Patents by Inventor Tani Shinichi

Tani Shinichi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive lamination useful in making circuit board structures
    Patent number: 6475314
    Abstract: An adhesive lamination has patches of an adhesive layer which correspond to predetermined positions on a plurality of circuit boards, and the adhesive layer is applied across the plurality of circuit boards. This adhesive lamination is composed of a first separation sheet, a second separation sheet and the adhesive layer interposed between the first and second separation sheets. A number of patches of the adhesive layer are formed on the first separation sheet and arranged so that the length of the patch of the adhesive layer is approximately parallel to the short side of the first separation sheet.
    Type: Grant
    Filed: October 31, 1996
    Date of Patent: November 5, 2002
    Assignee: Sharp Kabushiki Kaisha
    Inventors: Shirai Yoshihiro, Tani Shinichi