstract: A crystal growth doping apparatus and a crystal growth doping method are provided. The crystal growth doping apparatus includes a crystal growth furnace and a doping device that includes a feeding tube inserted to the furnace body along an oblique insertion direction, and a storage cover and a gate tube that are disposed in the feeding tube. The feeding tube extends from an outer surface thereof to form a placement opening, and the placement opening is recessed from an edge thereof to form an upper recessed portion and a lower recessed portion along the oblique insertion direction. The storage cover includes a storage tank and a handle. When the storage cover is disposed in the gate tube body, the gate tube body is configured to isolate an inner space of the feeding tube from the placement opening.

Abstract: A crystal growth doping apparatus and a crystal growth doping method are provided. The crystal growth doping apparatus includes a crystal growth furnace and a doping device that includes a feeding tube inserted to the furnace body along an oblique insertion direction, and a storage cover and a gate tube that are disposed in the feeding tube. The feeding tube extends from an outer surface thereof to form a placement opening, and the placement opening is recessed from an edge thereof to form an upper recessed portion and a lower recessed portion along the oblique insertion direction. The storage cover includes a storage tank and a handle. When the storage cover is disposed in the gate tube body, the gate tube body is configured to isolate an inner space of the feeding tube from the placement opening.

Abstract: An ingot jig assembly is provided, including an end surface clamping jig and an ingot positioning jig. The end surface clamping jig includes two opposite clamping parts. The ingot positioning jig is located below the end surface clamping jig and includes a first base, an adjusting base, and two rollers. The adjusting base is located between the first base and the end surface clamping jig and is movably disposed on the first base along a first axis to be close to or away from the end surface clamping jig. The two rollers are rotatably disposed on the adjusting base. An ingot edge-polishing machine tool is also provided.

Abstract: A wafer susceptor includes a main plate, a plurality of minor plates, and a plurality of plugs. The main plate has a plurality of first notches. The minor plates are respectively disposed in the first notches, and each of the minor plates has a second notch carrying a wafer and an engaging surface of inclination engaged with a side surface of the first notch. A first angle of 20 degrees to 45 degrees is included between the engaging surface of inclination and a horizontal plane. The second notch has a flat side corresponding to a flat of the wafer. An eave portion is disposed on the flat side. The plugs are respectively located between the main plate and the minor plates and are configured to fix the minor plates.