Patents by Inventor Tang-Jung Wu

Tang-Jung Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for packaging light-emitting diode
    Patent number: 7871835
    Abstract: Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: January 18, 2011
    Assignees: Industrial Technology Research Institute, Topco Technologies Corp.
    Inventors: Shu-Ling Yeh, Ya-Lan Chuang, Pei-Jung Tsai, Chih-Hsiang Lin, Hsin-Ching Kao, Feng-Chih Chang, Tang-Jung Wu
  • METHOD FOR PACKAGING LIGHT-EMITTING DIODE
    Publication number: 20100047936
    Abstract: Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
    Type: Application
    Filed: April 3, 2009
    Publication date: February 25, 2010
    Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Topco Technologies Corp.
    Inventors: Shu-Ling YEH, Ya-Lan CHUANG, Pei-Jung TSAI, Chih-Hsiang LIN, Hsin-Ching KAO, Feng-Chih CHANG, Tang-Jung WU