Abstract: The present invention relates to a SCR catalytic article, comprising —a substrate and —a copper-containing small pore zeolite, having a crystal structure characterized by a decrease of unit cell volume upon sulfurization and desulfurization of less than ?3 as determined by an X-ray powder diffraction, wherein the sulfurization and desulfurization are carried out in accordance with the processes as described in the specification, and to an exhaust treatment system comprising the same. The present invention also relates to a method for determining whether a metal-promoted small pore zeolite is resistant to irreversible sulfur poisoning and a method for evaluating whether a metal-promoted small pore zeolite is qualified for resistance to irreversible sulfur poisoning.

Abstract: An optical device and the prism module thereof are provided. The prism module includes a first prism, a second prism, and a third prism. The second prism is disposed beside the first prism. The third prism is adhered to the second prism. First light enters the first prism, is reflected plural times in the first prism, enters the second prism, and is emitted from the second prism. Second light enters the second prism, is reflected plural times in the second prism, and is emitted from the second prism. Third light sequentially passes through the third prism and the second prism, enters the first prism, is reflected plural times in the first prism, and is emitted from the first prism.

Abstract: The present invention provides a method for treating a used particulate filter, comprising: removing particulates from the particulate filter; and introducing simulated ash into inlet channels of the particulate filter after removing the particulates.

Abstract: A self-calibration apparatus and method for a real-time temperature measurement system of a MOCVD device belong to the technical field of semiconductor manufacturing. The apparatus comprises a MOCVD reactor chamber (1) and an optical detector (6). The MOCVD reactor chamber (1) comprises an epitaxial wafer (4). A detection window (5) is provided on the top of the MOCVD reactor chamber (1). The optical detector (6) emits detection light beams whose wavelengths are respectively ?1 and ?2 toward the epitaxial wafer (4) through the detection window (5). The detection light beams are reflected by the epitaxial wafer (4) to form reflected light beams which are detected by the optical detector (6). In the method, points corresponding to the actual thermal radiation ratios are depicted on the theoretical thermal radiation ratio-temperature curve according to actual thermal radiation ratios, and values of the temperatures T corresponding to the points are substituted into formulas to obtain m1 and m2 respectively.

Abstract: A device for detecting a two-dimensional morphology of a wafer substrate in real time. The device comprises: a first calculation module, a second calculation module and an analysis module, wherein the first calculation module calculates the curvature CX between any two points of incidence on the wafer substrate in an X direction of a substrate to be detected according to position signals of N light spots; the second calculation module calculates the curvature CY at any one point of incidence on the wafer substrate in a moving direction, i.e. a Y direction, of the substrate to be detected according to the position signals of N light spots. The device can be adapted to a sapphire substrate on a graphite disc which rotates at a high speed.

Abstract: A self-calibration apparatus and method for a real-time temperature measurement system of a MOCVD device belong to the technical field of semiconductor manufacturing. The apparatus comprises a MOCVD reactor chamber (1) and an optical detector (6). The MOCVD reactor chamber (1) comprises an epitaxial wafer (4). A detection window (5) is provided on the top of the MOCVD reactor chamber (1). The optical detector (6) emits detection light beams whose wavelengths are respectively ?1 and ?2 toward the epitaxial wafer (4) through the detection window (5). The detection light beams are reflected by the epitaxial wafer (4) to form reflected light beams which are detected by the optical detector (6). In the method, points corresponding to the actual thermal radiation ratios are depicted on the theoretical thermal radiation ratio-temperature curve according to actual thermal radiation ratios, and values of the temperatures T corresponding to the points are substituted into formulas to obtain m1 and m2 respectively.

Abstract: Disclosed is an apparatus for automatically and quickly detecting a two-dimensional morphology of a wafer substrate in real time. The apparatus may comprise: a first calculation module, a second calculation module and an analysis module, wherein the first calculation module calculates a curvature CX between any two points of incidence on the wafer substrate in an X direction of a substrate to be detected according to position signals of N light spots; the second calculation module calculates a curvature CY of any point of incidence on the wafer substrate in a moving direction, i.e., a Y direction of the substrate to be detected according to the position signals of the N light spots, wherein N is a natural number of 3 or more, and the N light spots are formed by N laser beams which are incident on the wafer substrate in a radial direction, i.e.

Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a clasping portion, an elastic member placed and a first gasket. The clasping portion includes a fixing part, an operating part, and a connecting part connected to the fixing part and the operating part. The connecting part defines a slip groove. The first gasket interferingly fits the slip groove of the clasping portion. The elastic member is placed around the connecting part of the clasping portion and is arranged between the operation part and the first gasket. The first gasket abuts the base after the fixing part extending through the base.

Abstract: A heat dissipation device includes a base and a fastener. The fastener includes a clasping portion, an elastic member placed and a first gasket. The clasping portion includes a fixing part, an operating part, and a connecting part connected to the fixing part and the operating part. The connecting part defines a slip groove. The first gasket interferingly fits the slip groove of the clasping portion. The elastic member is placed around the connecting part of the clasping portion and is arranged between the operation part and the first gasket. The first gasket abuts the base after the fixing part extending through the base.

Abstract: An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.

Abstract: A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: Provided is an inorganic/organic composite porous separator including a porous substrate having pores and an active layer formed on the porous substrate. The active layer contains mixture of binder and inorganic particles. The inorganic/organic composite porous separator of the present invention has desirable anti-oxidation performance, and can prevent the separator from being oxidized in the lithium secondary battery using high voltage anode material. Also provided is a method for manufacturing the inorganic/organic composite porous separator and an electrochemical device using the same.

Abstract: A heat dissipation device with guiding line and soldered heat pipe includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: An exemplary method of manufacturing a heat dissipation device includes, firstly, providing a heat pipe including a condenser section having a planar outer surface, and providing a heat sink including a supporting surface defining a guiding line. The guiding line has a width smaller than a width of the outer surface of the condenser section. Next, an amount solder is spread on the supporting surface along the guiding line to form a solder layer on the supporting surface. The solder layer has a size not larger than a size of the outer surface of the condenser section. Then the outer surface of condenser section of the heat pipe is attached to the solder layer on the supporting surface of the heat sink.

Abstract: An integrated light guide plate having axial directional luminance distribution has a substrate. The substrate has a light incident plane, a light emission plane and a bottom surface opposite to the light emission surface. The light incident plane has a plurality of V-cuts formed thereon to serve as prisms. The included angle of the V-cuts is between 85° and 105°. A plurality of pyramidal recesses is formed on the bottom surface of the substrate. Given the formation of the V-cuts and the pyramidal recesses, the integrated light guide plate of the present invention provides an enhanced axial luminous intensity without requiring additional diffuser sheets and prism sheets. Accordingly, the integrated light guide plate has a good directional axial luminance.

Abstract: A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.

Abstract: An integrated light guide plate having axial directional luminance distribution has a substrate. The substrate has a light incident plane, a light emission plane and a bottom surface opposite to the light emission surface. The light incident plane has a plurality of V-cuts formed thereon to serve as prisms. The included angle of the V-cuts is between 85° and 105°. A plurality of pyramidal recesses is formed on the bottom surface of the substrate. Given the formation of the V-cuts and the pyramidal recesses, the integrated light guide plate of the present invention provides an enhanced axial luminous intensity without requiring additional diffuser sheets and prism sheets. Accordingly, the integrated light guide plate has a good directional axial luminance.

Abstract: A fan includes a base and an impeller rotatably mounted on the base. The base protrudes a tube outwardly therefrom. The tube defines a receiving hole therein for receiving a bearing. The bearing defines a bearing hole therein. The impeller protrudes a shaft therefrom towards the base. The shaft is rotatably received in the bearing hole. The fan further includes a gasket located at a bottom of the bearing and clipped on a free end of the shaft. The gasket includes a first surface and an opposite second surface. The first surface is a smooth surface and facing directly the bottom surface of the bearing. The second surface is a rough surface relative to the first surface. At least one of the first surface and the second surface is provided with a mark to differentiate the rough second surface from the smooth first surface.

Abstract: A heat dissipation device includes a heat pipe and a heat sink. The heat pipe includes a condenser section and an evaporator section. The condenser section has a planar outer surface. The heat sink includes a supporting surface for contacting the outer surface of the condenser section. A guiding line is defined in the supporting surface for spreading a solder therealong. The guiding line has a width smaller than a width of the outer surface of the condenser section. The condenser section of the heat pipe is mounted on the supporting surface of the heat sink along the guiding line and firmly connected to the heat sink by the solder.