Abstract: In some examples, a system causes execution, in each respective storage node of a cluster of storage nodes, of a respective frontend service that provides a frontend to a client over a network for access by the client of a storage volume accessible by the cluster of storage nodes. The system obtains node-specific configuration data portions from a configuration data repository, the node-specific configuration data portions being for respective storage nodes of the cluster of storage nodes, and sends the node-specific configuration data portions to the respective frontend services for configuring the frontend services.

Abstract: A lens unit, a lens for a low-beam illumination module, a low-beam illumination module and a vehicle. The lens unit includes a rear surface and a front surface; the lens unit has a focal line, and the focal line is a straight line perpendicular to a light emitting direction of the lens unit; the rear surface and the front surface are adapted to project light rays passing through the focal line into parallel light rays, and the front surface is a free-form curved surface. The lens unit has the optical characteristics of a cylindrical lens, and is able to cause parallel incident light to be focused into a line instead of a focal point upon passing through the lens unit.

Abstract: Provided are a phosphorescent organometallic complex and a use thereof. The metal complex has a ligand with a structure represented by Formula 1 and may be used as a light-emitting material in an electroluminescent device. These novel metal complexes can not only maintain low voltage and improve device efficiency in electroluminescent devices but also greatly reduce the half-peak width of light emitted by these devices so as to greatly improve color saturation of the light emitted by these devices, thereby providing better device performance. Further provided are an electroluminescent device and a compound formulation.

Abstract: The present invention provides a Computer Supported Telecommunications Applications (CSTA) protocol-based service delivery method, which includes: obtaining a switching function service that carries voice parameters; and sending the switching function service that carries voice parameters down to the switch side. The present invention also provides a CSTA-based service execution method, a Personal Computer (PC), a switch, and a voice service system. In the present invention, when the PC sends a switching function service to the switch, voice parameters can be carried in the switching function service. In this way, when the switch obtains the switching function service with voice parameters, the switch can play voice according to the voice parameters. Therefore, the present invention enables play of voice without modifying the existing service process, thus, simplifying the implementation.

Abstract: The present invention discloses a system and method for monitoring customer service agents' performance according to the interaction with one or more customers in a call center. The system comprises a call control server, a management console, and an agent console. The management console sends the call control server a first request, carrying a predetermined tag, to initiate a monitoring session, thereby triggering the call control server to send the agent console a second request, carrying the predetermined tag, to establish the monitoring session with the management console without notifying the agent, wherein during the monitoring session the agent console forwards a copy of data streams, related to the activities of the agent and one or more customer, to the management console.

Abstract: An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.