Patents by Inventor Tang-Wei Huang

Tang-Wei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240014105
    Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes at least one substrate and an interconnection structure. The at least one substrate has a cavity partially defined by an inner sidewall of the at least one substrate and a channel disposed at a bottom of the at least one substrate. The channel laterally penetrates through the at least one substrate. The interconnections structure is disposed over the substrate, and the interconnection structure has a through hole penetrating through the interconnection structure. The through hole, the cavity and the channel are in spatial communication with each other.
    Type: Application
    Filed: September 22, 2023
    Publication date: January 11, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Sheng Lin, Cheng-Lung Yang, Chin-Yu Ku, Ming-Da Cheng, Wen-Hsiung Lu, Tang-Wei Huang, Fu Wei Liu
  • Patent number: 11769716
    Abstract: A semiconductor device and method of forming the same are provided. The semiconductor device includes at least one substrate and an interconnection structure. The at least one substrate has a cavity partially defined by an inner sidewall of the at least one substrate and a channel disposed at a bottom of the at least one substrate. The channel laterally penetrates through the at least one substrate. The interconnections structure is disposed over the substrate, and the interconnection structure has a through hole penetrating through the interconnection structure. The through hole, the cavity and the channel are in spatial communication with each other.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: September 26, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Sheng Lin, Cheng-Lung Yang, Chin-Yu Ku, Ming-Da Cheng, Wen-Hsiung Lu, Tang-Wei Huang, Fu Wei Liu
  • Publication number: 20220310492
    Abstract: A semiconductor device and method of forming the same are provided. The semiconductor device includes at least one substrate and an interconnection structure. The at least one substrate has a cavity partially defined by an inner sidewall of the at least one substrate and a channel disposed at a bottom of the at least one substrate. The channel laterally penetrates through the at least one substrate. The interconnections structure is disposed over the substrate, and the interconnection structure has a through hole penetrating through the interconnection structure. The through hole, the cavity and the channel are in spatial communication with each other.
    Type: Application
    Filed: March 25, 2021
    Publication date: September 29, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yung-Sheng Lin, Cheng-Lung Yang, Chin-Yu Ku, Ming-Da Cheng, Wen-Hsiung Lu, Tang-Wei Huang, Fu Wei Liu
  • Patent number: 8429166
    Abstract: A density-based data clustering method executed by a computer system is disclosed. The method includes a setup step, a clustering step, an expansion step and a termination step. The setup step sets a radius and a threshold value. The clustering step defines a single cluster on a plurality of data points of a data set, and provides and adds a plurality of first boundary marks to a seed list as seeds. The expansion step expands the cluster from each seed of the seed list, and provides and adds at least one second boundary mark to the seed list as seeds. The termination step determines whether each of the data points is clustered, wherein the clustering step is re-performed if the determination is negative.
    Type: Grant
    Filed: May 2, 2012
    Date of Patent: April 23, 2013
    Assignee: National Pingtung University of Science & Technology
    Inventors: Cheng-Fa Tsai, Tang-Wei Huang
  • Publication number: 20120296905
    Abstract: A density-based data clustering method executed by a computer system is disclosed. The method includes a setup step, a clustering step, an expansion step and a termination step. The setup step sets a radius and a threshold value. The clustering step defines a single cluster on a plurality of data points of a data set, and provides and adds a plurality of first boundary marks to a seed list as seeds. The expansion step expands the cluster from each seed of the seed list, and provides and adds at least one second boundary mark to the seed list as seeds. The termination step determines whether each of the data points is clustered, wherein the clustering step is re-performed if the determination is negative.
    Type: Application
    Filed: May 2, 2012
    Publication date: November 22, 2012
    Inventors: Cheng-Fa TSAI, Tang-Wei Huang