Patents by Inventor Tanner Schulz

Tanner Schulz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays
    Patent number: 11639556
    Abstract: A micronozzle assembly, comprising a reservoir, an array of structures comprising micronozzles, a porous structure positioned between the reservoir and the array, and an electrode within the reservoir, wherein the electrode comprises any of a mesh, a frame along the perimeter of the cavity of the reservoir, or a rod extending into a cavity of the reservoir.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: May 2, 2023
    Assignee: Intel Corporation
    Inventors: Joe Walczyk, Pooya Tadayon, Andrew Hoitink, Tanner Schulz
  • MASSIVELY-PARALLEL MICRONOZZLE ARRAY FOR DIRECT WRITE ELECTRODEPOSITION OF HIGH-DENSITY MICROSTRUCTURE ARRAYS
    Publication number: 20190203370
    Abstract: A micronozzle assembly, comprising a reservoir, an array of structures comprising micronozzles, a porous structure positioned between the reservoir and the array, and an electrode within the reservoir, wherein the electrode comprises any of a mesh, a frame along the perimeter of the cavity of the reservoir, or a rod extending into a cavity of the reservoir.
    Type: Application
    Filed: December 28, 2017
    Publication date: July 4, 2019
    Applicant: Intel Corporation
    Inventors: Joe Walczyk, Pooya Tadayon, Andrew Hoitink, Tanner Schulz