Abstract: A card substrate laminating device including a transfer roller configured to heat a portion of a transfer layer of a transfer ribbon and transfer the portion of the transfer layer from a carrier layer of the transfer ribbon to a surface of a card substrate. The transfer roller includes a diameter of less than 0.537 inches and a compliant exterior surface layer or coating. The compliant exterior surface layer or coating can include silicon rubber. The compliant exterior surface layer or coating can be approximately 0.020 inches thick. An internal heating element is configured to heat the transfer roller from an ambient temperature to a laminating temperature, at which laminating operations are performed, within 40 seconds.

Abstract: A card flipper includes a frame, a receptacle, and a motor. The receptacle is supported by the frame for a rotation about a flipping axis. The receptacle is configured to support a card in a support plane and receive and discharge cards along a card feed axis. The motor is configured to drive rotation of the receptacle, the support plane and the card feed axis about the flipping axis. The flipping axis is oblique to the card feed axis and is displaced from the support plane.

Abstract: An ink jet card printer includes a card transport and a print unit. The card transport includes a first belt, a first motor configured to drive the first belt to feed a card along a processing axis, a second belt, and a second motor configured to drive the second belt to feed a card along the processing axis. The print unit includes an ink jet print head and a gantry. The ink jet print head is configured to perform a print operation simultaneously on a card supported in a print position on the first belt and on a card supported in a print position on the second belt. The gantry is configured to move the ink jet print head along a fast scan axis that is parallel to the processing axis and a slow scan axis that is perpendicular to the processing axis.

Abstract: A card stacker includes a stack support that supports a stack of card substrates, a card lift mechanism, a card feed mechanism, and a retraction mechanism. The card lift mechanism is configured to support the card substrate in a lift position below the stack support, and drive the card substrate to a raised position, in which the card substrate is supported on the stack support at the bottom of the stack. The card feed mechanism includes a first transport roller having a feed position, in which the first transport roller engages a top surface of the card substrate in the lift position, and a retracted position when the card substrate is in the raised position, in which the first transport roller is on the bottom side of the stack support. The retraction mechanism is configured to move the first transport roller between the feed and retracted positions.

Abstract: A card substrate laminating device including a transfer roller configured to heat a portion of a transfer layer of a transfer ribbon and transfer the portion of the transfer layer from a carrier layer of the transfer ribbon to a surface of a card substrate. The transfer roller includes a diameter of less than 0.537 inches and a compliant exterior surface layer or coating. The compliant exterior surface layer or coating can include silicon rubber. The compliant exterior surface layer or coating can be approximately 0.020 inches thick. An internal heating element is configured to heat the transfer roller from an ambient temperature to a laminating temperature, at which laminating operations are performed, within 40 seconds.

Abstract: In a method of operating an ink jet card printer, which includes a transport belt, a print unit including an ink jet print head, a sensor and a gantry, a card is loaded onto the transport belt along a processing axis using an exposed surface of the transport belt. The sensor and the ink jet print head are moved relative to the card using the gantry. A current position of the card is detected using the sensor. An image is printed to the card using the ink jet print head when the detected current position of the card indicates that the card is supported on the transport belt in a print position. Printing is interrupted when the detected current position of the card indicates that the card is not in the print position.

Abstract: An ink jet card printer includes an ink jet print head, a gantry, and a card feeder. The ink jet print head is configured to perform a print operation on a card supported in a print position along a processing axis. The gantry is configured to move the print head through a print zone. The card feeder includes a feeder frame, a first pinch roller pair, and a lift mechanism. The first pinch roller pair is supported by the feeder frame and is configured to feed individual cards along a card feed axis. The lift mechanism is configured to move the feeder frame and the first pinch roller pair between a lowered position, in which the card feeder is displaced from the print zone, and a raised position, in which at least a portion of the card feeder extends into the print zone.

