Abstract: An apparatus includes a crystalline substrate. A cleaving guide on the substrate is positioned over a cleave plane of the crystalline substrate and positioned in a known location with respect to a feature of an electronic device on the substrate. Cleaving of the substrate along the cleave plane changes a physical characteristic of the cleaving guide and measurement of the physical characteristic provides a parameter representative of the relative position of the cleave plane and the cleaving guide.

Abstract: An apparatus includes a crystalline substrate. A cleaving guide on the substrate is positioned over a cleave plane of the crystalline substrate and positioned in a known location with respect to a feature of an electronic device on the substrate. Cleaving of the substrate along the cleave plane changes a physical characteristic of the cleaving guide and measurement of the physical characteristic provides a parameter representative of the relative position of the cleave plane and the cleaving guide.

Abstract: An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.

Abstract: A package for an optoelectronic device includes a hermetically sealed cavity into which a mirror or other optical element is integrated. For a side-emitting laser, an integrated mirror turns the light emitted from the laser inside the cavity so that the light exits through a top surface of the package. The packaging can be implemented for individual lasers or at the wafer level. A wafer level process fabricates sub-mounts in a first wafer, fabricates depressions with reflective areas in a second wafer, electrically connects optoelectronic devices to respective sub-mounts on the first wafer, and bonds a second wafer to the first wafer with the lasers hermetically sealed in cavities corresponding to the depressions in the second wafer. The reflective areas in the depressions act as turning mirrors for side emitting lasers.

Abstract: Fiber optic connectors and methods of making the same are described. In one aspect, a fiber optic connector includes a support surface and at least one alignment pin. The support surface has at least one optical communication port. Each alignment pin has an elongated distal end and a flanged proximal end with a bottom surface that is fixedly attached to the support surface.

Abstract: Fiber optic connectors and methods of making the same are described. In one aspect, a fiber optic connector includes a support surface and at least one alignment pin. The support surface has at least one optical communication port. Each alignment pin has an elongated distal end and a flanged proximal end with a bottom surface that is fixedly attached to the support surface.

Abstract: A system is described for interconnecting a first optical component and a second optical component in which the first optical component is guided passively into precise alignment with the second optical component. The system includes a base and a guide structure. The base has a first surface exposed for contact with a front surface of the first optical component and a second surface configured to contact a front surface of the second optical component, and defines a transparent optical aperture extending from the first base surface to the second base surface and aligned with respect to the optical axis. The guide structure is supported by the base in fixed registration with respect to the optical axis and is exposed for contact with an exposed peripheral surface of the first optical component at three or more spaced apart discrete locations.

Abstract: A scheme (systems and methods) for passively aligning one or more optical devices with a corresponding number of optical lenses in an accurate and efficient manner is described. By this approach, the invention avoids the often labor-intensive and costly steps required by conventional active alignment techniques that attempt to align the optical devices to the optical fibers. In one aspect, an optoelectronic device includes an optical device system, an optical lens system and a plurality of solder bumps disposed therebetween. The optical device system includes an optical device substrate supporting one or more optical devices and a solderable metallization pattern having a spatial arrangement with respect to the one or more optical devices. The optical lens system includes one or more optical lenses and a device bonding surface supporting a solderable metallization pattern having a spatial arrangement with respect to the one or more optical lenses.

Abstract: A system is described for interconnecting a first optical component and a second optical component in which the first optical component is guided passively into precise alignment with the second optical component. The system includes a base and a guide structure. The base has a first surface exposed for contact with a front surface of the first optical component and a second surface configured to contact a front surface of the second optical component, and defines a transparent optical aperture extending from the first base surface to the second base surface and aligned with respect to the optical axis. The guide structure is supported by the base in fixed registration with respect to the optical axis and is exposed for contact with an exposed peripheral surface of the first optical component at three or more spaced apart discrete locations.

Abstract: An interpolation circuit for an optical encoder or other sensing device includes a signal generating circuit, a comparator circuit and a logic circuit. The signal generating circuit generates A, A′, B, B′, one or more fractional A or A′ and one or more fractional B or B′ ramp signals in response to input ramp signals that are one quarter cycle out of phase. The comparator circuit compares selected pairs of the A, A′, B, B′, one or more fractional A or A′ and one or more fractional B or B′ ramp signals and generates intermediate signals. The phases of the intermediate signals are preferably uniformly or nearly uniformly distributed in phase with respect to the ramp signals. The logic circuit combines the intermediate signals and provides first and second output signals, each having multiple cycles of the ramp signals. In one embodiment, the signal generating circuit generates A, A′, B, B′, A/3 or A′/3 and B/3 or B′/3 ramp signals.

Abstract: The present invention is technique for setting the codewheel gap that is quick and requires no parts beyond what is needed for encoder operation. The gapping mechanism is incorporated into the encoder cover and maintains solid contact between the base and the housing of the encoder.