Abstract: Embodiments of the disclosure provide a cooling system, including: a cooling source configured to provide a cooling liquid; an air cooling portion configured to cool an electronic device with a gas, wherein the air cooling portion includes a first liquid inlet and a first liquid outlet, and the first liquid inlet is connected to the cooling source via a first pipeline to receive the cooling liquid from the cooling source; and a liquid cooling portion configured to cool the electronic device with a liquid, wherein the liquid cooling portion includes a second liquid inlet and a second liquid outlet, the second liquid inlet is connected to the first liquid outlet via a second pipeline to receive the cooling liquid from the air cooling portion, and the second liquid outlet is connected to the cooling source via a third pipeline to return the cooling liquid to the cooling source for cooling.

Abstract: A system and a method for cooling a data center, and a computer room are provided, where the system has a first channel and a second channel and the system includes: a stacking structure located between the first channel and the second channel, the stacking structure includes at least one electronic device and at least one surface cooler stacked with each other, each electronic device has a first air inlet and a first air outlet, each surface cooler has a second air inlet and a second air outlet, the first air outlet and the second air inlet are both oriented towards one side of the first channel, and the first air inlet and the second air outlet are both oriented towards one side of the second channel.

Abstract: Embodiments of the disclosure provide a cooling system including an air cooling part including a first cooler and a first circulation pipeline, the first cooler being configured to cool a coolant inside it with an external liquid, and the first circulation pipeline including a first liquid outlet pipe and a first liquid return pipe; a liquid cooling part including a second cooler and a second circulation pipeline, the second cooler being configured to cool a coolant inside it with an external gas, and the second circulation pipeline including a second liquid outlet pipe and a second liquid return pipe; and a guide assembly connected between the first circulation pipeline and the second circulation pipeline.

Abstract: A heat dissipation system and method for a data center are provided. The heat dissipation system includes a first heat exchanger, a second heat exchanger, a third heat exchanger, and a first controller. The first heat exchanger and the second heat exchanger form a first cooling circuit with a cooling medium outlet and a cooling medium inlet of the data center, and the second heat exchanger and the third heat exchanger form a second cooling circuit. The third heat exchanger is connected to a heat recovery system. The first controller is connected to the first heat exchanger and the second heat exchanger, and is configured to control a heat exchange ratio of the first heat exchanger to the second heat exchanger.

Abstract: The disclosure relates to a data center, including: an IT equipment container provided with a server rack therein, an air-cooling equipment container, the IT equipment container having IT coolant inlet and outlet ports, and IT air inlet and outlet ports, the IT equipment container being prefabricated with a coolant inlet pipe connecting the IT coolant inlet port to a coolant inlet of a server rack, a coolant outlet pipe connecting the IT coolant outlet port to a coolant outlet of the server rack, and an air duct connecting the IT air outlet port to an air outlet of the server rack, and the IT air inlet port being in communication with interior of the IT equipment container; and having air-cooling air inlet and outlet ports, the air-cooling air inlet port and outlet ports being docked with the IT air outlet port and the IT air inlet port, respectively.

Abstract: The disclosure relates to a data center cooling system including a cooling tower, an air cooling unit, a liquid cooling unit and a cabinet, the air cooling unit including a first heat exchanger, a fan and an air returning channel, the liquid cooling unit including a second heat exchanger, the cabinet including a server. A coolant outlet of the cooling tower is connected to a coolant inlet of the first heat exchanger and a first coolant inlet of the second heat exchanger, a coolant outlet of the first heat exchanger and a first coolant outlet of the second heat exchanger are connected to a coolant inlet of the cooling tower, a second coolant outlet of the second heat exchanger is connected to a coolant inlet of the server, and a coolant outlet of the server is connected to a second coolant inlet of the second heat exchanger.

Abstract: A liquid-cooled server chassis includes: a case; one or more liquid-cooling modules, each liquid-cooling module including a housing, a gas outlet valve, and a liquid return valve, wherein the gas outlet valve and the liquid return valve are opened during operation of the liquid-cooling module, and the liquid-cooling module accommodates a single server and is filled with coolant during operation; a connector configured to connect the liquid-cooling module to a power source; and a circulation portion including an gas outlet pipe, a liquid return pipe, a vapor processing part, and a liquid collecting part.

Abstract: An objective of the present disclosure is to provide a cooling system for a data center. The system includes: a cabinet hot aisle, disposed above a cabinet; a hot airflow passage, disposed at a top of the data center, a ventilating fan being disposed between the hot airflow passage and the cabinet hot aisle; an exterior wall heat exchanging structure, disposed on an exterior wall of the hot airflow passage, a surface of the exterior wall heat exchanging structure adopting a turbulent airflow heat exchanging structure; and a cold airflow passage, communicated with the cabinet, a natural cold air supply damper being disposed between the cold airflow passage and the hot airflow passage.

Abstract: A liquid-cooled server chassis includes: a case; one or more liquid-cooling modules, each liquid-cooling module including a housing, a gas outlet valve, and a liquid return valve, wherein the gas outlet valve and the liquid return valve are opened in an operation of the liquid-cooling module, and the liquid-cooling module accommodates a single server and is filled with coolant during operation; a connector configured to connect the liquid-cooling module to a power source; and a circulation portion including an gas outlet pipe, a liquid return pipe, a vapor processing part, and a liquid collecting part. The server can be taken out separately for maintenance or replacement without affecting the operation of other servers. In addition, a condenser is disposed outside the liquid-cooling module so that the coolant cannot contaminate the server and the reliability of the chassis is improved.

Abstract: An objective of the present disclosure is to provide a cooling system for a data center. The system includes: a cabinet hot aisle, disposed above a cabinet; a hot airflow passage, disposed at a top of the data center, a ventilating fan being disposed between the hot airflow passage and the cabinet hot aisle; an exterior wall heat exchanging structure, disposed on an exterior wall of the hot airflow passage, a surface of the exterior wall heat exchanging structure adopting a turbulent airflow heat exchanging structure; and a cold airflow passage, communicated with the cabinet, a natural cold air supply damper being disposed between the cold airflow passage and the hot airflow passage.