Abstract: A microwave antenna apparatus comprises a package module comprising a semiconductor unit, an antenna unit arranged on a first side of the package module and a redistribution layer group arranged on a second side of the package module opposite the first side, and an electromagnetic band gap structure, EBG, module coupled to the redistribution layer group of the package module.

Abstract: Aspects of the present disclosure relate to methods and compositions for sugarcane transformation using morphogenic genes. In particular, the present disclosure relates to the use of morphogenic sequences that improve the efficiency of sugarcane cell or tissue transformation and genomic modification. The present disclosure further relates to genetically altered sugarcane cells, tissues, and plants produced using these methods and compositions.

Abstract: A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.

Abstract: A microwave antenna apparatus comprises a semiconductor element and an antenna element embedded into a mold layer, which is covered by a redistribution layer. The antenna element is preferably configured as SMD component so that it can be handled by a standard pick and place process. The coupling between semiconductor element and antenna element is provided either by a metal layer or aperture coupling within the redistribution layer. The microwave antenna apparatus may be coupled to a PCB arrangement thus forming an embedded wafer-level ball grid array (eWLB) or embedded micro-wafer-level-packaging (emWLP) package.

Abstract: A microwave antenna apparatus comprises a package module comprising a semiconductor unit, an antenna unit arranged on a first side of the package module and a redistribution layer group arranged on a second side of the package module opposite the first side, and an electromagnetic band gap structure, EBG, module coupled to the redistribution layer group of the package module.

Abstract: A Post-Quantum Computing Cryptographic communication protocol including a lattice based RSA algorithm, the protocol may include: generating a public key and a private key pair; encrypting a message using a public key pair; transmitting the encrypted message over a communication channel; and decrypting the encrypted message using a private key pair, wherein the generating the public key and the private key pair includes; selecting a first random vector from lattices using a Klein's Algorithm; selecting a second random vector from lattices using the Klein's Algorithm; generating a shortest random vector using a Gauss Sieve algorithm; taking a first vector product of the first random vector and the second random vector; calculating a Totient function of the first vector product; converting the Totient function to the first vector product; generating the public key pair; and generating the private key pair.

Abstract: A microwave antenna coupling apparatus forming an eWLB package, comprises an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material. Different multi-layer antenna structures can be placed on top of eWLB package. By this type of integration Package-on-Package (PoP) antenna are constructed. The elements can be integrated by a standard pick and place process.

Abstract: A microwave antenna apparatus comprises a semiconductor package module comprising a mold layer, a semiconductor element, a coupling element and a redistribution layer, and an antenna module mounted on top of the semiconductor package module, said antenna module comprising an antenna substrate, one or more antenna elements, an antenna feed layer and an antenna ground layer. The footprint of the antenna module is larger than the footprint of the semiconductor package module.

Abstract: A microwave antenna apparatus comprises a semiconductor element and an antenna element embedded into a mold layer, which is covered by a redistribution layer. The antenna element is preferably configured as SMD component so that it can be handled by a standard pick and place process. The coupling between semiconductor element and antenna element is provided either by a metal layer or aperture coupling within the redistribution layer. The microwave antenna apparatus may be coupled to a PCB arrangement thus forming an embedded wafer-level ball grid array (eWLB) or embedded micro-wafer-level-packaging (emWLP) package.

Abstract: A Post-Quantum Computing Cryptographic communication protocol including a lattice based RSA algorithm, the protocol may include: generating a public key and a private key pair; encrypting a message using a public key pair; transmitting the encrypted message over a communication channel; and decrypting the encrypted message using a private key pair, wherein the generating the public key and the private key pair includes; selecting a first random vector from lattices using a Klein's Algorithm; selecting a second random vector from lattices using the Klein's Algorithm; generating a shortest random vector using a Gauss Sieve algorithm; taking a first vector product of the first random vector and the second random vector; calculating a Totient function of the first vector product; converting the Totient function to the first vector product; generating the public key pair; and generating the private key pair.

