Patents by Inventor Tar Tsau

Tar Tsau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8070470
    Abstract: A mold assembly has two mold half shells each having an outer and inner wall for defining the shape of a container to be formed. Two mold half carriers each have an inner wall overlaying and spaced from a corresponding mold shell outer wall for supporting the shells in the assembly. At least one insulating pad is sandwiched between the inner wall and the corresponding outer wall and is secured to one of the inner wall and the outer wall. The pad supports the outer wall in non-contacting and buffering relation relative the carrier inner wall. Each pad may be secured in a recessed seat in the respective wall. Pads may be secured in recessed seats having a depth less than the thickness of the pad. Pads absorb mold operational forces to reduce wear, reduce conduction from shell to carrier and facilitate the use of different-sized shells with one carrier.
    Type: Grant
    Filed: February 6, 2009
    Date of Patent: December 6, 2011
    Assignee: Wentworth Mold Ltd.
    Inventors: Tar Tsau, Kyi San Kyi
  • Publication number: 20100203186
    Abstract: A mold assembly has two mold half shells each having an outer and inner wall for defining the shape of a container to be formed. Two mold half carriers each have an inner wall overlaying and spaced from a corresponding mold shell outer wall for supporting the shells in the assembly. At least one insulating pad is sandwiched between the inner wall and the corresponding outer wall and is secured to one of the inner wall and the outer wall. The pad supports the outer wall in non-contacting and buffering relation relative the carrier inner wall. Each pad may be secured in a recessed seat in the respective wall. Pads may be secured in recessed seats having a depth less than the thickness of the pad. Pads absorb mold operational forces to reduce wear, reduce conduction from shell to carrier and facilitate the use of different-sized shells with one carrier.
    Type: Application
    Filed: February 6, 2009
    Publication date: August 12, 2010
    Applicant: WENTWORTH MOLD LTD.
    Inventors: Tar Tsau, Kyi San Kyi
  • Patent number: 7025584
    Abstract: A base assembly used as a part of a mold assembly for forming a container has a base insert and a flow divider plate that co-operate to define a continuous fluid passageway for cooling or heating the base insert. The flow divider plate has an upper surface portion having at least one raised runway extending in a first pattern covering a substantial area of the upper surface portion. The base insert has a lower surface portion with a continuous channel extending in a second pattern. The channel is positioned adjacent the at least one raised runway in sealing relation therewith to define a continuous fluid passageway.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: April 11, 2006
    Assignee: Wentworth Mold Inc.
    Inventor: Tar Tsau
  • Patent number: 6994542
    Abstract: A mold half carrier has first and second air flow compensating surface areas. The second air flow compensating surface area encloses the first air flow compensating surface area. The first air flow compensating surface area provides pressure compensation for formation of smaller containers. Both air flow compensating surface areas are utilized for formation of larger containers. A shut off valve controls air flow through a passage in the mold carrier extending between the first and second air flow compensating surface areas. The second air flow compensating surface area has an exhaust passage for bleeding unwanted pressurized air therefrom when the shut off valve is closed. The compensating surface areas are separated from each other by a common continuous groove and an O-ring mounted in the groove. The groove has an arcuate main portion for receiving the O-ring and an auxiliary portion into which a portion of the O-ring may collapse.
    Type: Grant
    Filed: December 30, 2003
    Date of Patent: February 7, 2006
    Assignee: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
  • Patent number: 6948924
    Abstract: A mold assembly for forming a container has two modular mold half shells that are adapted to be surrounded by mold half carriers. Each modular mold half shell has an upper body mold section and at least one lower body mold section. The upper body mold sections of the mold half shells are releasably secured in vertical registry with the mold half carriers. The upper body mold sections have upper inner walls defining an upper cavity whose shape corresponds to an upper portion of the container to be formed. The modular mold half shell have at least one lower body mold section and preferably multiple interchangeable lower body mold sections that are releasably secured with the upper body mold section. The lower body mold sections have lower inner walls defining a lower cavity whose shape corresponds to a lower portion of the container to be formed.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: September 27, 2005
    Assignee: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
  • Patent number: 6913455
    Abstract: A hot fill hot fill mold assembly has two mold half shells and two mold half carriers for supporting the mold half shells. The shells each have an inner wall that defines the shape of at least a portion of the container to be formed. Each shell has outer wall surface portions and a plurality of spaced apart slotted grooves extending between the outer wall surface portions that define open air spaces recessed from the outer wall portions. The mold half carriers have a carrier inner wall that overlays in contacting and thermal conducting relation the outer wall surface portions of a corresponding one of the mold half shells and overlays the spaced apart slotted grooves to create thermal buffering open air pockets between the mold half shells and the mold half carriers so as to reduce the thermal conduction away from the mold face and improve hot fill container formation.
