Abstract: The present invention provides a temporary bonding method comprising: providing a stack comprising: a first substrate, an adhesive layer, a second substrate, and a sacrificial layer; and applying laser energy to the sacrificial layer to facilitate separation of the first substrate from the second substrate. The sacrificial layer in this invention is soluble in alkaline aqueous solution and therefore if there is a residual sacrificial layer, it can be easily removed with an alkaline aqueous solution to avoid damaging the component.

Abstract: The present invention provides a flexible display cover substrate, which comprises a transparent polyimide film; and a device protection layer formed by curing a hard coating composition and disposed on at least one surface of the transparent polyimide film. The hard coating composition includes a hydrophobic UV-curable resin, an antistatic agent, a compound with three or more reactive functional groups, an elastic oligomer, an initiator and a modified inorganic nanoparticle. According to the present invention, a flexible display cover substrate with low haze and good bending resistance can be obtained.

Abstract: The invention provides a curable composition for inkjet, a cured product, and a flexible printed circuit board. The curable composition for inkjet includes a soluble polyimide resin, a photocurable acrylate compound, a photopolymerization initiator, and a thermosetting resin. The curable composition for inkjet has excellent flexibility, and has a withstand voltage of greater than 2 kV even when the thickness is less than 20 ?m.

Abstract: The present invention provides a polyimide film, which comprises a polyimide having a structure represented by formula (I): in which A is a residue group of an aromatic diamine containing a sulfonyl group in its main chain moiety, R1 is a residue group of an aromatic dianhydride, R2 is a residue group of an aliphatic dianhydride, m and n are each independently a positive integer, a diamine monomer constituting the polyimide is only composed of the aromatic diamine containing the sulfonyl group in its main chain moiety, and the polyimide is surface-dried at 75° C. to 155° C. in the process of forming the polyimide film. The polyimide film of the present invention has transparency and UV absorption properties.

Abstract: A flexible display cover substrate is provided, including a transparent polyimide film and a device protective layer. The device protective layer is formed by a hard coating layer disposed on at least one side of the transparent polyimide film, and the hard coating layer is composed of three or more reactive functional group compounds, an initiator, an elastic oligomer, a nano inorganic modified particle, and a fluorescent pigment. The flexible display cover substrate of the invention, after being folded by a radius of curvature of 1 mm, does not cause cracks on the surface of the hard coating layer or break the substrate, and the yellow index YI of the flexible display cover substrate is less than 2.0.

Abstract: The present invention provides a laminate with good adhesion, which includes a transparent substrate, an adhesive layer formed by an adhesive composition, and a metal layer. The adhesive composition contains a resin, an adhesion promoter selected from a triazole compound represented by formula (1), a thiadiazole compound represented by formula (2), a benzotriazole compound represented by formula (3) or a phosphate oligomer; and an antioxidant, in which R1˜R5 are as defined herein.

Abstract: The present invention provides a polyamide-imide copolymer, which is obtained by copolymerizing an aromatic diamine monomer, a dianhydride monomer and an aromatic dicarbonyl monomer, wherein the aromatic diamine monomer comprises a diamine containing an amide group (—CONH2) represented by formula (1), and Q1, X1, X2, R1, R2, Y1, Y2 and m are as defined herein:

Abstract: A polyimide film and a flexible display device cover substrate using the same are provided, and the polyimide film includes a polyimide and a blue infrared absorbing agent. The blue infrared absorbing agent includes cesium tungsten oxide, tungsten oxide, Prussian blue, or antimony tin oxide. The blue infrared absorbing agent has infrared absorbing and photothermal conversion effects, and the surface temperature of the polyimide resin may be increased by infrared irradiation, so as to shorten the baking time.

Abstract: The present invention provides a photosensitive resin composition comprising (a) a polyamide ester represented by formula (1); (b) a polyimide; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide in which A, B, R1, R2, and m have the meaning as defined herein.

Abstract: A polyimide film and a flexible display device cover substrate using the same are provided, and the polyimide film includes a polyimide and a blue infrared absorbing agent. The blue infrared absorbing agent includes cesium tungsten oxide, tungsten oxide, Prussian blue, or antimony tin oxide. The blue infrared absorbing agent has infrared absorbing and photothermal conversion effects, and the surface temperature of the polyimide resin may be increased by infrared irradiation, so as to shorten the baking time.

