Patents by Inventor Tao-Sheng Chang
Tao-Sheng Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240136316Abstract: A semiconductor package includes a conductive pillar and a solder. The conductive pillar has a first sidewall and a second sidewall opposite to the first sidewall, wherein a height of the first sidewall is greater than a height of the second sidewall. The solder is disposed on and in direct contact with the conductive pillar, wherein the solder is hanging over the first sidewall and the second sidewall of conductive pillar.Type: ApplicationFiled: January 2, 2024Publication date: April 25, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang
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Patent number: 11901323Abstract: A semiconductor package includes a first device, a second device and a solder region. The first device includes a first conductive pillar, wherein the first conductive pillar has a first sidewall, a second sidewall opposite to the first sidewall, a first surface and a second surface physically connected to the first surface, the first surface and the second surface are disposed between the first sidewall and the second sidewall, and an included angle is formed between the first surface and the second surface. The solder region is disposed between the first conductive pillar and the second device to bond the first device and the second device.Type: GrantFiled: June 16, 2022Date of Patent: February 13, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang
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Patent number: 11877075Abstract: An electronic device includes a first transistor, a second transistor, and a sensing circuit coupled to at least one of the first transistor and the second transistor. The sensing circuit includes a diode, a third transistor, and a fourth transistor. The diode has a first terminal. The third transistor has a first terminal and a second terminal. The first terminal of the third transistor is coupled to the first terminal of the diode. The fourth transistor has a first terminal coupled to the second terminal of the third transistor, and a second terminal coupled to a data driver.Type: GrantFiled: March 16, 2023Date of Patent: January 16, 2024Assignee: InnoLux CorporationInventors: Hui-Ching Yang, Tao-Sheng Chang, Te-Yu Lee
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Patent number: 11770637Abstract: A sensing device, including a plurality of sensing pixels arranged in Y rows and M columns, a plurality of readout lines coupled to the sensing pixels, and a plurality of control lines each coupled to a sensing pixel subset, is provided. The Y times N sensing pixels within the sensing pixel subset are arranged in adjacent N columns, where Y, M and N are integers and N is smaller than M. Each of the control lines is configured to control one row of the sensing pixel subset to output signals through corresponding readout lines.Type: GrantFiled: March 7, 2022Date of Patent: September 26, 2023Assignee: INNOLUX CORPORATIONInventors: Ya-Li Tsai, Tao-Sheng Chang, Hui-Ching Yang, Te-Yu Lee
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Publication number: 20230239588Abstract: An electronic device includes a first transistor, a second transistor, and a sensing circuit coupled to at least one of the first transistor and the second transistor. The sensing circuit includes a diode, a third transistor, and a fourth transistor. The diode has a first terminal. The third transistor has a first terminal and a second terminal. The first terminal of the third transistor is coupled to the first terminal of the diode. The fourth transistor has a first terminal coupled to the second terminal of the third transistor, and a second terminal coupled to a data driver.Type: ApplicationFiled: March 16, 2023Publication date: July 27, 2023Applicant: InnoLux CorporationInventors: Hui-ching Yang, Tao-Sheng Chang, Te-Yu Lee
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Patent number: 11632503Abstract: An electronic device includes a reset circuit and a first image sensing circuit. The reset circuit is used to receive a reset signal and includes a plurality of transistors. The first image sensing circuit is coupled to the reset circuit and includes a photodiode, a first transistor and a second transistor. The photodiode has a first terminal. The first transistor has a first terminal coupled to the first terminal of the photodiode, and a second terminal. The second transistor has a first terminal coupled to the second terminal of the first transistor, and a second terminal configured to receive a row selection signal.Type: GrantFiled: September 1, 2021Date of Patent: April 18, 2023Assignee: InnoLux CorporationInventors: Hui-Ching Yang, Tao-Sheng Chang, Te-Yu Lee
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Publication number: 20230098704Abstract: A heater device with a memory unit includes a first transistor, a second transistor, a memory unit and a heater. The first terminal of the second transistor and the first terminal of the first transistor are electrically connected to each other. The memory unit is electrically connected to the second terminal of the first transistor. The heater is electrically connected to the second terminal of the second transistor.Type: ApplicationFiled: August 19, 2022Publication date: March 30, 2023Inventors: Po-Han HUANG, Tao-Sheng CHANG, Te-Yu LEE