    Type: Grant
    Filed: April 11, 2003
    Date of Patent: July 5, 2005
    Assignee: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
  • Publication number: 20050142243
    Abstract: A mold half carrier has first and second air flow compensating surface areas. The second air flow compensating surface area encloses the first air flow compensating surface area. The first air flow compensating surface area provides pressure compensation for formation of smaller containers. Both air flow compensating surface areas are utilized for formation of larger containers. A shut off valve controls air flow through a passage in the mold carrier extending between the first and second air flow compensating surface areas. The second air flow compensating surface area has an exhaust passage for bleeding unwanted pressurized air therefrom when the shut off valve is closed. The compensating surface areas are separated from each other by a common continuous groove and an O-ring mounted in the groove. The groove has an arcuate main portion for receiving the O-ring and an auxiliary portion into which a portion of the O-ring may collapse.
    Type: Application
    Filed: December 30, 2003
    Publication date: June 30, 2005
    Applicant: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Nitsche, Kyi Kyi
  • Publication number: 20050048155
    Abstract: A base assembly used as a part of a mold assembly for forming a container has a base insert and a flow divider plate that co-operate to define a continuous fluid passageway for cooling or heating the base insert. The flow divider plate has an upper surface portion having at least one raised runway extending in a first pattern covering a substantial area of the upper surface portion. The base insert has a lower surface portion with a continuous channel extending in a second pattern. The channel is positioned adjacent the at least one raised runway in sealing relation therewith to define a continuous fluid passageway. The channel in the base insert is a recessed groove and a plurality of bores with dome shaped ends that extend from the lower surface portion of the base insert deeper into the base insert than the recessed groove. The raised runway has a plurality of baffles with rounded tips that extend outwardly therefrom and into a corresponding one of the bores to redirect flow of fluid through the bores.
    Type: Application
    Filed: August 29, 2003
    Publication date: March 3, 2005
    Applicant: Wentworth Mold Inc.
    Inventor: Tar Tsau
  • Publication number: 20040202746
    Abstract: A mold assembly for forming a container has two modular mold half shells that are adapted to be surrounded by mold half carriers. Each modular mold half shell has an upper body mold section and at least one lower body mold section. The upper body mold sections of the mold half shells are releasably secured in vertical registry with the mold half carriers. The upper body mold sections have upper inner walls defining an upper cavity whose shape corresponds to an upper portion of the container to be formed. The modular mold half shell have at least one lower body mold section and preferably multiple interchangeable lower body mold sections that are releasably secured with the upper body mold section. The lower body mold sections have lower inner walls defining a lower cavity whose shape corresponds to a lower portion of the container to be formed.
    Type: Application
    Filed: April 11, 2003
    Publication date: October 14, 2004
    Applicant: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
  • Publication number: 20040202745
    Abstract: A hot fill hot fill mold assembly has two mold half shells and two mold half carriers for supporting the mold half shells. The shells each have an inner wall that defines the shape of at least a portion of the container to be formed. Each shell has outer wall surface portions and a plurality of spaced apart slotted grooves extending between the outer wall surface portions that define open air spaces recessed from the outer wall portions. The mold half carriers have a carrier inner wall that overlays in contacting and thermal conducting relation the outer wall surface portions of a corresponding one of the mold half shells and overlays the spaced apart slotted grooves to create thermal buffering open air pockets between the mold half shells and the mold half carriers so as to reduce the thermal conduction away from the mold face and improve hot fill container formation.
    Type: Application
    Filed: April 11, 2003
    Publication date: October 14, 2004
    Applicant: Wentworth Mold Inc.
    Inventors: Tar Tsau, Reinhold Ernst Nitsche, Kyi San Kyi
  • Patent number: 6428302
    Abstract: A mold assembly has two mold half shells, corresponding mold half carriers, and a novel intermediate interconnecting member comprising a pair of ring shaped locating members. The locating members have an inner locating wall, preferably a stepped shoulder, that fits into a recessed slot in the outer wall of the mold shells. The locating members have an outer wall that fits into a recessed slot in the inner wall of the mold half carriers. The inner and outer locating walls of the locating members are vertically positioned relative to each to determine the vertical registry of the mold shell to the mold carrier. By utilizing intermediate interconnecting members of differing relative vertical positioning of the inner and outer locating walls, universals mold shells and mold carriers may be used for containers having differing neck heights whereby the neck height adjustment is accommodated by changing the intermediate interconnecting member.
    Type: Grant
    Filed: September 14, 2000
    Date of Patent: August 6, 2002
    Assignee: Wentworth Mold Inc.
    Inventor: Tar Tsau