Patents by Inventor Tao Sang Park

Tao Sang Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20080157326
    Abstract: An IC package including a plurality of BGA IC packages stacked on a printed circuit board and a method of manufacturing the same. The IC package includes a printed circuit board, a first BGA IC package, having a plurality of first solder balls, stacked on the printed circuit board, a second BGA IC package, having a plurality of second solder balls, stacked on the first BGA IC package, and an interposer having a plurality of through-holes, which are filled by the second solder balls in a molten state such that the length of the second solder balls increases while the second solder balls harden, the interposer being joined to the top of the first BGA IC package.
    Type: Application
    Filed: October 16, 2007
    Publication date: July 3, 2008
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Hyun Joo HAN, Tao Sang Park, Se Yeong Jang, Young Jun Moon, Jung Hyeon Kim, Sung Wook Kang