Abstract: The present invention relates to a process for gratings able to resist dizziness, enhance color displayed, eliminate static electricity and block radiation. Steps included are: making a substrate with an enhanced glass or optical plastic glass or optical plastics; coating the surface of the substrate with dizziness-resistant films composed of evenly distributed nano-particles, wherein the inner layer is made of Cu particles or Al particles and the outer layer is made of Cr particles; forming a static-electricity-resistant layer on the grating's surface so as to form an optical diffraction grating able to resist dizziness, enhance color displayed, eliminate static electricity and block radiation.

Abstract: A gold wire having a non-pure gold core member and a layer of pure gold coating covering the non-pure gold core member. The fabrication method of the gold wire includes the procedures of (1) selecting a non-pure gold wire rod, (2) gold-plating the non-pure gold wire rod with a layer of pure gold coating of thickness about 10˜100 &mgr;in, (3) drawing the pure gold-coated wire rod into a gold wire of thickness about 40˜4000 &mgr;in, (4) examining the material properties of the gold wire so as to obtained the desired finished product.

Abstract: A power generating method of generating power supply by: guiding seawater through a reaction tank having negative electrodes made of magnesium or aluminum alloy and a positive electrode made of silver chloride, cuasing the negative electrodes to produce the oxidizing reaction of Mg→Mg+2+2e− and the positive electrode to produce the reduction reaction of 2AgCl+2e−→2Ag+2Cl−.

Abstract: A novel method for fabricating leadless solder for IC packaging includes the following steps: A. to prepare a mixture containing Zn, 7-11 wt %; Co, 0.1-0.5 wt %; and Sn for balance; or a mixture containing Zn, 7-11 wt %; Co, 0.1-0.5 wt %; P, 0.005-0.05 wt % and Sn for balance; or a mixture containing Zn, 7-11 wt %; Al, 0.1-0.5 wt %; and Sn for balance; a mixture containing Zn, 7-11 wt %; Al, 0.1-0.5 wt %; P, 0.005-0.05 wt % and Sn for balance; or a mixture containing In, 10-15 wt %; Co, 0.1-0.5 wt % and Sn for balance; B. to place the mixture in a high frequency furnace to be melted together at a temperature lower than 350° C., then take it out of the furnace for a quick freezing and cast it into an ingot in an adequate size; C. to treat the ingot with a homogenization processing at 180-240° C. for 30-240 minutes; D. to draw the homogenized ingot into the form of leadless solder filament or granule.

Abstract: A soldering ball fabrication method includes the steps of: (1) drawing a metal wire rod into the desired thickness, (2) cutting the metal wire thus obtained into pieces subject to the desired length, (3) washing the pieces of metal wire to remove dust, (4) processing the pieces of metal wire into balls, (5) washing the balls thus obtained, (6) using a screen to select the balls, (7) inspecting selected balls, and (8) obtaining approved soldering balls.

Abstract: A power generating method of generating power supply by: guiding seawater through a reaction tank having negative electrodes made of magnesium or aluminum alloy and a positive electrode made of silver chloride, cuasing the negative electrodes to produce the oxidizing reaction of Mg→Mg+2+2e− and the positive electrode to produce the reduction reaction of 2AgCl+2e−→2Ag+2Cl−.

Abstract: A gold wire having a non-pure gold core member and a layer of pure gold coating covering the non-pure gold core member. The fabrication method of the gold wire includes the procedures of (1) selecting a non-pure gold wire rod, (2) gold-plating the non-pure gold wire rod with a layer of pure gold coating of thickness about 10˜100 &mgr;in, (3) drawing the pure gold-coated wire rod into a gold wire of thickness about 40˜4000 &mgr;in, (4) examining the material properties of the gold wire so as to obtained the desired finished product.

Abstract: A bio-chip substrate includes a base material selected from nylon or resin, and a layer of high purity nano microchip diamond membrane bonded to the surface of the base material for the embedding of DNA or protein. The invention relates also to the fabrication of the bio-chip substrate.

Abstract: A soldering ball fabrication method includes the steps of: (1) drawing a metal wire rod into the desired thickness, (2) cutting the metal wire thus obtained into pieces subject to the desired length, (3) washing the pieces of metal wire to remove dust, (4) processing the pieces of metal wire into balls, (5) washing the balls thus obtained, (6) using a screen to select the balls, (7) inspecting selected balls, and (8) obtaining approved soldering balls.

Abstract: A gold bonding wire fabrication method, which includes the steps of (a) drawing a non-gold wire rod, for example, a pure silver wire rod or pure palladium wire rod into a core wire of thickness within about 1 &mgr;m˜500 &mgr;m, (b) electroplating the core wire with a layer of gold plating of thickness within about 0.025 &mgr;m˜25 &mgr;m.