Abstract: A display panel and a display device are disclosed. In preparing the display panel, based on a height difference formed between a plurality of first column spacers and a plurality of second column spacers, as a color filter substrate deforms during a vacuum assembly process, a deformation area of a blind hole area increases because the second column spacers are not in contact with an array substrate in the blind hole area, resulting in a decrease in a radius of curvature of the deformation of the blind hole area, so that an amount of deformation is reduced and poor focusing due to Newton's ring effect on the blind hole can be prevented.

Abstract: A cable connector includes a housing, a terminal module and a cable connected to the terminal module. The terminal module includes multiple groups of conductive terminals. At least one group of conductive terminals include two signal terminals, a first ground terminal and a second ground terminal. The at least one group of conductive terminals include a connecting portion connecting the first ground terminal and the second ground terminal. The cable includes signal wires electrically connected to the signal terminals and a ground shielding layer wrapped around a periphery of the signal wires. The connecting portion is at least partially wrapped and fixed on the ground shielding layer. With this arrangement, it is easy to connect the ground terminals and the cable ground shielding layer in order to achieve a better shielding effect.

Abstract: A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

Abstract: A backplane connector assembly includes a first backplane connector and a second backplane connector. The first backplane connector includes a number of first conductive terminals, a first metal shield and a second metal shield. The first conductive terminal includes a first mating portion, a first tail portion and a first connection portion extending along a mating direction. The first conductive terminals includes first differential signal terminals. The first backplane connector includes a number of shielding spaces. The second backplane connector includes second differential signal terminals and metal shield surrounding members received in the shield spaces. Compared with the prior art, the structure of the first conductive terminals of the backplane connector assembly of the present invention is simplified. By providing the shielding spaces and the metal shield surrounding members, the shielding effect of the present disclosure is improved.

Abstract: A mating module includes a conductive terminal, a cable, a first metal shield member and a second metal shield member. The cable includes a core electrically connected to the conductive terminal, an insulating layer wrapped on the core, and a shielding layer wrapped on the insulating layer. The first metal shield member includes a first mounting piece. The second metal shield member includes a second mounting piece. The cable further includes a protruding piece connected to the shielding layer. The protruding piece is directly or indirectly clamped by the first mounting piece and the second mounting piece. As a result, the shielding effect of the mating module is improved. The present disclosure also relates to a cable connector having the mating module.

Abstract: A backplane connector includes a housing, a number of terminal modules assembled to the housing, and a metal shield surrounding member. The housing includes a base, a first side wall and a second side wall. The base, the first side wall and the second side wall jointly form a receiving space for at least partially receiving a mating connector. The terminal module includes a first signal terminal, a second signal terminal and an insulating block fixed on the first signal terminal and the second signal terminal. The metal shield surrounding member at least partially surrounds the periphery of the first signal terminal and the second signal terminal. As a result, the shielding effect of the backplane connector is improved.

Abstract: A backplane connector includes a number of wafers. Each wafer includes a number of conductive terminals, a first metal shield and a second metal shield. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. Each conductive terminal has a contact portion. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The first extension portion and/or the second extension portion include a limiting structure for limiting the contact portion of the first ground terminal and/or the contact portion of the second ground terminal. Besides, in two adjacent wafers, the first extension portion of one wafer contacts the second extension portion of the other wafer through protruding tabs. As a result, the structural reliability of the backplane connector is improved.

Abstract: The present invention discloses a hierarchical highly heterogeneous distributed system based deep learning application optimization framework and relates to the field of deep learning in the direction of computational science. The hierarchical highly heterogeneous distributed system based deep learning application optimization framework comprises a running preparation stage and a running stage. The running preparation stage is used for performing deep neural network training. The running stage performs task assignment to all kinds of devices in the distributed system and uses a data encryption module to perform privacy protection to user sensitive data.

Abstract: A backplane connector includes a housing and a number of wafers assembled to the housing. Each wafer includes a number of conductive terminals, an insulating frame and a metal shield. The housing includes an insulating housing and a metal shell fixed to the insulating housing. The insulating housing includes a number of slots for positioning the wafers. The metal shell is provided with a mating surface and a number of terminal receiving grooves. The contact portions of the conductive terminals are exposed in the corresponding terminal receiving grooves. The present disclosure improves the structural strength of the backplane connector and reduces the risk of damage the mating surface due to the push or collision of a mating connector.