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Patent number: 11468699Abstract: An electronic device has a photosensitive element, a charge storage element, and a node. The photosensitive element generates a current in response to illumination thereon. The charge storage element is coupled to the photosensitive element and is used to store charge in response to the current generated by the photosensitive element. The signal reading circuit is coupled to the photosensitive element, and the node is coupled between the photosensitive element and the charge storage element. The charge storage element and the photosensitive element are coupled in series, and the node is coupled to an end of the signal reading circuit.Type: GrantFiled: May 21, 2020Date of Patent: October 11, 2022Assignee: InnoLux CorporationInventors: Tao-Sheng Chang, Hui-Ching Yang, Te-Yu Lee
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Publication number: 20220321821Abstract: A sensing device, including a plurality of sensing pixels arranged in Y rows and M columns, a plurality of readout lines coupled to the sensing pixels, and a plurality of control lines each coupled to a sensing pixel subset, is provided. The Y times N sensing pixels within the sensing pixel subset are arranged in adjacent N columns, where Y, M and N are integers and N is smaller than M. Each of the control lines is configured to control one row of the sensing pixel subset to output signals through corresponding readout lines.Type: ApplicationFiled: March 7, 2022Publication date: October 6, 2022Inventors: Ya-Li TSAI, Tao-Sheng CHANG, Hui-Ching YANG, Te-Yu LEE
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Publication number: 20220310543Abstract: A semiconductor package includes a first device, a second device and a solder region. The first device includes a first conductive pillar, wherein the first conductive pillar has a first sidewall, a second sidewall opposite to the first sidewall, a first surface and a second surface physically connected to the first surface, the first surface and the second surface are disposed between the first sidewall and the second sidewall, and an included angle is formed between the first surface and the second surface. The solder region is disposed between the first conductive pillar and the second device to bond the first device and the second device.Type: ApplicationFiled: June 16, 2022Publication date: September 29, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang
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Patent number: 11398444Abstract: Electrical devices, semiconductor packages and methods of forming the same are provided. One of the electrical devices includes a substrate, a conductive pad, a conductive pillar and a solder region. The substrate has a surface. The conductive pad is disposed on the surface of the substrate. The conductive pillar is disposed on and electrically connected to the conductive pad, wherein a top surface of the conductive pillar is inclined with respect to the surface of the substrate. The solder region is disposed on the top surface of the conductive pillar.Type: GrantFiled: May 5, 2020Date of Patent: July 26, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang
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Patent number: 11374142Abstract: An electronic device includes a photodiode, a first transistor, a second transistor, a third transistor and a capacitor. The photodiode has a first terminal and a second terminal. The first transistor has a control terminal used to receive a reset signal, a first terminal coupled to the second terminal of the photodiode, and a second terminal. The second transistor has a control terminal coupled to the second terminal of the photodiode, a first terminal and a second terminal. The third transistor has a control terminal used to receive a row selection signal, a first terminal coupled to the second terminal of the second transistor, and a second terminal. The capacitor has a first terminal coupled to the second terminal of the photodiode, and a second terminal coupled to the second terminal of the first transistor.Type: GrantFiled: February 19, 2020Date of Patent: June 28, 2022Assignee: InnoLux CorporationInventors: Hui-Ching Yang, Tao-Sheng Chang, Te-Yu Lee
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Patent number: 11263420Abstract: An electronic device and a manufacturing method for the electronic device are provided. The electronic device includes a display structure layer and a light sensing panel. The light sensing panel includes a first substrate; a second substrate, wherein the second substrate is disposed between the first substrate and the display structure layer; a plurality of sensing units, disposed on the first substrate and between the first substrate and the second substrate; and an optical structure layer, disposed on the second substrate and between the second substrate and the display structure layer.Type: GrantFiled: December 23, 2020Date of Patent: March 1, 2022Assignee: InnoLux CorporationInventors: Yu-Tsung Liu, Hui-Ching Yang, Te-Yu Lee, Tao-Sheng Chang, Ting-Yeh Chi
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Publication number: 20210400212Abstract: An electronic device includes a reset circuit and a first image sensing circuit. The reset circuit is used to receive a reset signal and includes a plurality of transistors. The first image sensing circuit is coupled to the reset circuit and includes a photodiode, a first transistor and a second transistor. The photodiode has a first terminal. The first transistor has a first terminal coupled to the first terminal of the photodiode, and a second terminal. The second transistor has a first terminal coupled to the second terminal of the first transistor, and a second terminal configured to receive a row selection signal.Type: ApplicationFiled: September 1, 2021Publication date: December 23, 2021Applicant: InnoLux CorporationInventors: Hui-Ching Yang, Tao-Sheng Chang, Te-Yu Lee