Abstract: A flexible display cover substrate is provided, including a transparent polyimide film and a device protective layer. The device protective layer is formed by a hard coating layer disposed on at least one side of the transparent polyimide film, and the hard coating layer is composed of three or more reactive functional group compounds, an initiator, an elastic oligomer, a nano inorganic modified particle, and a fluorescent pigment. The flexible display cover substrate of the invention, after being folded by a radius of curvature of 1 mm, does not cause cracks on the surface of the hard coating layer or break the substrate, and the yellow index YI of the flexible display cover substrate is less than 2.0.

Abstract: The present invention relates to an adhesive composition, which comprises an epoxy resin; and a polyimide comprising a repeating unit. The repeating unit comprises a first repeating unit represented by formula (1) and a second repeating unit represented by formula (2): wherein X1, Y, Z, m, and n are as defined herein, the weight ratio of polyimide to the total amount of the epoxy resin is 50% to 100%, and in the epoxy resin, the proportion of the epoxy resin having a weight average molecular weight of less than 400 Da accounts for 12 to 40% by weight of the total amount of the epoxy resin. The adhesive formed by the adhesive composition of the present invention has a relatively high glass transition temperature.

Abstract: The present invention provides a photosensitive polyimide resin composition, which comprises (a) a photosensitive polyimide represented by formula (1); (b) a filler selected from one or more of alumina, graphene, inorganic clay, silica, and zinc oxide and having a particle diameter ranging from 10 nm to 1.0 ?m; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide; wherein X is derived from a tetracarboxylic dianhydride, Y is derived from a diamine, and m is a positive integer from 1 to 5000.

Abstract: The present invention provides a photosensitive polyimide resin composition, which comprises (a) a photosensitive polyimide represented by formula (1); (b) titanium dioxide having a particle size of 0.2 ?m to 10 ?m; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide; wherein X is derived from a tetracarboxylic dianhydride, Y is derived from a diamine, and m is a positive integer from 1 to 5000.

Abstract: A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 ?m.

Abstract: A photosensitive and via-forming circuit board comprising a laminate unit, a conductor unit, and a cover layer unit is provided. The laminate unit includes an insulating layer, a first conductive wiring layer and a second conductive wiring layer formed at two opposite sides of the insulating layer, respectively, and at least one through-hole surface defining a through hole extending from the upper surface of the first conductive wiring layer through the insulating layer to the lower surface of the second conductive wiring layer. The conductor unit is formed on the at least one through-hole surface. The cover layer unit is formed from a photosensitive composition comprising an epoxy group-containing compound and a photosensitive polyimide capable of reacting with the epoxy group of the epoxy group-containing compound, and includes a first cover layer formed on the first conductive wiring layer and extending into and filling the through hole.

Abstract: The present invention provides a thinned flexible polyimide substrate and a method for manufacturing the same. The thinned flexible polyimide substrate comprises a polyimide resin, a conductor layer, and a polyimide insulating layer. The polyimide resin has a linear thermal expansion coefficient of less than 40 ppm/K. The conductor layer is formed of a plurality of stacked metal nanoparticles having pores therebetween, and each of the pores has a size between 0.1 ?m and 1 ?m. A portion of the polyimide resin fills into the pores. The polyimide insulating layer is formed of the polyimide resin coated on the conductor layer.

Abstract: A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1): wherein m, n are independently 1 to 600; X is a tetravalent organic group, and the main chain of X includes alicyclic structure; Y is a divalent organic group, and the main chain of Y includes siloxane structure; Z is a divalent organic group, and the side chain of Z includes phenolic hydroxyl group or carboxyl group. The photosensitive polyimide has an amount of weight accounting for 30-90% of total solid weight of the photosensitive polyimide resin composition.

Abstract: A transparent and colorless polyimide resin is provided. The polyimide resin is derived from at least two dianhydride monomers and at least two diamine monomers. At least one monomer in the dianhydride and diamine monomers includes structure of formula (1). The monomer with structure of formula (1) has an amount of moles accounting for 10-50% of total moles of the dianhydride or diamine monomers. In formula (1), X is SO2,C(CH3)2 or C(CF3)2, Y is oxygen.

Abstract: The present invention relates to an adhesive composition, which comprises an epoxy resin; and a polyimide comprising a repeating unit. The repeating unit comprises a first repeating unit represented by formula (1) and a second repeating unit represented by formula (2): wherein X1, Y, Z, m, and n are as defined herein, the weight ratio of polyimide to the total amount of the epoxy resin is 50% to 100%, and in the epoxy resin, the proportion of the epoxy resin having a weight average molecular weight of less than 400 Da accounts for 12 to 40% by weight of the total amount of the epoxy resin. The adhesive formed by the adhesive composition of the present invention has a relatively high glass transition temperature.