Abstract: A die-to-wafer stacking method includes: providing a wafer to be processed, including a substrate, a dielectric layer on the substrate and a metal layer embedded in the dielectric layer; forming a bonding layer covering the dielectric layer; picking up dies to be bonded from the wafer to be processed and arranging the dies to be bonded on an electrostatic chuck; and bonding the dies arranged on the electrostatic chuck, as a whole, to a wafer to be bonded. Pre-arranging all the dies to be bonded on the electrostatic chuck and then bonding the dies on the electrostatic chuck, as a whole, to the wafer to be bonded can greatly shorten post-activation waiting times of dies before they are bonded to the wafer and thus reduce the risk of loss of activation.