Patents by Inventor Tang Hiang

Tang Hiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Prediction of ESL/ILD remaining thickness
    Publication number: 20070196935
    Abstract: A method for determining a remaining thickness of a dielectric layer at the bottom of an opening in an integrated circuit is provided. The method includes providing a substrate, forming a dielectric layer over the substrate, forming an opening in the dielectric layer, grounding the substrate, scanning the substrate using a scanning electron microscope to produce a voltage contrast (VC) image, determining a gray level of the opening in the VC image, and using the gray level to determine a remaining thickness of the dielectric layer at the bottom of the opening.
    Type: Application
    Filed: April 26, 2006
    Publication date: August 23, 2007
    Inventors: Tang Hiang, Ming-Ta Lei, Yung-Chih Wang, Chia Huang
  • Predictions of leakage modes in integrated circuits
    Publication number: 20070196934
    Abstract: A method for determining leakage currents in integrated circuits is provided. The method includes providing a substrate comprising a target structure having a first region and a second region, grounding the second region, scanning the substrate using a scanning electron microscope to produce a voltage contrast (VC) image, determining a gray level of the first region in the VC image, and using the gray level to determine a leakage current between the first region and the second region.
    Type: Application
    Filed: April 17, 2006
    Publication date: August 23, 2007
    Inventors: Tang Hiang, Ming-Ta Lei