Patents by Inventor Tang-Yi Lin

Tang-Yi Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240122078
    Abstract: A semiconductor memory device includes a substrate having a conductor region thereon, an interlayer dielectric layer on the substrate, and a conductive via electrically connected to the conductor region. The conductive via has a lower portion embedded in the interlayer dielectric layer and an upper portion protruding from a top surface of the interlayer dielectric layer. The upper portion has a rounded top surface. A storage structure conformally covers the rounded top surface.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Chang Hsu, Tang-Chun Weng, Cheng-Yi Lin, Yung-Shen Chen, Chia-Hung Lin
  • Publication number: 20060285622
    Abstract: The present invention processes a non-destructive examination on a spent-fuel storage rack by neutron rays to identify the existence and the depletion of a boron plate in the rack as utilizing an examination apparatus coordinated with a nuclear module system and a speed-controllable crane.
    Type: Application
    Filed: June 15, 2005
    Publication date: December 21, 2006
    Inventors: Cheng-si Tsao, Kang-Neng Perng, Tang-Yi Lin, Ming-Tsung Hsieh, Ming-Chen Yung, Kang-Lin Hwang, Hsin-Fa Fang, Shih-Chung Cheng, Kin-Fu Lin