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Patent number: 11134207Abstract: An electronic device includes a reset circuit and a first image sensing circuit. The reset circuit has a first node used to receive a reset signal, and a second node. The first image sensing circuit is coupled to the reset circuit and includes a photodiode, a first transistor and a second transistor. The photodiode has a first terminal coupled to the second node, and a second terminal. The first transistor has a control terminal coupled to the second terminal of the photodiode via a third node, a first terminal and a second terminal. The second transistor has a control terminal configured to receive a row selection signal and a first terminal coupled to the second terminal of the first transistor.Type: GrantFiled: March 5, 2020Date of Patent: September 28, 2021Assignee: InnoLux CorporationInventors: Hui-Ching Yang, Tao-Sheng Chang, Te-Yu Lee
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Patent number: 11093077Abstract: An electronic device includes a touch sensing layer, a touch sensor, a biometric sensor and a driver. The touch sensor is used to identify a touch location and output a touch signal upon the touch sensing layer being touched. The biometric sensor includes a plurality of sensing blocks, and is used to generate electrical signals corresponding to biometric data. The driver is coupled to the touch sensor and the biometric sensor, and is used to drive a portion of the plurality of sensing blocks according to the touch signal.Type: GrantFiled: March 3, 2020Date of Patent: August 17, 2021Assignee: InnoLux CorporationInventors: Hui-Ching Yang, Tao-Sheng Chang, Te-Yu Lee
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Publication number: 20210216744Abstract: An electronic device and a manufacturing method for the electronic device are provided. The electronic device includes a display structure layer and a light sensing panel. The light sensing panel includes a first substrate; a second substrate, wherein the second substrate is disposed between the first substrate and the display structure layer; a plurality of sensing units, disposed on the first substrate and between the first substrate and the second substrate; and an optical structure layer, disposed on the second substrate and between the second substrate and the display structure layer.Type: ApplicationFiled: December 23, 2020Publication date: July 15, 2021Inventors: Yu-Tsung Liu, Hui-Ching Yang, Te-Yu Lee, Tao-Sheng Chang, Ting-Yeh Chi
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Publication number: 20210066226Abstract: Electrical devices, semiconductor packages and methods of forming the same are provided. One of the electrical devices includes a substrate, a conductive pad, a conductive pillar and a solder region. The substrate has a surface. The conductive pad is disposed on the surface of the substrate. The conductive pillar is disposed on and electrically connected to the conductive pad, wherein a top surface of the conductive pillar is inclined with respect to the surface of the substrate. The solder region is disposed on the top surface of the conductive pillar.Type: ApplicationFiled: May 5, 2020Publication date: March 4, 2021Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Chiang-Jui Chu, Ching-Wen Hsiao, Hao-Chun Liu, Ming-Da Cheng, Young-Hwa Wu, Tao-Sheng Chang
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Publication number: 20200410203Abstract: An electronic device has a photosensitive element, a charge storage element, and a node. The photosensitive element generates a current in response to illumination thereon. The charge storage element is coupled to the photosensitive element and is used to store charge in response to the current generated by the photosensitive element. The signal reading circuit is coupled to the photosensitive element, and the node is coupled between the photosensitive element and the charge storage element. The charge storage element and the photosensitive element are coupled in series, and the node is coupled to an end of the signal reading circuit.Type: ApplicationFiled: May 21, 2020Publication date: December 31, 2020Inventors: Tao-Sheng Chang, Hui-Ching Yang, Te-Yu Lee
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Publication number: 20200313025Abstract: An electronic device includes a photodiode, a first transistor, a second transistor, a third transistor and a capacitor. The photodiode has a first terminal and a second terminal. The first transistor has a control terminal used to receive a reset signal, a first terminal coupled to the second terminal of the photodiode, and a second terminal. The second transistor has a control terminal coupled to the second terminal of the photodiode, a first terminal and a second terminal. The third transistor has a control terminal used to receive a row selection signal, a first terminal coupled to the second terminal of the second transistor, and a second terminal. The capacitor has a first terminal coupled to the second terminal of the photodiode, and a second terminal coupled to the second terminal of the first transistor.Type: ApplicationFiled: February 19, 2020Publication date: October 1, 2020Inventors: Hui-Ching Yang, Tao-Sheng Chang, Te-Yu Lee