Abstract: A microwave antenna coupling apparatus forming an eWLB package, comprises an antenna coupling element comprising a coupling unit, a coupling feed line arranged on a first surface of the coupling unit and an internal coupling component to provide signal coupling between the coupling feed line and the second surface of the coupling unit, wherein the antenna coupling element is arranged within the mold layer separate from the semiconductor element and such that an outer surface of the coupling feed line is not covered by mold material. Different multi-layer antenna structures can be placed on top of eWLB package. By this type of integration Package-on-Package (PoP) antenna are constructed.

Abstract: A grid nozzle assembly for a fluidized bed reactor that includes a horizontally extending bottom plate, a gas plenum chamber below the bottom plate, and vertical gas pipes having a top end and extending from the gas plenum chamber upwards across the bottom plate. The assembly includes a nozzle head with a gas channel that injects fluidizing gas from one of the vertical gas pipes to the reaction chamber. A tube sleeve is adapted to be fixed by welding around the top end of the vertical gas pipe. The nozzle head and the tube sleeve have a knob and groove portion that form a twist-lock enabling quick connecting and disconnecting of the nozzle head and the tube sleeve.

Abstract: A grid nozzle assembly for a fluidized bed reactor, a fluidized bed reactor with a grid nozzle assembly, a method of mounting a grid nozzle assembly as a replacement in a fluidized bed reactor, and a method of replacing a grid nozzle assembly in a fluidized bed reactor. The reactor includes a horizontally extending bottom plate, a gas plenum chamber below the bottom plate, and vertical gas pipes having a top end and extending from the gas plenum chamber upwards across the bottom plate. The nozzle assembly includes a nozzle head with a gas channel for injecting fluidizing gas from one of the vertical gas pipes to the reaction chamber and a tube sleeve adapted to be firmly fixed by welding around the top end of the vertical gas pipe. The nozzle head and the tube sleeve form a twist-lock enabling quick connecting and disconnecting.

Abstract: A cookware handle with a soft non-slip surface is formed by molding elastomeric composition around a core or elongated member that connects a flange portion and the terminal end or hanging portion of the handle. The core or elongated member has a relatively narrow cross-section to minimize heat transfer from the pot so that the gripping portion remains cool during cooking.

Abstract: A cooking vessel or pan has a two part handle that comprises a flame guard flange portion attached to the pan wall via a stud and a grip portion attached to the flame guard portion via the stud. The flame guard portion is split into an upper and lower shell, with the upper shell urged to make good thermal contact with the pan wall by the grip portion and the lower portion disposed to generally insulate the upper shell and grip portion from direct heat from the heat source used in cooking. The upper shell preferably has at least a portion covered with a thermal indicating paint.

Abstract: A cookware handle with a soft non-slip surface is formed by molding elastomeric composition around a core or elongated member that connects a flange portion and the terminal end or hanging portion of the handle. The core or elongated member has a relatively narrow cross-section to minimize heat transfer from the pot so that the gripping portion remains cool during cooking.

Abstract: A cookware handle with a soft non-slip surface is formed by molding elastomeric composition around a core or elongated member that connects a flange portion and the terminal end or hanging portion of the handle. The core or elongated member has a relatively narrow cross-section to minimize heat transfer from the pot so that the gripping portion remains cool during cooking.

Abstract: An article of cookware is assembled by the riveted attachment of a handle. Novel rivets are first attached from the interior of the cookware article via a flush hole such that the deformation of the cookware article around the rivet locks the rivet to the cookware article yet leaves the rivet head flush with the interior surface of the cookware article. The handle is subsequently attached by deforming the opposite end of the rivet.

Abstract: An article of cookware is assembled by the rivet attachment of a handle. The rivets are simultaneously attached to both the cookware vessel and the handle. The co-aligned holes for receiving the rivet in the wall of the cooking vessel and the handle flange are bevel such that exterior of the rivet is relatively flush with the interior of the cookware article and the exterior of the handle flange. Deformation of the rivet head also deforms the beveled edges of the through hole in the cookware article, locking it with the corresponding portion of the handle flange through hole.

Abstract: An article of cookware is assembled by the riveted attachment of a handle. Novel rivets are first attached from the interior of the cookware article via a flush hole such that the deformation of the cookware article around the rivet locks the rivet to the cookware article yet leaves the rivet head flush with the interior surface of the cookware article. The handle is subsequently attached by deforming the opposite end of the rivet.