Patents by Inventor Tangyii SIM

Tangyii SIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductor substrate, wiring substrate and method for producing wiring substrate
    Patent number: 11259409
    Abstract: Disclosed is a wiring substrate 1 including a stretchable resin layer 3 and a conductor foil or conductor plating film 5 which is provided on the stretchable resin layer 3 and forms a wiring pattern.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: February 22, 2022
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Takeshi Masaki, Tangyii Sim, Kumpei Yamada, Tadahiro Ogawa, Takashi Kawamori
  • Stretchable member with metal foil
    Patent number: 10880997
    Abstract: Disclosed is a stretchable member with a metal foil including a stretchable resin base material, and a conductive metal foil provided on the stretchable resin base material. A surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 ?m to 3 ?m.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: December 29, 2020
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Tangyii Sim, Kumpei Yamada, Takashi Kawamori, Takeshi Masaki
  • STRETCHABLE MEMBER WITH METAL FOIL
    Publication number: 20200154563
    Abstract: Disclosed is a stretchable member with a metal foil including a stretchable resin base material, and a conductive metal foil provided on the stretchable resin base material. A surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 ?m to 3 ?m.
    Type: Application
    Filed: December 21, 2017
    Publication date: May 14, 2020
    Inventors: Tangyii SIM, Kumpei YAMADA, Takashi KAWAMORI, Takeshi MASAKI
  • CONDUCTOR SUBSTRATE, WIRING SUBSTRATE AND METHOD FOR PRODUCING WIRING SUBSTRATE
    Publication number: 20190320527
    Abstract: Disclosed is a wiring substrate 1 including a stretchable resin layer 3 and a conductor foil or conductor plating film 5 which is provided on the stretchable resin layer 3 and forms a wiring pattern.
    Type: Application
    Filed: November 14, 2017
    Publication date: October 17, 2019
    Inventors: Takeshi MASAKI, Tangyii SIM, Kumpei YAMADA, Tadahiro OGAWA, Takashi KAWAMORI