Abstract: A flame-retardant composition is provided that includes at least one melamine compound, at least one metal borate, at least one alkaline metal hydroxide, and optionally hydrated alumina. The flame-retardant composition can be used in coating powder compositions that also include a resin. The flame retardant coating powder composition can be applied to a substrate, such as an electrical or electronic device, and heated to a temperature sufficient to effect crosslinking of the resin and the curing agent to provide a flame resistant coating composition.

Abstract: A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrated metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one or more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coat an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.

Abstract: Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. The molding compositions may further include a flame retardant compound such as melamine cyanurate. In a further embodiment, the molding composition may include an additional catalyst, such as 1,8-diazabicyclo[5.4.0]undec-7-ene. Integrated circuits encapsulated with such molding compositions exhibit reduced electrothermally induced parasitic gate leakage.

Abstract: A molding composition or encapsulant for an electronic component and its method of preparation provides reduced moisture uptake without undue swelling and comprises melt-blending an epoxy resin, hardener and clay, cooling, adding a catalyst to form an epoxy-clay nano-composite, and combining it with a bulk amount of a filler.

Abstract: A flame-retardant composition is provided that includes at least one melamine compound, at least one metal borate, at least one alkaline metal hydroxide, and optionally hydrated alumina. The flame-retardant composition can be used in coating powder compositions that also include a resin. The flame retardant coating powder composition can be applied to a substrate, such as an electrical or electronic device, and heated to a temperature sufficient to effect crosslinking of the resin and the curing agent to provide a flame resistant coating composition.

Abstract: A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrated metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one or more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coat an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.

Abstract: A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrate metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coast an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.

Abstract: A flame-retardant molding composition that includes an epoxy resin, melamine cyanurate, and one or more hydrated metal salts capable of liberating water when heated. The hydrated metal salt may include one or more compounds selected from metal borate salts, Group IIB oxides, and polyhydroxides of one or more elements selected from Group IIA elements and Group IIIB elements. The molding composition may be used to coat an electrical or electronic device by heating the molding composition to a temperature sufficient to cure the molding composition and form a polymer on the surface of the device. Electrical and electronic devices formed by the method are also disclosed.

Abstract: A latent catalyst particularly useful in epoxy molding compositions for use in electronic packaging materials is provided. The latent catalyst is in the form of a curative represented by a combination of an inorganic-based carrier having an activated surface and a catalyst compound including a moiety capable of accelerating curing of the epoxy resin, such as the reaction product of silica and 1,8-diazobicyclo(5.4.0)undecene-7 (DBU). The activated surface of the inorganic-based carrier includes reactive surface groups capable of bonding to the moiety through a hydrogen bond, and also includes a high surface area porous surface, such that the catalyst compound is sorbed on the activated surface. The invention further provides epoxy compositions including the curative with an epoxy resin and a curing agent for the epoxy resin, which compositions are particularly useful as molding powders for semiconductors with prolonged shelf life stability.

Abstract: Molding compositions particularly useful in coating electronic devices such as integrated circuits are disclosed. The molding compositions include an epoxy resin; a hardener for the epoxy resin, a flame retardant compound such as melamine cyanurate, and a quaternary organophosphonium salt for catalyzing a reaction between the epoxy resin and the hardener, such as ethyl triphenyl phosphonium acid acetate. The molding compositions exhibit improved flame retardancy. Also, when multifunctional epoxy resins and multifunctional phenolic hardeners such as those derived from phenol with a degree of branching of at least three are used, the molding compounds including the quaternary organophosphonium salt as a catalyst exhibit long flow and low shrinkage and warpage.

Abstract: A molding composition or encapsulant for an electronic component and its method of preparation provides reduced moisture uptake without undue swelling and comprises melt-blending an epoxy resin, hardener and clay, cooling, adding a catalyst to form an epoxy-clay nano-composite, and combining it with a bulk amount of a filler.