Abstract: A card flipper includes a frame, a receptacle, and a motor. The receptacle is supported by the frame for a rotation about a flipping axis. The receptacle is configured to support a card in a support plane and receive and discharge cards along a card feed axis. The motor is configured to drive rotation of the receptacle, the support plane and the card feed axis about the flipping axis. The flipping axis is oblique to the card feed axis and is displaced from the support plane.

Abstract: In a method of operating an ink jet card printer, which includes a transport belt, a print unit including an ink jet print head, a sensor and a gantry, a card is loaded onto the transport belt along a processing axis using an exposed surface of the transport belt. The sensor and the ink jet print head are moved relative to the card using the gantry. A current position of the card is detected using the sensor. An image is printed to the card using the ink jet print head when the detected current position of the card indicates that the card is supported on the transport belt in a print position. Printing is interrupted when the detected current position of the card indicates that the card is not in the print position.

Abstract: An ink jet card printer includes an ink jet print head, a gantry, and a card feeder. The ink jet print head is configured to perform a print operation on a card supported in a print position along a processing axis. The gantry is configured to move the print head through a print zone. The card feeder includes a feeder frame, a first pinch roller pair, and a lift mechanism. The first pinch roller pair is supported by the feeder frame and is configured to feed individual cards along a card feed axis. The lift mechanism is configured to move the feeder frame and the first pinch roller pair between a lowered position, in which the card feeder is displaced from the print zone, and a raised position, in which at least a portion of the card feeder extends into the print zone.

Abstract: A card stacker includes a stack support that supports a stack of card substrates, a card lift mechanism, a card feed mechanism, and a retraction mechanism. The card lift mechanism is configured to support the card substrate in a lift position below the stack support, and drive the card substrate to a raised position, in which the card substrate is supported on the stack support at the bottom of the stack. The card feed mechanism includes a first transport roller having a feed position, in which the first transport roller engages a top surface of the card substrate in the lift position, and a retracted position when the card substrate is in the raised position, in which the first transport roller is on the bottom side of the stack support. The retraction mechanism is configured to move the first transport roller between the feed and retracted positions.

Abstract: An ink jet card printer includes a card transport and a print unit. The card transport includes a first belt, a first motor configured to drive the first belt to feed a card along a processing axis, a second belt, and a second motor configured to drive the second belt to feed a card along the processing axis. The print unit includes an ink jet print head and a gantry. The ink jet print head is configured to perform a print operation simultaneously on a card supported in a print position on the first belt and on a card supported in a print position on the second belt. The gantry is configured to move the ink jet print head along a fast scan axis that is parallel to the processing axis and a slow scan axis that is perpendicular to the processing axis.

Abstract: A card substrate laminating device includes a transfer ribbon and a transfer roller. The transfer ribbon includes a carrier layer and a transfer layer attached to the carrier layer. The transfer roller is configured to heat and transfer a portion of the transfer layer from the carrier layer to a surface of a card substrate. The transfer roller has a circumference that is less than one-half of a length of the card substrate.

Abstract: A card substrate laminating device includes a transfer ribbon and a transfer roller. The transfer ribbon includes a carrier layer and a transfer layer attached to the carrier layer. The transfer roller is configured to heat and transfer a portion of the transfer layer from the carrier layer to a surface of a card substrate. The transfer roller has a circumference that is less than one-half of a length of the card substrate.

Abstract: A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

Abstract: A package for an optoelectronic device includes a hermetically sealed cavity into which a mirror or other optical element is integrated. For a side-emitting laser, an integrated mirror turns the light emitted from the laser inside the cavity so that the light exits through a top surface of the package. The packaging can be implemented for individual lasers or at the wafer level. A wafer level process fabricates sub-mounts in a first wafer, fabricates depressions with reflective areas in a second wafer, electrically connects optoelectronic devices to respective sub-mounts on the first wafer, and bonds a second wafer to the first wafer with the lasers hermetically sealed in cavities corresponding to the depressions in the second wafer. The reflective areas in the depressions act as turning mirrors for side emitting lasers.

Abstract: An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.

Abstract: A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.