Abstract: A backplane connector includes a number of wafers and a spacer for assembling the wafers together. Each wafer includes an insulating frame and a number of conductive terminals fixed to the insulating frame. The insulating bracket includes a first protrusion and a second protrusion. The spacer includes a first body portion and a second body portion. The first body portion includes a first clamping slot for clamping the first protrusion. The second body portion includes a second clamping slot for clamping the second protrusion. The present disclosure increases the ability of the spacer to resist external forces and improves the structural stability of the backplane connector.

Abstract: A semiconductor structure and its fabrication method are provided in the present disclosure. The method includes providing a layer to-be-etched, including first regions and second regions. The method further includes forming a plurality of discrete first sacrificial layers on the layer to-be-etched, where a plurality of openings is between the plurality of first sacrificial layers and includes first openings on the first regions. The method further includes forming initial sidewall spacer structures on sidewalls of the plurality of first sacrificial layers, where the initial sidewall spacer structures include first sidewall spacers, and the first sidewall spacers fill the first openings. The method further includes, using the first sidewall spacers as an alignment mark, forming a first mask layer on the layer to-be-etched and the initial sidewall spacer structures, where the first mask layer exposes a portion of the layer to-be-etched and a portion of the initial sidewall spacer structures.

Abstract: A driver device may comprise a housing and a hole located on the housing. The hole may comprise a sealing lip. The driver device may comprise a bit holder located within the housing, and a bit socket located on the bit holder. The bit socket may be aligned with the hole, such that inserting a bit into the bit socket also inserts the bit into the hole. The driver device may comprise a spring located within the bit socket. The spring may cause an inserted bit to partially exit the hole in the absence of an external force pushing the it against the spring. The driver device may comprise a vacuum component connected to the housing, and a vacuum chamber within the housing.

Abstract: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. Each conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first elastic arm and a second elastic arm. The second metal shield has a third elastic arm and a fourth elastic arm. The first elastic arm and the third elastic arm are in contact with two opposite side surfaces of the contact portion of the first ground terminal. The second elastic arm and the fourth elastic arm are in contact with two opposite side surfaces of the contact portion of the second ground terminal. This arrangement increases the grounding shielding area, reduces crosstalk, and improves the quality of signal transmission.

Abstract: A backplane connector includes a wafer and a mounting block. The wafer includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a contact portion, a tail portion and a connection portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield includes a first protruding piece. The second metal shield includes a second protruding piece. The mounting block includes a slot for passing through the tail portions of the differential signal terminals. The first protruding piece and the second protruding piece are at least partially inserted into the slot. This arrangement can provide better shielding adjacent to the tail portions of the differential signal terminals, reduce crosstalk, and improve the quality of signal transmission.

Abstract: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The first metal shield and the second metal shield respectively include a first extension portion and a second extension portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first extension portion and the second extension portion in contact with the first ground terminal and the second ground terminal. As a result, a shielding space to enclose contact portions of the differential signal terminals is formed. This arrangement can provide better shielding for the differential signal terminals, reduce crosstalk, and improve the quality of signal transmission.

Abstract: A circuit board includes two first insertion holes, a second insertion hole located on one side of the two first insertion holes, a third insertion hole located on the other side of the two first insertion holes, and a number of grounding points. The grounding points are distributed on a periphery of the first insertion holes. The grounding points, the second insertion hole and the third insertion hole together form a shielding layer surrounding the periphery of the first insertion holes. The present disclosure also relates to a backplane connector assembly having a backplane connector and the circuit board. Compared with the prior art, the circuit board disclosed in the present disclosure improves the shielding effect of differential signal terminals, reduces crosstalk and improves the quality of signal transmission.

Abstract: A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. The conductive terminal includes a connection portion and a contact portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield has a first extension portion. The second metal shield has a second extension portion. The backplane connector includes an insulating block sleeved on the contact portions of the differential signal terminal and a metal shell sleeved on the insulating block. The metal shell is in contact with the first extension portion and the second extension portion. This arrangement increases the grounding shielding area, reduces crosstalk and improves the quality of signal transmission.

Abstract: A backplane connector includes a wafer. The wafer includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield located on opposite sides of the insulating frame. The insulating frame includes a number of first posts and a number of second posts. The first metal shield has a number of first mounting holes to receive the first posts. The second metal shield has a number of second mounting holes to receive the second posts. With this arrangement, the first metal shield and the second metal shield can be easily positioned with the insulating frame.